公开(公告)号：US11862505B2

公开(公告)日：2024-01-02

申请号：US17651114

申请日：2022-02-15

申请人： DISCO CORPORATION

发明人： Yoshinori Kakinuma ,  Takashi Mori ,  Yoshinobu Saito

IPC分类号： B32B43/00 ,  H01L21/683 ,  H01L21/677 ,  B23K26/364 ,  B23K26/402 ,  B25J11/00 ,  H05B1/02 ,  B23K103/00

CPC分类号： H01L21/6836 ,  B23K26/364 ,  B23K26/402 ,  B25J11/0095 ,  H01L21/67775 ,  H01L21/6838 ,  B23K2103/56 ,  B32B43/006 ,  H05B1/0233 ,  Y10T156/1158 ,  Y10T156/1917

摘要： A processing apparatus includes a wafer carrying-out unit, a wafer table that supports a wafer carried out, a frame carrying-out unit, a frame table that supports an annular frame carried out, a tape sticking unit that sticks a tape to the frame, a tape-attached frame conveying unit, a tape pressure bonding unit that executes pressure bonding of the tape of a tape-attached frame to a back surface of the wafer, a frame unit carrying-out unit, and a beveled part removing unit that cuts and removes, in a ring manner, a beveled part formed in an outer circumferential surplus region from the wafer of a frame unit.

公开(公告)号：US09875918B2

公开(公告)日：2018-01-23

申请号：US14788783

申请日：2015-06-30

申请人： Samsung Electronics Co., Ltd.

发明人： Kyu-Dong Jung ,  Jung-Hwan Kim ,  Dong-Gil Lee ,  Tae-Je Cho ,  Kwang-Chul Choi

IPC分类号： B32B43/00 ,  H01L21/67 ,  B32B38/10 ,  B32B41/00

CPC分类号： H01L21/67115 ,  B32B38/10 ,  B32B41/00 ,  B32B43/006 ,  B32B2250/02 ,  B32B2310/0843 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67253 ,  H01L2221/68381 ,  H01L2224/98 ,  Y10T156/1158 ,  Y10T156/1917

摘要： Provided are an initiator and a method for debonding a wafer supporting system. The initiator for debonding a wafer supporting system includes a rotation chuck having an upper surface on which a wafer supporting system (WSS), which includes a carrier wafer, a device wafer, and a glue layer for bonding the carrier wafer and the device wafer to each other, is seated to rotate the wafer supporting system, a detecting module detecting a height and a thickness of the glue layer and a laser module generating a fracture portion on the glue layer through irradiating a side surface of the glue layer with a laser on the basis of the height and the thickness of the glue layer.

公开(公告)号：US20170266946A1

公开(公告)日：2017-09-21

申请号：US15613768

申请日：2017-06-05

申请人： IPG Photonics Corporation

发明人： Cristian PORNEALA ,  Mathew HANNON ,  Marco MENDES ,  Jeffrey P. SERCEL

IPC分类号： B32B43/00 ,  B23K26/40 ,  B23K26/00

CPC分类号： B32B43/006 ,  B23K26/40 ,  B23K26/50 ,  B23K2101/40 ,  B23K2103/50 ,  Y10T156/1158 ,  Y10T156/1917

摘要： Laser lift off systems and methods overlap irradiation zones to provide multiple pulses of laser irradiation per location at the interface between layers of material to be separated. To overlap irradiation zones, the laser lift off systems and methods provide stepwise relative movement between a pulsed laser beam and a workpiece. The laser irradiation may be provided by a non-homogeneous laser beam with a smooth spatial distribution of energy across the beam profile. The pulses of laser irradiation from the non-homogenous beam may irradiate the overlapping irradiation zones such that each of the locations at the interface is exposed to different portions of the non-homogeneous beam for each of the multiple pulses of the laser irradiation, thereby resulting in self-homogenization. Thus, the number of the multiple pulses of laser irradiation per location is generally sufficient to provide the self-homogenization and to separate the layers of material.

公开(公告)号：US09718221B2

公开(公告)日：2017-08-01

申请号：US15012572

申请日：2016-02-01

申请人： The Boeing Company

发明人： Darrin M. Hansen ,  Carissa Ann Pajel

IPC分类号： B05D3/00 ,  C08J7/18 ,  G21H5/00 ,  B29C41/42 ,  B08B9/08 ,  B65D53/06 ,  B29C73/02 ,  B29C73/26 ,  B29C73/34 ,  B29C35/08 ,  B29C35/12 ,  B29C41/00 ,  B29C41/52 ,  B29C65/00 ,  B64C3/34 ,  B64F5/45 ,  B08B1/00 ,  B08B7/00 ,  B29L31/00 ,  B29K85/00 ,  B29K105/16 ,  B29K505/00 ,  B29L31/26 ,  B29L31/30

CPC分类号： B29C41/42 ,  B08B1/00 ,  B08B7/0035 ,  B08B7/0071 ,  B08B9/08 ,  B29C35/0805 ,  B29C35/12 ,  B29C41/003 ,  B29C41/52 ,  B29C66/53461 ,  B29C73/02 ,  B29C73/26 ,  B29C73/34 ,  B29C2035/0811 ,  B29C2035/0855 ,  B29C2035/0861 ,  B29K2085/00 ,  B29K2105/16 ,  B29K2505/00 ,  B29L2031/26 ,  B29L2031/3076 ,  B29L2031/7172 ,  B64C3/34 ,  B64F5/45 ,  B65D53/06 ,  Y10T156/1158 ,  Y10T156/1917

摘要： Cured flexible sealant may be removed from a substrate if the cured flexible sealant includes within its volume a susceptor such as metal susceptor particles. Removal proceeds by exposing the sealant with the susceptor to radio-frequency radiation sufficient to cause dielectric heating in the susceptor. The consequent heating in the cured sealant reduces the bond strength of the cured sealant. The reduced bond-strength sealant may be removed by physical methods, such as scraping etc., much more easily than the original (unexposed) cured sealant. Also disclosed are sealant compositions with susceptor, susceptor tools to introduce susceptor into cured sealant, and handheld radio-frequency heaters to apply radio-frequency radiation to cured sealant.

公开(公告)号：US09627235B2

公开(公告)日：2017-04-18

申请号：US14698049

申请日：2015-04-28

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Yasumasa Iwata ,  Yoshihiro Inao ,  Akihiko Nakamura ,  Shinji Takase ,  Takahiro Yoshioka

IPC分类号： H01L21/683 ,  B32B43/00 ,  H01L21/67 ,  B32B37/02 ,  B32B38/10 ,  B32B38/18 ,  B32B37/26

CPC分类号： H01L21/67092 ,  B32B37/02 ,  B32B38/10 ,  B32B38/1858 ,  B32B43/006 ,  B32B2037/268 ,  B32B2307/202 ,  B32B2310/0825 ,  B32B2310/0843 ,  B32B2311/00 ,  B32B2313/00 ,  B32B2457/14 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1111 ,  Y10T156/1158 ,  Y10T156/1189 ,  Y10T156/1917

摘要： A supporting member separation method for separating a laminate which is formed by laminating a substrate and a support plate through an adhesive layer and in which a release layer is provided on at least a part of the peripheral portion on the surface of the side of the substrate facing the support plate or the peripheral portion on the surface of the side of the support plate facing the substrate, the method including reducing the adhesive force of at least a part of the release layer which is provided on the peripheral portion of the substrate or the support, and fixing a part in the substrate and the support plate and separating the support plate from the substrate by applying a force to another part, after the preliminary treatment.

公开(公告)号：US20170036433A1

公开(公告)日：2017-02-09

申请号：US15332898

申请日：2016-10-24

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Ying-Ching Shih ,  Jing-Cheng Lin ,  Szu-Wei Lu

IPC分类号： B32B43/00 ,  B32B38/10 ,  H01L21/683 ,  H01L21/687 ,  H01L21/02 ,  B32B38/16 ,  H01L21/67

CPC分类号： B32B43/006 ,  B32B38/10 ,  B32B38/162 ,  B32B38/1858 ,  B32B2310/0825 ,  B32B2310/0831 ,  B32B2310/0843 ,  B32B2457/14 ,  H01L21/02076 ,  H01L21/02079 ,  H01L21/02096 ,  H01L21/02098 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6836 ,  H01L21/68785 ,  H01L24/96 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/95001 ,  Y10S901/40 ,  Y10S901/43 ,  Y10T156/1111 ,  Y10T156/1158 ,  Y10T156/1917 ,  Y10T156/1928

摘要： Methods and tools for de-bonding and cleaning substrates are disclosed. A method includes de-bonding a surface of a first substrate from a second substrate, and after de-bonding, cleaning the surface of the first substrate. The cleaning comprises physically contacting a cleaning mechanism to the surface of the first substrate. A tool includes a de-bonding module and a cleaning module. The de-bonding module comprises a first chuck, a radiation source configured to emit radiation toward the first chuck, and a first robot arm having a vacuum system. The vacuum system is configured to secure and remove a substrate from the first chuck. The cleaning module comprises a second chuck, a spray nozzle configured to spray a fluid toward the second chuck, and a second robot arm having a cleaning device configured to physically contact the cleaning device to a substrate on the second chuck.

摘要翻译： 公开了用于去粘合和清洁基底的方法和工具。 一种方法包括从第二衬底去除粘合第一衬底的表面，并且在去结合之后，清洁第一衬底的表面。 清洁包括将清洁机构物理接触到第一基板的表面。 一种工具包括去粘合模块和清洁模块。 去粘合模块包括第一卡盘，被配置为朝向第一卡盘发射辐射的辐射源，以及具有真空系统的第一机器人手臂。 真空系统构造成从第一卡盘固定和移除基板。 清洁模块包括第二卡盘，被配置为朝向第二卡盘喷射流体的喷嘴，以及第二机器人手臂，其具有构造成将清洁装置物理接触到第二卡盘上的基板的清洁装置。

公开(公告)号：US20160362534A1

公开(公告)日：2016-12-15

申请号：US15183110

申请日：2016-06-15

申请人： Immunolight, LLC.

发明人： Zakaryae FATHI ,  John PACANOVSKY ,  Frederic A. BOURKE, JR.

IPC分类号： C08J11/10 ,  C08J7/12

CPC分类号： C08J11/10 ,  B32B7/04 ,  B32B38/10 ,  B32B43/006 ,  C08J2321/00 ,  Y02W30/702 ,  Y10T156/1153 ,  Y10T156/1917

摘要： A method is provided for de-bonding objects contained in an article at an interface between the objects, wherein the objects are joined at the interface through an intermediate layer, which involves applying energy from a radiation source, wherein the energy is sufficient to cause destruction of bonds within the intermediate layer; and separating the two objects from one another.

摘要翻译： 提供了一种用于将包含在物品中的物体去粘合在物体之间的界面处的物体的方法，其中物体在界面处通过中间层连接，该中间层涉及从辐射源施加能量，其中能量足以引起破坏 的中间层内的键; 并将两个物体彼此分开。

公开(公告)号：US20160332436A1

公开(公告)日：2016-11-17

申请号：US14797124

申请日：2015-07-11

申请人： Hao Tang ,  Yushen Zeng

发明人： Hao Tang ,  Yushen Zeng

IPC分类号： B32B43/00 ,  B32B37/06 ,  B32B38/10

CPC分类号： B32B43/006 ,  B32B37/06 ,  B32B38/10 ,  B32B2457/14 ,  H01L21/67092 ,  Y10T156/1111 ,  Y10T156/1116 ,  Y10T156/1137 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1184 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1939 ,  Y10T156/1967

摘要： The present invention provides a method of separating a bonded stack utilizing the force generated by a gas jet. The stack includes a carrier and a thinned workpiece such as device wafer that are bonded together through one or more layers therebetween. The gas jet can separate two adjacent layers having peeling strength therebetween in the range of from 0.01 to 50.0 g/cm. The invention can simplify the procedure and provide high throughput in separating thinned wafer from its carrier.

摘要翻译： 本发明提供了一种利用气体射流产生的力分离粘合的叠层的方法。 堆叠包括载体和诸如器件晶片的薄化工件，其通过它们之间的一个或多个层结合在一起。 气体射流可以分离其间具有0.01至50.0g / cm 3范围内的剥离强度的两个相邻层。 本发明可以简化程序并提供从其载体分离薄化晶片的高产量。

公开(公告)号：US20160318321A1

公开(公告)日：2016-11-03

申请号：US15133219

申请日：2016-04-19

申请人： Oki Data Corporation

发明人： Hiromi TAKAHASHI ,  Mihoko ODATE ,  Syuji SATO

IPC分类号： B41J15/16 ,  B41J3/407

CPC分类号： B41J15/16 ,  B31D1/021 ,  B31D1/027 ,  B31D2201/02 ,  B32B38/10 ,  B32B43/006 ,  B41J2/01 ,  B41J3/4075 ,  B65C9/0015 ,  B65C9/40 ,  B65H23/048 ,  B65H23/1955 ,  B65H23/198 ,  B65H26/025 ,  B65H2301/51122 ,  B65H2553/416 ,  B65H2553/51 ,  B65H2701/19404 ,  G03G15/00 ,  G09F3/02 ,  G09F3/0291 ,  G09F3/0297 ,  G09F3/10 ,  G09F2003/0225 ,  G09F2003/0226 ,  G09F2003/0227 ,  G09F2003/023 ,  G09F2003/0255 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1174 ,  Y10T156/1195 ,  Y10T156/1917 ,  Y10T156/195 ,  Y10T156/1956 ,  Y10T156/1994

摘要： A label winding device is for receiving a medium including a label liner and a label member that is removably attached to the label liner and has at least one label portion and a waste portion, separating the waste portion from the label liner at a waste separation portion, and winding the at least one label portion with the label liner. The label winding device includes: a waste winder for winding the separated waste portion; a label winder for winding the at least one label portion with the label liner without the separated waste portion; a waste guide for guiding the separated waste portion to the waste winder; a support for rotatably supporting the waste guide; a sensor for detecting a rotational speed of the waste guide; and a waste break detector for detecting break of the waste portion on a basis of the detection by the sensor.

摘要翻译： 标签卷绕装置用于接收包括标签衬垫和可移除地附接到标签衬垫的标签构件的介质，并且具有至少一个标签部分和废物部分，在废物分离部分处将废物部分与标签衬里分离 ，并且用标签衬垫卷绕至少一个标签部分。 标签卷绕装置包括：用于卷绕分离的废物部分的废料卷绕机; 用于将至少一个标签部分与标签衬里缠绕而没有分离的废物部分的标签卷绕机; 用于将分离的废物部分引导到废料卷取机的废物引导件; 用于可旋转地支撑废物引导件的支撑件; 用于检测废物引导件的转速的传感器; 以及用于基于传感器的检测来检测废物部分的断裂的废料破碎检测器。

公开(公告)号：US20160093518A1

公开(公告)日：2016-03-31

申请号：US14788783

申请日：2015-06-30

申请人： Samsung Electronics Co., Ltd.

发明人： Kyu-Dong JUNG ,  Jung-Hwan KIM ,  Dong-Gil LEE ,  Tae-Je CHO ,  Kwang-Chul CHOI

IPC分类号： H01L21/67 ,  B32B43/00

CPC分类号： H01L21/67115 ,  B32B38/10 ,  B32B41/00 ,  B32B43/006 ,  B32B2250/02 ,  B32B2310/0843 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67253 ,  H01L2221/68381 ,  H01L2224/98 ,  Y10T156/1158 ,  Y10T156/1917

摘要： Provided are an initiator and a method for debonding a wafer supporting system. The initiator for debonding a wafer supporting system includes a rotation chuck having an upper surface on which a wafer supporting system (WSS), which includes a carrier wafer, a device wafer, and a glue layer for bonding the carrier wafer and the device wafer to each other, is seated to rotate the wafer supporting system, a detecting module detecting a height and a thickness of the glue layer and a laser module generating a fracture portion on the glue layer through irradiating a side surface of the glue layer with a laser on the basis of the height and the thickness of the glue layer.

摘要翻译： 提供了一种用于剥离晶片支撑系统的引发剂和方法。 用于剥离晶片支撑系统的启动器包括具有上表面的旋转卡盘，其上包括载体晶片的晶片支撑系统（WSS），器件晶片和用于将载体晶片和器件晶片接合的胶层 彼此坐下来旋转晶片支撑系统，检测模块检测胶层的高度和厚度;以及激光模块，其通过用激光照射胶层的侧表面而在胶层上产生断裂部分 胶层的高度和厚度的基础。