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公开(公告)号：US20240395587A1
公开(公告)日：2024-11-28
申请号：US18669662
申请日：2024-05-21
Applicant: Japan Display Inc.
Inventor： Kenichi TAKEMASA , Kazuyuki YAMADA , Keisuke ASADA , Daiki ISONO
IPC: H01L21/673 , H01L23/00 , H01L25/075
Abstract: Performance of an electronic component including a plurality of elements is improved. A transfer substrate includes: a support substrate; an adhesive resin layer continuously provided on one surface of the support substrate and having a plurality of holding regions adhesively holding elements; and a coating film provided on a surface of the adhesive resin layer opposite to the support substrate to cover an outer region of the holding region of the adhesive resin layer and having lower surface adhesiveness than surface adhesiveness of the adhesive resin layer.
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公开(公告)号：US20220229324A1
公开(公告)日：2022-07-21
申请号：US17715496
申请日：2022-04-07
Applicant: Japan Display Inc.
Inventor： Hideaki ABE , Yasuhito ARUGA , Hiroyuki ONODERA , Hiroki KATO , Yasushi NAKANO , Hitoshi KAWAGUCHI , Keisuke ASADA
Abstract: A display device includes: a display panel including panel terminals; and a wiring substrate including first substrate terminals coupled to the panel terminals. The panel terminals include panel terminals arranged in a first region and panel terminals arranged in second regions sandwiching the first region. The first substrate terminals include first substrate terminals arranged in a third region and first substrate terminals arranged in fourth regions sandwiching the third region. A gap between panel terminals is substantially constant in the first and second regions. A first width of the panel terminals in the first region is different from a second width of the panel terminals in the second regions. A width of the first substrate terminals is substantially constant in the third and fourth regions. A first gap between first substrate terminals in the third region is different from a second gap between first substrate terminals in the fourth regions.
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公开(公告)号：US20220209084A1
公开(公告)日：2022-06-30
申请号：US17551182
申请日：2021-12-15
Applicant: Japan Display Inc.
Inventor： Kenichi TAKEMASA , Kazuyuki YAMADA , Keisuke ASADA , Daiki ISONO
IPC: H01L33/62 , H01L25/075 , H01L33/38
Abstract: An LED module includes a first electrode, a second electrode arranged isolated from the first electrode, a first bump on the first electrode, a second bump on the second electrode, a protrusion between the first electrode and the second electrode, and an LED chip having a first pad electrode and a second pad electrode. The protrusion has insulating properties, the first pad electrode of the LED chip is disposed opposite the first electrode, the second pad electrode is disposed opposite the second electrode, the first pad electrode is connected to the first electrode through the first bump, and the second pad electrode is connected to the second electrode through the second bump.
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公开(公告)号：US20240266490A1
公开(公告)日：2024-08-08
申请号：US18625751
申请日：2024-04-03
Applicant: Japan Display Inc.
Inventor： Keisuke ASADA , Kazuyuki YAMADA , Kenichi TAKEMASA , Daiki ISONO
CPC classification number: H01L33/62 , H01L25/167 , H01L33/58
Abstract: A display device capable of providing a high production efficiency LED display including: a wiring electrically connected to a transistor of a pixel circuit, a layer including a top surface of the wiring being formed of a first material; a connecting electrode electrically connected to the wiring, a layer including a top surface of the connecting electrode being formed of a second material; and an LED element mounted on the connecting electrode, wherein an absorption rate of the first material with respect to infrared radiation is smaller than an absorption rate of the second material with respect to infrared radiation.
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公开(公告)号：US20220102326A1
公开(公告)日：2022-03-31
申请号：US17549930
申请日：2021-12-14
Applicant: Japan Display Inc.
Inventor： Keisuke ASADA
IPC: H01L25/075 , H01L33/62
Abstract: An anisotropic conductive film in which conductive particles are dispersed in a resin includes a first region having a first pattern in which the conductive particles are discretely arranged, and a second region having a first shape by aggregating the conductive particles. Further, a display device includes a substrate provided with a plurality of electrodes arranged in a first pattern, the anisotropic conductive film, and a plurality of light emitting diodes. The plurality of light emitting diodes is electrically connected to the plurality of electrodes through the conductive particles in the first region.
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Patent Agency Ranking
公开(公告)号：US20190250447A1
公开(公告)日：2019-08-15
申请号：US16269906
申请日：2019-02-07
Applicant: Japan Display Inc.
Inventor： Hideaki ABE , Yasuhito ARUGA , Hiroyuki ONODERA , Hiroki KATO , Yasushi NAKANO , Hitoshi KAWAGUCHI , Keisuke ASADA
CPC classification number: G02F1/13452 , G02F1/13458 , G02F1/1368 , G02F2001/133354 , G02F2202/28 , H01L27/1214 , H05K1/0266 , H05K1/11 , H05K1/144 , H05K1/181 , H05K3/368 , H05K2201/041 , H05K2201/049 , H05K2201/09936 , H05K2201/10136 , H05K2203/166
Abstract: A display device includes: a display panel including panel terminals; and a wiring substrate including first substrate terminals coupled to the panel terminals. The panel terminals include panel terminals arranged in a first region and panel terminals arranged in second regions sandwiching the first region. The first substrate terminals include first substrate terminals arranged in a third region and first substrate terminals arranged in fourth regions sandwiching the third region. A gap between panel terminals is substantially constant in the first and second regions. A first width of the panel terminals in the first region is different from a second width of the panel terminals in the second regions. A width of the first substrate terminals is substantially constant in the third and fourth regions. A first gap between first substrate terminals in the third region is different from a second gap between first substrate terminals in the fourth regions.
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公开(公告)号：US20240419224A1
公开(公告)日：2024-12-19
申请号：US18819025
申请日：2024-08-29
Applicant: Japan Display Inc.
Inventor： Keisuke ASADA , Hideaki ABE , Kota UOGISHI , Kazuyuki YAMADA
Abstract: An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.
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公开(公告)号：US20230350470A1
公开(公告)日：2023-11-02
申请号：US18347030
申请日：2023-07-05
Applicant: Japan Display Inc.
Inventor： Keisuke ASADA , Hideaki ABE , Kota UOGISHI , Kazuyuki YAMADA
CPC classification number: G06F1/189 , G06F1/1605 , G06F1/1652 , G09F9/301
Abstract: An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.
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公开(公告)号：US20230343907A1
公开(公告)日：2023-10-26
申请号：US18346294
申请日：2023-07-03
Applicant: Japan Display Inc.
Inventor： Keisuke ASADA
IPC: H01L33/56 , H01L25/075
CPC classification number: H01L33/56 , H01L25/0753 , H01L2933/005
Abstract: According to one embodiment, a method for manufacturing a display device, includes attaching a protective film on a surface of a backplane including a plurality of flexible backplanes formed on a glass substrate, cutting out the plurality of flexible backplanes from the backplane on which the protective film is attached, peeling the protective film off from each of the flexible backplanes and constituting a display device including an LED chip using the flexible backplane in a state that the protective film is peeled off.
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公开(公告)号：US20220336250A1
公开(公告)日：2022-10-20
申请号：US17719388
申请日：2022-04-13
Applicant: Japan Display Inc.
Inventor： Kenichi TAKEMASA , Kazuyuki YAMADA , Keisuke ASADA , Daiki ISONO
IPC: H01L21/683 , H01L25/075 , H01L33/62
Abstract: According to one embodiment, a wafer for electronic components, includes a sapphire substrate including a first surface and a second surface on an opposite side to the first surface and a plurality of electronic components located on a side of the first surface, and the sapphire substrate includes trench portions located between respective adjacent electronic components, and the trench portions extend linearly in plan view.
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