公开(公告)号：US20230094594A1

公开(公告)日：2023-03-30

申请号：US17448732

申请日：2021-09-24

Applicant: Intel Corporation

Inventor： Wolfgang MOLZER ,  Klaus HEROLD ,  Joachim SINGER ,  Peter BAUMGARTNER ,  Michael LANGENBUCH ,  Thomas WAGNER ,  Bernd WAIDHAS

IPC: H01L25/065 ,  H01L27/088 ,  H01L23/498 ,  H01L23/367

Abstract: A semiconductor device is disclosed, comprising a first semiconductor die comprising a plurality of transistors; a second semiconductor die comprising power supply circuitry configured to generate a supply voltage for the plurality of transistors of the first semiconductor die; and a heat spreader structure. A power supply routing for a reference voltage or a power supply voltage which extends from the heat spreader structure through the second semiconductor die to the first semiconductor die.