System and method for completing lamination of rigid-to-rigid substrates by the controlled application of pressure
    21.
    发明申请
    System and method for completing lamination of rigid-to-rigid substrates by the controlled application of pressure 有权
    通过控制压力完成刚性 - 刚性基材层压的系统和方法

    公开(公告)号:US20090126872A1

    公开(公告)日:2009-05-21

    申请号:US12009393

    申请日:2008-01-18

    IPC分类号: B29C65/48

    摘要: The present invention is a process for performing rigid-to-rigid substrate lamination implementing pressure-sensitive adhesive (PSA). The process may include pressurizing a first sealed cavity to a first pressure. The process may further include creating a vacuum within a second sealed cavity, the second sealed cavity being sealed from the first sealed cavity by a flexible membrane. The process may further include applying the first pressure to a laminate assembly stack via the flexible membrane, the laminate assembly stack including a first substrate, a second substrate, and a PSA layer, the PSA layer being positioned between the first substrate and the second substrate. The process may further include applying the vacuum created within the second sealed cavity to the laminate assembly stack. The applied first pressure and the applied vacuum promote intimate contact between the first substrate and the second substrate of the laminate assembly stack via the PSA layer.

    摘要翻译: 本发明是一种执行压敏粘合剂(PSA)的刚性至刚性基材层压的方法。 该方法可以包括将第一密封空腔加压至第一压力。 该方法还可以包括在第二密封空腔内产生真空,第二密封空腔通过柔性膜与第一密封空腔密封。 该方法还可以包括经由柔性膜将第一压力施加到层压组件叠层,层压组件堆叠包括第一衬底,第二衬底和粘合剂层,PSA层位于第一衬底和第二衬底之间 。 该方法还可以包括将在第二密封空腔内产生的真空施加到层压组件叠层。 所施加的第一压力和施加的真空促进层压组件叠层的第一衬底和第二衬底之间经由PSA层的紧密接触。

    Substrate lamination system and method
    22.
    发明申请
    Substrate lamination system and method 有权
    基板层压体系及方法

    公开(公告)号:US20090120572A1

    公开(公告)日:2009-05-14

    申请号:US12009375

    申请日:2008-01-18

    IPC分类号: B32B37/12

    摘要: The present disclosure is directed to a substrate lamination system and method.A method for laminating substrates may comprise: (a) disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate; (b) disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber; (c) evacuating the vacuum chamber; (d) applying pressure to at least one of the first substrate and the second substrate.A system for laminating substrates may comprise: (a) means for disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate; (b) means for disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber; (c) means for evacuating the vacuum chamber; (d) means for applying pressure to at least one of the first substrate and the second substrate

    摘要翻译: 本公开涉及基板层压系统和方法。 层压基板的方法可以包括:(a)在第一基板的基本上平坦的表面和第二基板的基本平坦的表面之间设置压敏粘合剂层; (b)将第一基板,压敏粘合剂层和第二基板设置在真空室内; (c)抽真空室; (d)向第一基板和第二基板中的至少一个施加压力。 用于层压基板的系统可以包括:(a)用于在第一基板的基本上平坦的表面和第二基板的基本上平坦的表面之间设置压敏粘合剂层的装置; (b)将第一基板,压敏粘合剂层和第二基板设置在真空室内的装置; (c)抽真空室的装置; (d)向第一基板和第二基板中的至少一个施加压力的装置

    Process for applying a protective cover on an organic light-emitting diode using a liquid adhesive
    23.
    发明授权
    Process for applying a protective cover on an organic light-emitting diode using a liquid adhesive 有权
    使用液体粘合剂在有机发光二极管上施加保护盖的工艺

    公开(公告)号:US07381110B1

    公开(公告)日:2008-06-03

    申请号:US11215050

    申请日:2005-08-30

    IPC分类号: H01L21/00

    CPC分类号: H01L21/67126 H01L51/5246

    摘要: A method of sealing an Organic Light-Emitting Diode (OLED) assembly is disclosed. According to the method, a liquid adhesive is applied to substantially all of a surface of an OLED assembly. A region of increased thickness of liquid adhesive is formed adjacent to a first edge of the OLED assembly. A first edge of the protective cover is placed adjacent to the first edge of the OLED assembly. A second edge of the protective cover is moved toward a second edge of the OLED assembly such that the region of increased thickness of liquid adhesive is moved from being adjacent to the first edge of the OLED assembly to being adjacent to the second edge of the OLED assembly. The liquid adhesive is allowed to stabilize and is then cured.

    摘要翻译: 公开了一种密封有机发光二极管(OLED)组件的方法。 根据该方法,将液体粘合剂施加到OLED组件的基本上所有的表面上。 在OLED组件的第一边缘附近形成增加液体粘合剂厚度的区域。 保护盖的第一边缘邻近OLED组件的第一边缘放置。 保护盖的第二边缘朝向OLED组件的第二边缘移动,使得液体粘合剂的增加厚度的区域从邻近OLED组件的第一边缘移动到与OLED的第二边缘相邻 部件。 允许液体粘合剂稳定,然后固化。