公开(公告)号：US20240405188A1

公开(公告)日：2024-12-05

申请号：US18672388

申请日：2024-05-23

Applicant: Japan Display Inc.

Inventor： Daiki ISONO ,  Kazuyuki YAMADA ,  Keisuke ASADA ,  Kenichi TAKEMASA

IPC: H01L33/64 ,  G09G3/32 ,  H01L25/075

Abstract: A technique for more appropriately adjusting a temperature of an electronic apparatus is provided. Temperatures of a panel substrate are detected in a plurality of measurement regions set in the panel substrate, and temperatures in a plurality of adjustment regions set in the panel substrate are individually adjusted in accordance with the temperatures of the panel substrate detected in the plurality of measurement regions.

公开(公告)号：US20240405059A1

公开(公告)日：2024-12-05

申请号：US18675253

申请日：2024-05-28

Applicant: Japan Display Inc.

Inventor： Daiki ISONO ,  Kazuyuki YAMADA ,  Keisuke ASADA ,  Kenichi TAKEMASA

IPC: H01L27/15

Abstract: A display device includes a substrate having a first main surface on which a plurality of light emitting elements spaced apart from each other are provided and a second main surface located on a side opposite to the first main surface, a cooling unit having a third main surface and a fourth main surface located on a side opposite to the third main surface, a heat dissipation sheet located between the second main surface and the third main surface and in contact with the second main surface and the third main surface, and a connection portion arranged at a position sandwiching the heat dissipation sheet in a direction along the second main surface and bonded to each of the substrate and the cooling unit, and the connection portion is made of a heat shrinkable resin.

公开(公告)号：US20240405001A1

公开(公告)日：2024-12-05

申请号：US18655479

申请日：2024-05-06

Applicant: Japan Display Inc.

Inventor： Kenichi TAKEMASA ,  Kazuyuki YAMADA ,  Keisuke ASADA ,  Daiki ISONO

IPC: H01L25/075 ,  H01L33/20 ,  H01L33/38

Abstract: A display device includes a first substrate having a first surface and a plurality of LED elements mounted on the first surface of the first substrate. Each of the plurality of LED elements includes a main body portion having a second surface facing the first surface of the first substrate and a third surface on a side opposite to the second surface, an anode electrode and a cathode electrode provided on the second surface of the main body portion, and an organic film bonded to the third surface of the main body portion. The organic film has a fourth surface facing and bonded to the third surface and a fifth surface on a side opposite to the fourth surface. The fifth surface of the organic film has a plurality of depressions.

公开(公告)号：US20240047605A1

公开(公告)日：2024-02-08

申请号：US18356321

申请日：2023-07-21

Applicant: Japan Display Inc.

Inventor： Kazuyuki YAMADA ,  Keisuke ASADA ,  Kenichi TAKEMASA ,  Daiki ISONO

IPC: H01L33/00 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L33/0093 ,  H01L25/167 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13021 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/16145

Abstract: Disclosed is a manufacturing method of a display device including: transferring at least one inorganic light-emitting diode formed over a base substrate onto a first carrier substrate; arranging a plurality of spacers configured to be elastically deformed over a substrate over which a pixel including a plurality of sub-pixels is arranged; and transforming the at least one inorganic light-emitting diode over the first carrier substrate onto the substrate. The manufacturing method may further include removing the plurality of spacers.

公开(公告)号：US20220253111A1

公开(公告)日：2022-08-11

申请号：US17660706

申请日：2022-04-26

Applicant: Japan Display Inc.

Inventor： Keisuke ASADA ,  Hideaki ABE ,  Kota UOGISHI ,  Kazuyuki YAMADA

IPC: G06F1/18 ,  G06F1/16

Abstract: An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.

公开(公告)号：US20220035411A1

公开(公告)日：2022-02-03

申请号：US17451050

申请日：2021-10-15

Applicant: Japan Display Inc.

Inventor： Hideaki ABE ,  Kazuyuki YAMADA ,  Keisuke ASADA ,  Kota UOGISHI

IPC: G06F1/16 ,  G06F1/18 ,  H05K1/18

Abstract: According to one embodiment, a display device including a display panel including a mount side curved to correspond to the curved shape of a display surface, a flat circuit board, and a first flexible wiring board mounted on the display panel in a first end side while being connected to the circuit board in a second end side, wherein the first flexible wiring board includes a first base member including a first surface and a second surface, a first line positioned in the first surface side, and a first protection layer covering the first line, and includes a first bending part to be bent between a first bending boundary and a second bending boundary, the second bending boundary is inclined with respect to the first bending boundary, and the first base member includes a first groove positioned in the first bending part and formed in the second surface.

公开(公告)号：US20210398939A1

公开(公告)日：2021-12-23

申请号：US17337626

申请日：2021-06-03

Applicant: Japan Display Inc.

Inventor： Kazuyuki YAMADA ,  Keisuke ASADA ,  Kenichi TAKEMASA

IPC: H01L23/00 ,  H01L25/16 ,  H01L33/62

Abstract: A method for manufacturing a display device includes preparing a circuit board including a drive circuit for driving a LED chip, forming a connecting electrode on the circuit board, forming an adhesive layer on the connecting electrode, adhering a terminal electrode of the LED chip on the adhesive layer and joining the connecting electrode and the terminal electrode by irradiating a laser light. The adhesive layer may be formed only on a upper surface of the connecting electrode.