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公开(公告)号:US20240266490A1
公开(公告)日:2024-08-08
申请号:US18625751
申请日:2024-04-03
Applicant: Japan Display Inc.
Inventor: Keisuke ASADA , Kazuyuki YAMADA , Kenichi TAKEMASA , Daiki ISONO
CPC classification number: H01L33/62 , H01L25/167 , H01L33/58
Abstract: A display device capable of providing a high production efficiency LED display including: a wiring electrically connected to a transistor of a pixel circuit, a layer including a top surface of the wiring being formed of a first material; a connecting electrode electrically connected to the wiring, a layer including a top surface of the connecting electrode being formed of a second material; and an LED element mounted on the connecting electrode, wherein an absorption rate of the first material with respect to infrared radiation is smaller than an absorption rate of the second material with respect to infrared radiation.
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公开(公告)号:US20230007770A1
公开(公告)日:2023-01-05
申请号:US17941761
申请日:2022-09-09
Applicant: Japan Display Inc.
Inventor: Kenichi TAKEMASA , Yasushi NAKANO
IPC: H05K1/11
Abstract: A wiring substrate includes a substrate, an insulating film stacked on the substrate, an anode pad stacked on a first surface of the insulating film and electrically coupled to an anode of an inorganic light-emitting diode, a cathode pad stacked on the first surface of the insulating film and electrically coupled to a cathode of the inorganic light-emitting diode, and an auxiliary pad provided to the first surface of the insulating film and having electrical conductivity. The auxiliary pad is disposed in a floating state near an end of the anode pad and the cathode pad.
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公开(公告)号:US20220336250A1
公开(公告)日:2022-10-20
申请号:US17719388
申请日:2022-04-13
Applicant: Japan Display Inc.
Inventor: Kenichi TAKEMASA , Kazuyuki YAMADA , Keisuke ASADA , Daiki ISONO
IPC: H01L21/683 , H01L25/075 , H01L33/62
Abstract: According to one embodiment, a wafer for electronic components, includes a sapphire substrate including a first surface and a second surface on an opposite side to the first surface and a plurality of electronic components located on a side of the first surface, and the sapphire substrate includes trench portions located between respective adjacent electronic components, and the trench portions extend linearly in plan view.
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公开(公告)号:US20210391381A1
公开(公告)日:2021-12-16
申请号:US17346466
申请日:2021-06-14
Applicant: Japan Display Inc.
Inventor: Keisuke ASADA , Kazuyuki YAMADA , Kenichi TAKEMASA
Abstract: According to one embodiment, a display device includes a substrate, a plurality of pixels, a resin layer and a common electrode. The pixels include a plurality of light emitting elements arranged on the substrate and having luminous colors different from each other, respectively. The resin layer is buried in a clearance part between the plurality of light emitting elements provided in each of the pixels. The common electrode is formed of a transparent conductive material covering the resin layer. The resin layer is provided in an island-like shape in each of the pixels.
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公开(公告)号:US20240414996A1
公开(公告)日:2024-12-12
申请号:US18677977
申请日:2024-05-30
Applicant: Japan Display Inc.
Inventor: Kenichi TAKEMASA , Daiki ISONO
IPC: H10K59/80 , H10K59/131
Abstract: The following transparent display device is used: an array substrate having a translucency, including a first main surface and a second main surface opposite to the first main surface, and having a display unit; a transparent substrate having a transparency and including a third main surface and a fourth main surface opposite to the third main surface; a plurality of sealing materials connecting the second main surface and the third main surface to each other in a plan view; an opening defining an inlet for a cooling medium having translucency; an opening defining an outlet for the cooling medium; and a flow path surrounded by the array substrate, the transparent substrate, and the plurality of sealing medium, and the cooling medium flows through the flow path from one of the openings 8 to the other of the openings.
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公开(公告)号:US20240395587A1
公开(公告)日:2024-11-28
申请号:US18669662
申请日:2024-05-21
Applicant: Japan Display Inc.
Inventor: Kenichi TAKEMASA , Kazuyuki YAMADA , Keisuke ASADA , Daiki ISONO
IPC: H01L21/673 , H01L23/00 , H01L25/075
Abstract: Performance of an electronic component including a plurality of elements is improved. A transfer substrate includes: a support substrate; an adhesive resin layer continuously provided on one surface of the support substrate and having a plurality of holding regions adhesively holding elements; and a coating film provided on a surface of the adhesive resin layer opposite to the support substrate to cover an outer region of the holding region of the adhesive resin layer and having lower surface adhesiveness than surface adhesiveness of the adhesive resin layer.
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公开(公告)号:US20230239441A1
公开(公告)日:2023-07-27
申请号:US18097528
申请日:2023-01-17
Applicant: Japan Display Inc.
Inventor: Kenichi TAKEMASA
CPC classification number: H04N9/3141 , G02B5/08 , G03B21/62
Abstract: Used is a display device having: a support; first and second image light source units mounted on the support; a first half mirror mounted on the support and having a first reflecting surface inclined with respect to an emitting direction of light of the first image light source unit; and a second half mirror mounted on the support and having a second reflecting surface inclined with respect to an emitting direction of light of the second image light source unit. The light emitted from the first image light source unit is reflected by the first reflecting surface and irradiated in a first direction, and the light emitted from the second image light source unit is reflected by the second reflecting surface and irradiated in a second direction different from the first direction. The same image or a different image can be simultaneously displayed at the first and second display regions.
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公开(公告)号:US20220302204A1
公开(公告)日:2022-09-22
申请号:US17686430
申请日:2022-03-04
Applicant: Japan Display Inc.
Inventor: Kenichi TAKEMASA
Abstract: A method for manufacturing a display device includes forming a drive circuit to drive an LED element on an insulating substrate; forming a light absorbing layer on the drive circuit; forming an insulating layer covering the light absorbing layer; forming a connecting electrode electrically connected to the drive circuit; arranging the LED element so that the connecting electrode is in contact with a terminal electrode of the LED element; and bonding the connecting electrode and the terminal electrode by irradiating laser light through a semiconductor layer of the LED element to the light absorbing layer.
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公开(公告)号:US20220209084A1
公开(公告)日:2022-06-30
申请号:US17551182
申请日:2021-12-15
Applicant: Japan Display Inc.
Inventor: Kenichi TAKEMASA , Kazuyuki YAMADA , Keisuke ASADA , Daiki ISONO
IPC: H01L33/62 , H01L25/075 , H01L33/38
Abstract: An LED module includes a first electrode, a second electrode arranged isolated from the first electrode, a first bump on the first electrode, a second bump on the second electrode, a protrusion between the first electrode and the second electrode, and an LED chip having a first pad electrode and a second pad electrode. The protrusion has insulating properties, the first pad electrode of the LED chip is disposed opposite the first electrode, the second pad electrode is disposed opposite the second electrode, the first pad electrode is connected to the first electrode through the first bump, and the second pad electrode is connected to the second electrode through the second bump.
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公开(公告)号:US20220150463A1
公开(公告)日:2022-05-12
申请号:US17453940
申请日:2021-11-08
Applicant: Japan Display Inc.
Inventor: Kenichi TAKEMASA
IPC: H04N13/211
Abstract: According to one embodiment, a method for controlling an electronic device includes illuminating an object while moving a light emitting area formed by turning on light emitting elements simultaneously, capturing a shadow generated by the object by image sensing elements on a same substrate as the light emitting elements, and creating three-dimensional data about an outer shape of the object based on a shadow image.
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