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公开(公告)号：US20210096168A1
公开(公告)日：2021-04-01
申请号：US16583464
申请日：2019-09-26
Applicant: International Business Machines Corporation
Inventor： Layne A. Berge , Matthew Doyle , Kyle Schoneck , Thomas W. Liang , Matthew A. Walther , Jason J. Bjorgaard , John R. Dangler
IPC: G01R31/28 , H01L23/00 , H01L25/065 , H01L21/48 , H01L23/498 , G01R19/25
Abstract: Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB) and are arranged to provide a contiguous channel for a current sense wire. A subset of solder balls is electrically connected to supply current from the PCB through the BGA package to the IC. The current sense wire is attached to the upper surface of the PCB, within the contiguous channel, and surrounds the subset of solder balls. An amplifier is electrically connected to the current sense wire ends to amplify a voltage induced on the current sense wire by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.
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公开(公告)号：US12117420B2
公开(公告)日：2024-10-15
申请号：US17217592
申请日：2021-03-30
Applicant: International Business Machines Corporation
Inventor： Layne A. Berge , Matthew Doyle , John R. Dangler , Thomas W. Liang , Jason J. Bjorgaard , Kyle Schoneck , Matthew A. Walther
CPC classification number: G01N29/26 , G01N29/4445 , H01B11/1882 , H01B11/1895 , G06N10/00
Abstract: A system, apparatus, and method for determining ultrasonic vital product data of coaxial cables and side-band communications through a water medium of a water-cooling system and/or apparatus. The system may include a first electronic device. The system may also include a second electronic device. The system may also include one or more cables running between the first electronic device and the second electronic device. The system may also include a water jacket filled with water encasing the one or more cables. The system may also include one or more transducers connected to the water jacket, the one or more transducers configured to send signals through the water to gather information about each cable. The system may also include a computer system connected to the one or more transducers, where the computer system is configured to control the one or more transducers.
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公开(公告)号：US12089359B2
公开(公告)日：2024-09-10
申请号：US17483789
申请日：2021-09-23
Applicant: International Business Machines Corporation
Inventor： Brandon R. Christenson , Phillip V. Mann , Christopher Lee Tuma , George Russell Zettles, IV , Matthew A. Walther , Ray Clement Laning
IPC: H05K7/14
CPC classification number: H05K7/1457 , H05K7/1452
Abstract: An electronic component system includes a chassis that includes a body, an electrically isolated portion, and an insulator disposed between the electrically isolated portion and the body, wherein the insulator is comprised of a first electrically insulating material. The electronic component system further includes a first electronic component mounted to the electrically isolated portion, and a second electronic component mounted to the body and electrically connected to the first electronic component.
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公开(公告)号：US12051870B2
公开(公告)日：2024-07-30
申请号：US17456670
申请日：2021-11-29
Applicant: International Business Machines Corporation
Inventor： Kyle Schoneck , Layne A. Berge , Jason J. Bjorgaard , John R. Dangler , Matthew Doyle , Thomas W. Liang , Matthew A. Walther
IPC: H01R13/207 , G06N10/40 , H01R24/28
CPC classification number: H01R13/207 , H01R24/28 , G06N10/40
Abstract: An approach for connecting electrical wiring between two chambers of varying temperatures is disclosed. One approach includes a first end of a wiring bundle comprising a first plurality of metal conductors; a second end of the wiring bundle comprising of equal number of metal conductors as the first end of the wiring bundle; the first end of the wiring bundle is separated by an air gap from the second end of the wiring bundle at a first temperature; and an insulator surrounding the wire bundle. Another approach includes the use of one or more SMA (shape-memory alloy) pins connecting the first end of the wiring bundle to the second end of the wiring bundle and that is separated by an air gap and a boundary plate.
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Patent Agency Ranking
公开(公告)号：US20230170641A1
公开(公告)日：2023-06-01
申请号：US17456670
申请日：2021-11-29
Applicant: International Business Machines Corporation
Inventor： Kyle Schoneck , Layne A. Berge , Jason J. Bjorgaard , John R. Dangler , Matthew Doyle , Thomas W. Liang , Matthew A. Walther
IPC: H01R13/207 , H01R24/28
CPC classification number: H01R13/207 , H01R24/28 , G06N10/40
Abstract: An approach for connecting electrical wiring between two chambers of varying temperatures is disclosed. One approach includes a first end of a wiring bundle comprising a first plurality of metal conductors; a second end of the wiring bundle comprising of equal number of metal conductors as the first end of the wiring bundle; the first end of the wiring bundle is separated by an air gap from the second end of the wiring bundle at a first temperature; and an insulator surrounding the wire bundle. Another approach includes the use of one or more SMA (shape-memory alloy) pins connecting the first end of the wiring bundle to the second end of the wiring bundle and that is separated by an air gap and a boundary plate.
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公开(公告)号：US11538638B2
公开(公告)日：2022-12-27
申请号：US16918251
申请日：2020-07-01
Applicant: International Business Machines Corporation
Inventor： Layne A. Berge , Matthew Doyle , John R. Dangler , Kyle Schoneck , Thomas W. Liang , Matthew A. Walther , Jason J. Bjorgaard
Abstract: A grid array capacitor can be used to physically and electrically couple an integrated circuit (IC) package to a printed circuit board (PCB). The grid array capacitor includes an inner conductor and an inner dielectric coaxially surrounding the inner conductor. A secondary conductor can be located to surround, in a coaxial orientation, the inner dielectric. Both the inner conductor and the secondary conductor can be electrically connected to the IC package and to the PCB. In certain applications, the structure of the inner conductor, inner dielectric, and secondary conductor can provide capacitance used to decouple electronic circuits.
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公开(公告)号：US11519957B2
公开(公告)日：2022-12-06
申请号：US16583464
申请日：2019-09-26
Applicant: International Business Machines Corporation
Inventor： Layne A. Berge , Matthew Doyle , Kyle Schoneck , Thomas W. Liang , Matthew A. Walther , Jason J. Bjorgaard , John R. Dangler
IPC: H01L23/48 , H01L23/52 , G01R31/28 , H01L23/00 , H01L25/065 , H01L21/48 , G01R19/25 , H01L23/498 , B23K101/42
Abstract: Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB) and are arranged to provide a contiguous channel for a current sense wire. A subset of solder balls is electrically connected to supply current from the PCB through the BGA package to the IC. The current sense wire is attached to the upper surface of the PCB, within the contiguous channel, and surrounds the subset of solder balls. An amplifier is electrically connected to the current sense wire ends to amplify a voltage induced on the current sense wire by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.
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公开(公告)号：US11488571B2
公开(公告)日：2022-11-01
申请号：US16919864
申请日：2020-07-02
Applicant: International Business Machines Corporation
Inventor： Layne A. Berge , Jason J. Bjorgaard , John R. Dangler , Matthew Doyle , Thomas W. Liang , Kyle Schoneck , Matthew A. Walther , Jeffrey N. Judd , Henry Michael Newshutz , Matthew S Kelly
IPC: G10K11/175 , H04R1/10 , H04M1/02
Abstract: A system and method to prevent eavesdropping by a device. An anti-eavesdrop component is installed on the device. The anti-eavesdrop component is configured to actively prevent the device from capturing audio from the environment. In response to installing the anti-eavesdrop component, the device recognizes the anti-eavesdrop component as a primary audio input for the device. The anti-eavesdrop component then proceeds to block the device from capturing outside audio by injecting noise or otherwise interfering with the primary audio input.
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公开(公告)号：US20210210448A1
公开(公告)日：2021-07-08
申请号：US16734583
申请日：2020-01-06
Applicant: International Business Machines Corporation
Inventor： Jason J. Bjorgaard , Layne A. Berge , John R. Dangler , Matthew Doyle , Thomas W. Liang , Kyle Schoneck , Matthew A. Walther
IPC: H01L23/00
Abstract: A solder ball assembly can include a first spring element having a first shape and formed from a first elastic electrically conductive material. The solder ball assembly can also include a second spring element having a second shape and formed from a second elastic electrically conductive material. The second spring element is mechanically attached to the first spring element to form a spring assembly. The solder ball can be configured to enclose the spring assembly.
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