公开(公告)号：US20170373645A1

公开(公告)日：2017-12-28

申请号：US15195575

申请日：2016-06-28

Applicant: Infineon Technologies AG

Inventor： Haedong Jang ,  Richard Wilson ,  Timothy Canning ,  David Seebacher

IPC: H03F1/02 ,  H03F1/56 ,  H03F3/21 ,  H03F3/60 ,  H03F3/193

CPC classification number: H03F1/0288 ,  H03F1/0294 ,  H03F1/56 ,  H03F3/193 ,  H03F3/245 ,  H03F3/604 ,  H03F2200/255 ,  H03F2200/423 ,  H03F2200/451

Abstract: An amplifier that is configured to amplify an RF signal includes a power combiner circuit. The power combiner circuit includes a first branch connected between a first RF input port and a summing node and a second branch connected between a second RF input port and the summing node. Each of the first and second branches includes an impedance inverter. The Chireix combiner is configured to present a Chireix load modulated impedance response to the first and second RF input ports. The power combiner circuit further includes compensation elements being configured to at least partially compensate for a reactance of the Chireix combiner circuit in a Doherty amplifier mode in which a signal is applied to the first RF input port and the second RF input port is electrically open.