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    System and method for completing lamination of rigid-to-rigid substrate by the controlled application of pressure
    2.
    发明授权
    System and method for completing lamination of rigid-to-rigid substrate by the controlled application of pressure 有权
    通过控制压力完成刚性 - 刚性基材层压的系统和方法

    公开(公告)号：US08746311B1

    公开(公告)日：2014-06-10

    申请号：US14019429

    申请日：2013-09-05

    申请人： James D. Sampica ,  Paul R. Nemeth ,  Tracy J. Barnidge ,  Vincent P. Marzen

    发明人： James D. Sampica ,  Paul R. Nemeth ,  Tracy J. Barnidge ,  Vincent P. Marzen

    IPC分类号： B32B37/00

    CPC分类号： B32B37/10 ,  B32B17/10018 ,  B32B37/003 ,  B32B37/0046 ,  B32B37/1009 ,  B32B37/1018 ,  B32B37/12 ,  B32B2457/202 ,  G02F1/1303 ,  H05K3/4611

    摘要： The present invention is a process for performing rigid-to-rigid substrate lamination implementing pressure-sensitive adhesive (PSA). The process may include pressurizing a first sealed cavity to a first pressure. The process may further include creating a vacuum within a second sealed cavity, the second sealed cavity being sealed from the first sealed cavity by a flexible membrane. The process may further include applying the first pressure to a laminate assembly stack via the flexible membrane, the laminate assembly stack including a first substrate, a second substrate, and a PSA layer, the PSA layer being positioned between the first substrate and the second substrate. The process may further include applying the vacuum created within the second sealed cavity to the laminate assembly stack. The applied first pressure and the applied vacuum promote intimate contact between the first substrate and the second substrate of the laminate assembly stack via the PSA layer.

    摘要翻译： 本发明是一种执行压敏粘合剂（PSA）的刚性至刚性基材层压的方法。 该方法可以包括将第一密封空腔加压至第一压力。 该方法还可以包括在第二密封空腔内产生真空，第二密封空腔通过柔性膜与第一密封空腔密封。 该方法还可以包括经由柔性膜将第一压力施加到层压组件叠层，层压组件堆叠包括第一衬底，第二衬底和粘合剂层，PSA层位于第一衬底和第二衬底之间 。 该方法还可以包括将在第二密封空腔内产生的真空施加到层压组件叠层。 所施加的第一压力和施加的真空促进层压组件叠层的第一衬底和第二衬底之间经由PSA层的紧密接触。

    System and method for disassembling laminated substrates
    5.
    发明授权
    System and method for disassembling laminated substrates 有权
    用于拆卸层压基板的系统和方法

    公开(公告)号：US08118075B2

    公开(公告)日：2012-02-21

    申请号：US12009372

    申请日：2008-01-18

    申请人： James D. Sampica ,  Paul R. Nemeth ,  Tracy J. Barnidge ,  Vincent P. Marzen

    发明人： James D. Sampica ,  Paul R. Nemeth ,  Tracy J. Barnidge ,  Vincent P. Marzen

    IPC分类号： B32B38/10

    CPC分类号： B26D1/547 ,  B26D3/28 ,  B26D7/10 ,  B32B17/1099 ,  B32B43/006 ,  B32B2457/20 ,  Y10S83/907 ,  Y10T83/0274 ,  Y10T83/0296 ,  Y10T83/041 ,  Y10T83/0515 ,  Y10T83/707 ,  Y10T83/7101 ,  Y10T83/73 ,  Y10T83/9292 ,  Y10T156/1153 ,  Y10T156/1911 ,  Y10T156/1961 ,  Y10T156/1967

    摘要： An apparatus for separating a laminated substrate assembly comprises at least a substantially planar assembly, a cutting member housing assembly positioned on a first side of the substantially planar assembly, a cutting member receiving assembly positioned on a second side of the substantially planar assembly, substantially opposite from the first side of the planar assembly suitable for receiving an amount of the elongated cutting member. At least one of the cutting member housing assembly or the cutting member receiving assembly is configured to provide an amount of tension to the elongated cutting member as the elongated cutting member is released by the cutting member housing assembly or received by the cutting member receiving assembly, and the elongated cutting member is configured to remove an amount of adhesive from an adhesive layer of the laminated substrate assembly.

    摘要翻译： 用于分离层压基板组件的装置包括至少基本平坦的组件，位于基本上平面的组件的第一侧上的切割构件壳体组件，位于基本平坦的组件的第二侧上的切割构件接收组件， 从适于接收一定量的细长切割构件的平面组件的第一侧。 切割构件壳体组件或切割构件接收组件中的至少一个构造成当细长切割构件被切割构件壳体组件释放或由切割构件接收组件接收时，向细长切割构件提供一定量的张力， 并且所述细长切割构件构造成从所述层叠基底组件的粘合剂层去除一定量的粘合剂。

    Substrate lamination system and method
    6.
    发明授权
    Substrate lamination system and method 有权
    基板层压体系及方法

    公开(公告)号：US08691043B2

    公开(公告)日：2014-04-08

    申请号：US12009375

    申请日：2008-01-18

    申请人： James D. Sampica ,  Paul R. Nemeth ,  Tracy J. Barnidge ,  Vincent P. Marzen

    发明人： James D. Sampica ,  Paul R. Nemeth ,  Tracy J. Barnidge ,  Vincent P. Marzen

    IPC分类号： B32B37/00

    CPC分类号： B32B37/1018 ,  B32B37/003 ,  B32B37/0046 ,  B32B37/12 ,  B32B2038/1891 ,  B32B2309/02 ,  B32B2309/04 ,  B32B2309/72 ,  B32B2315/08 ,  B32B2457/202

    摘要： The present disclosure is directed to a substrate lamination system and method. A method for laminating substrates may comprise: (a) disposing a pressure-sensitive adhesive later between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate; (b) disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber; (c) evacuating the vacuum chamber; (d) applying pressure to at least one of the first substrate and the second substrate. A system for laminating substrates may comprise: (a) means for disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate; (b) means for disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber; (c) means for evacuating the vacuum chamber; (d) means for applying pressure to at least one of the first and second substrates.

    摘要翻译： 本公开涉及基板层压系统和方法。 层压基板的方法可以包括：（a）在第一基板的基本上平坦的表面和第二基板的基本上平坦的表面之间设置压敏粘合剂; （b）将第一基板，压敏粘合剂层和第二基板设置在真空室内; （c）抽真空室; （d）向第一基板和第二基板中的至少一个施加压力。 用于层压基板的系统可以包括：（a）用于在第一基板的基本上平坦的表面和第二基板的基本上平坦的表面之间设置压敏粘合剂层的装置; （b）将第一基板，压敏粘合剂层和第二基板设置在真空室内的装置; （c）抽真空室的装置; （d）向第一和第二基板中的至少一个施加压力的装置。

    Alignment system and method thereof
    8.
    发明申请
    Alignment system and method thereof 有权
    校准系统及其方法

    公开(公告)号：US20090183381A1

    公开(公告)日：2009-07-23

    申请号：US12009373

    申请日：2008-01-18

    申请人： James D. Sampica ,  Paul R. Nemeth ,  Tracy J. Barnidge ,  Vincent P. Marzen

    发明人： James D. Sampica ,  Paul R. Nemeth ,  Tracy J. Barnidge ,  Vincent P. Marzen

    IPC分类号： G01D21/00

    CPC分类号： B32B38/1833 ,  B32B2457/202

    摘要： A method for alignment comprises calculating the proper alignment position for a plurality of planar items based on at least one datum per planar item of the plurality of planar items, instructing a tooling system to form a tooling aid for providing the proper alignment position in a planar substrate lamination apparatus, and inserting the tooling aid into the planar substrate lamination apparatus for the proper alignment of the plurality of planar items in the planar substrate lamination apparatus.

    摘要翻译： 用于对准的方法包括基于多个平面物品中的每个平面物品的至​​少一个基准来计算多个平面物品的适当对准位置，指示工具系统形成用于在平面物体中提供适当对准位置的工具辅助 基板层压装置，并将工具辅助材料插入到平面基板层压装置中，以便平面基板层压装置中的多个平面物品的适当对准。