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公开(公告)号：US08936057B2
公开(公告)日：2015-01-20
申请号：US12009482
申请日：2008-01-18
CPC分类号： B32B37/003 , B32B37/0046 , B32B37/10 , B32B37/1009 , B32B38/1841 , B32B2457/202
摘要： The present disclosure is directed to a substrate lamination system and method.A substrate lamination apparatus may comprise: (a) a vacuum chamber; (b) a flexible membrane; and (c) a substrate support.A system for laminating substrates may comprise: (a) a vacuum chamber; (b) a flexible membrane; (c) a substrate support; (d) a vacuum pump; (e) a compressor; and (f) a control unit, wherein the control unit is configured to carry out the steps: (i) evacuating the vacuum chamber; and (ii) applying pressure to at least one of a first substrate and a second substrate.
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2.发明授权System and method for completing lamination of rigid-to-rigid substrate by the controlled application of pressure 有权通过控制压力完成刚性 - 刚性基材层压的系统和方法公开(公告)号：US08746311B1
公开(公告)日：2014-06-10
申请号：US14019429
申请日：2013-09-05
IPC分类号： B32B37/00
CPC分类号： B32B37/10 , B32B17/10018 , B32B37/003 , B32B37/0046 , B32B37/1009 , B32B37/1018 , B32B37/12 , B32B2457/202 , G02F1/1303 , H05K3/4611
摘要： The present invention is a process for performing rigid-to-rigid substrate lamination implementing pressure-sensitive adhesive (PSA). The process may include pressurizing a first sealed cavity to a first pressure. The process may further include creating a vacuum within a second sealed cavity, the second sealed cavity being sealed from the first sealed cavity by a flexible membrane. The process may further include applying the first pressure to a laminate assembly stack via the flexible membrane, the laminate assembly stack including a first substrate, a second substrate, and a PSA layer, the PSA layer being positioned between the first substrate and the second substrate. The process may further include applying the vacuum created within the second sealed cavity to the laminate assembly stack. The applied first pressure and the applied vacuum promote intimate contact between the first substrate and the second substrate of the laminate assembly stack via the PSA layer.
摘要翻译： 本发明是一种执行压敏粘合剂（PSA）的刚性至刚性基材层压的方法。 该方法可以包括将第一密封空腔加压至第一压力。 该方法还可以包括在第二密封空腔内产生真空，第二密封空腔通过柔性膜与第一密封空腔密封。 该方法还可以包括经由柔性膜将第一压力施加到层压组件叠层，层压组件堆叠包括第一衬底，第二衬底和粘合剂层，PSA层位于第一衬底和第二衬底之间 。 该方法还可以包括将在第二密封空腔内产生的真空施加到层压组件叠层。 所施加的第一压力和施加的真空促进层压组件叠层的第一衬底和第二衬底之间经由PSA层的紧密接触。
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公开(公告)号：US07573466B1
公开(公告)日：2009-08-11
申请号：US10664214
申请日：2003-09-17
IPC分类号： G06F3/043
CPC分类号： G06F3/043
摘要： A touch screen for LCDs which uses a plurality of shockwave detectors disposed around the periphery of the viewing area to detect the location of a touch or tap which is the point of origin of an expanding shockwave.
摘要翻译： 一种用于LCD的触摸屏，其使用设置在观看区域的周边周围的多个冲击波检测器来检测作为扩张的冲击波的起点的触摸或水龙头的位置。
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公开(公告)号：US20090117809A1
公开(公告)日：2009-05-07
申请号：US11214518
申请日：2005-08-30
IPC分类号： H01L51/50
CPC分类号： H01L51/56 , H01L51/524 , H01L51/5246
摘要： A method of sealing an Organic Light-Emitting Diode (OLED) assembly is disclosed. A dry film adhesive is applied to a capping layer. An OLED assembly is placed in a cavity of a fixture. The capping layer is positioned in the cavity of the fixture such that a first edge of the capping layer contacts the OLED assembly and a second edge of the capping layer is separate from the OLED assembly. Atmospheric pressure is reduced between the capping layer and the OLED assembly. The second edge of the capping layer is dropped such that the second edge of the capping layer is adjacent the OLED assembly.
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5.发明授权公开(公告)号：US08603288B2
公开(公告)日：2013-12-10
申请号：US12009472
申请日：2008-01-18
IPC分类号： B32B37/10
CPC分类号： B29D7/01 , B29C33/20 , B29C43/12 , B29C43/203 , B29C43/3642 , B29C53/18 , B29C2043/3233 , B29C2043/3647 , B29C2043/3649 , B32B7/12 , B32B15/08 , B32B25/08 , B32B27/08 , B32B27/32 , B32B2250/05 , B32B2250/40 , B32B2255/10 , B32B2255/26 , B32B2457/00 , B32B2457/08 , B32B2457/202 , B32B2457/206 , B32B2457/208 , Y10T428/28
摘要： The present invention is a process for performing a planarization treatment of pressure-sensitive adhesive (PSA). The process includes positioning a first substrate onto a support surface of a planarization tool. The process further includes placing at least one layer of PSA onto the first substrate. The process further includes positioning a second substrate onto the layer(s) of PSA. The process further includes applying a pressure to the second substrate via a flexible membrane, said pressure being applied in a generally uniform, unidirectional and localized manner. Further, the applied pressure flattens the PSA between the first substrate and the second substrate for promoting suitability of the PSA for use in rigid-to-rigid lamination processes.
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公开(公告)号：US08540002B2
公开(公告)日：2013-09-24
申请号：US13420381
申请日：2012-03-14
IPC分类号： B32B37/00
CPC分类号： B32B37/10 , B32B17/10018 , B32B37/003 , B32B37/0046 , B32B37/1009 , B32B37/1018 , B32B37/12 , B32B2457/202 , G02F1/1303 , H05K3/4611
摘要： The present invention is a process for performing rigid-to-rigid substrate lamination implementing pressure-sensitive adhesive (PSA). The process may include pressurizing a first sealed cavity to a first pressure. The process may further include creating a vacuum within a second sealed cavity, the second sealed cavity being sealed from the first sealed cavity by a flexible membrane. The process may further include applying the first pressure to a laminate assembly stack via the flexible membrane, the laminate assembly stack including a first substrate, a second substrate, and a PSA layer, the PSA layer being positioned between the first substrate and the second substrate. The process may further include applying the vacuum created within the second sealed cavity to the laminate assembly stack. The applied first pressure and the applied vacuum promote intimate contact between the first substrate and the second substrate of the laminate assembly stack via the PSA layer.
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7.发明授权System and method for completing lamination of rigid-to-rigid substrates by the controlled application of pressure 有权通过控制压力完成刚性 - 刚性基材层压的系统和方法公开(公告)号：US08137498B2
公开(公告)日：2012-03-20
申请号：US12009393
申请日：2008-01-18
IPC分类号： B32B37/00
CPC分类号： B32B37/10 , B32B17/10018 , B32B37/003 , B32B37/0046 , B32B37/1009 , B32B37/1018 , B32B37/12 , B32B2457/202 , G02F1/1303 , H05K3/4611
摘要： The present invention is a process for performing rigid-to-rigid substrate lamination implementing pressure-sensitive adhesive (PSA). The process may include pressurizing a first sealed cavity to a first pressure. The process may further include creating a vacuum within a second sealed cavity, the second sealed cavity being sealed from the first sealed cavity by a flexible membrane. The process may further include applying the first pressure to a laminate assembly stack via the flexible membrane, the laminate assembly stack including a first substrate, a second substrate, and a PSA layer, the PSA layer being positioned between the first substrate and the second substrate. The process may further include applying the vacuum created within the second sealed cavity to the laminate assembly stack. The applied first pressure and the applied vacuum promote intimate contact between the first substrate and the second substrate of the laminate assembly stack via the PSA layer.
摘要翻译： 本发明是一种执行压敏粘合剂（PSA）的刚性至刚性基材层压的方法。 该方法可以包括将第一密封空腔加压至第一压力。 该方法还可以包括在第二密封空腔内产生真空，第二密封空腔通过柔性膜与第一密封空腔密封。 该方法还可以包括经由柔性膜将第一压力施加到层压组件叠层，层压组件堆叠包括第一衬底，第二衬底和粘合剂层，PSA层位于第一衬底和第二衬底之间 。 该方法还可以包括将在第二密封空腔内产生的真空施加到层压组件叠层。 所施加的第一压力和施加的真空促进层压组件叠层的第一衬底和第二衬底之间经由PSA层的紧密接触。
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公开(公告)号：US20090120585A1
公开(公告)日：2009-05-14
申请号：US12009482
申请日：2008-01-18
IPC分类号： B29C65/02
CPC分类号： B32B37/003 , B32B37/0046 , B32B37/10 , B32B37/1009 , B32B38/1841 , B32B2457/202
摘要： The present disclosure is directed to a substrate lamination system and method.A substrate lamination apparatus may comprise: (a) a vacuum chamber; (b) a flexible membrane; and (c) a substrate support.A system for laminating substrates may comprise: (a) a vacuum chamber; (b) a flexible membrane; (c) a substrate support; (d) a vacuum pump; (e) a compressor; and (f) a control unit, wherein the control unit is configured to carry out the steps: (i) evacuating the vacuum chamber; and (ii) applying pressure to at least one of a first substrate and a second substrate.
摘要翻译： 本公开涉及基板层压系统和方法。 基板层压装置可以包括：（a）真空室; （b）柔性膜; 和（c）基材载体。 层压基板的系统可以包括：（a）真空室; （b）柔性膜; （c）基底支撑体; （d）真空泵; （e）压缩机; 和（f）控制单元，其中所述控制单元被配置为执行以下步骤：（i）抽真空室; 和（ii）向第一基板和第二基板中的至少一个施加压力。
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公开(公告)号：US08691043B2
公开(公告)日：2014-04-08
申请号：US12009375
申请日：2008-01-18
IPC分类号： B32B37/00
CPC分类号： B32B37/1018 , B32B37/003 , B32B37/0046 , B32B37/12 , B32B2038/1891 , B32B2309/02 , B32B2309/04 , B32B2309/72 , B32B2315/08 , B32B2457/202
摘要： The present disclosure is directed to a substrate lamination system and method. A method for laminating substrates may comprise: (a) disposing a pressure-sensitive adhesive later between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate; (b) disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber; (c) evacuating the vacuum chamber; (d) applying pressure to at least one of the first substrate and the second substrate. A system for laminating substrates may comprise: (a) means for disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate; (b) means for disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber; (c) means for evacuating the vacuum chamber; (d) means for applying pressure to at least one of the first and second substrates.
摘要翻译： 本公开涉及基板层压系统和方法。 层压基板的方法可以包括：（a）在第一基板的基本上平坦的表面和第二基板的基本上平坦的表面之间设置压敏粘合剂; （b）将第一基板，压敏粘合剂层和第二基板设置在真空室内; （c）抽真空室; （d）向第一基板和第二基板中的至少一个施加压力。 用于层压基板的系统可以包括：（a）用于在第一基板的基本上平坦的表面和第二基板的基本上平坦的表面之间设置压敏粘合剂层的装置; （b）将第一基板，压敏粘合剂层和第二基板设置在真空室内的装置; （c）抽真空室的装置; （d）向第一和第二基板中的至少一个施加压力的装置。
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10.发明申请PLANARIZATION TREATMENT OF PRESSURE SENSITIVE ADHESIVE FOR RIGID-TO-RIGID SUBSTRATE LAMINATION 有权用于刚性刚性基板层压的压敏粘合剂的平面处理公开(公告)号：US20140057012A1
公开(公告)日：2014-02-27
申请号：US14070251
申请日：2013-11-01
IPC分类号： B29D7/01
CPC分类号： B29D7/01 , B29C33/20 , B29C43/12 , B29C43/203 , B29C43/3642 , B29C53/18 , B29C2043/3233 , B29C2043/3647 , B29C2043/3649 , B32B7/12 , B32B15/08 , B32B25/08 , B32B27/08 , B32B27/32 , B32B2250/05 , B32B2250/40 , B32B2255/10 , B32B2255/26 , B32B2457/00 , B32B2457/08 , B32B2457/202 , B32B2457/206 , B32B2457/208 , Y10T428/28
摘要： The present invention is a process for performing a planarization treatment of pressure-sensitive adhesive (PSA). The process includes positioning a first substrate onto a support surface of a planarization tool. The process further includes placing at least one layer of PSA onto the first substrate. The process further includes positioning a second substrate onto the layer(s) of PSA. The process further includes applying a pressure to the second substrate via a flexible membrane, said pressure being applied in a generally uniform, unidirectional and localized manner. Further, the applied pressure flattens the PSA between the first substrate and the second substrate for promoting suitability of the PSA for use in rigid-to-rigid lamination processes.
摘要翻译： 本发明是进行压敏粘合剂（PSA）的平坦化处理的方法。 该方法包括将第一衬底定位在平坦化工具的支撑表面上。 该方法还包括将至少一层PSA放置在第一衬底上。 该方法还包括将第二衬底定位在PSA的层上。 该方法还包括通过柔性膜向第二基底施加压力，所述压力以大致均匀的单向和局部化方式施加。 此外，施加的压力使PSA在第一基板和第二基板之间平坦化，以促进PSA在刚性到刚性层压工艺中的适用性。
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