公开(公告)号：US20240266490A1

公开(公告)日：2024-08-08

申请号：US18625751

申请日：2024-04-03

Applicant: Japan Display Inc.

Inventor： Keisuke ASADA ,  Kazuyuki YAMADA ,  Kenichi TAKEMASA ,  Daiki ISONO

IPC: H01L33/62 ,  H01L25/16 ,  H01L33/58

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/58

Abstract: A display device capable of providing a high production efficiency LED display including: a wiring electrically connected to a transistor of a pixel circuit, a layer including a top surface of the wiring being formed of a first material; a connecting electrode electrically connected to the wiring, a layer including a top surface of the connecting electrode being formed of a second material; and an LED element mounted on the connecting electrode, wherein an absorption rate of the first material with respect to infrared radiation is smaller than an absorption rate of the second material with respect to infrared radiation.

公开(公告)号：US20220336250A1

公开(公告)日：2022-10-20

申请号：US17719388

申请日：2022-04-13

Applicant: Japan Display Inc.

Inventor： Kenichi TAKEMASA ,  Kazuyuki YAMADA ,  Keisuke ASADA ,  Daiki ISONO

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/62

Abstract: According to one embodiment, a wafer for electronic components, includes a sapphire substrate including a first surface and a second surface on an opposite side to the first surface and a plurality of electronic components located on a side of the first surface, and the sapphire substrate includes trench portions located between respective adjacent electronic components, and the trench portions extend linearly in plan view.

公开(公告)号：US20220123191A1

公开(公告)日：2022-04-21

申请号：US17563084

申请日：2021-12-28

Applicant: Japan Display Inc.

Inventor： Kazuyuki YAMADA ,  Keisuke ASADA ,  Daiki ISONO

IPC: H01L33/62 ,  H01L25/075

Abstract: An LED module includes a first electrode on an insulating surface, a second electrode adjacent to the first electrode, at least one groove arranged between the first electrode and the second electrode on the insulating surface, and an LED chip disposed over the first electrode and the second electrode. The LED chip is connected to the first electrode and the second electrode through conductive members.

公开(公告)号：US20240414996A1

公开(公告)日：2024-12-12

申请号：US18677977

申请日：2024-05-30

Applicant: Japan Display Inc.

Inventor： Kenichi TAKEMASA ,  Daiki ISONO

IPC: H10K59/80 ,  H10K59/131

Abstract: The following transparent display device is used: an array substrate having a translucency, including a first main surface and a second main surface opposite to the first main surface, and having a display unit; a transparent substrate having a transparency and including a third main surface and a fourth main surface opposite to the third main surface; a plurality of sealing materials connecting the second main surface and the third main surface to each other in a plan view; an opening defining an inlet for a cooling medium having translucency; an opening defining an outlet for the cooling medium; and a flow path surrounded by the array substrate, the transparent substrate, and the plurality of sealing medium, and the cooling medium flows through the flow path from one of the openings 8 to the other of the openings.

公开(公告)号：US20240395587A1

公开(公告)日：2024-11-28

申请号：US18669662

申请日：2024-05-21

Applicant: Japan Display Inc.

Inventor： Kenichi TAKEMASA ,  Kazuyuki YAMADA ,  Keisuke ASADA ,  Daiki ISONO

IPC: H01L21/673 ,  H01L23/00 ,  H01L25/075

Abstract: Performance of an electronic component including a plurality of elements is improved. A transfer substrate includes: a support substrate; an adhesive resin layer continuously provided on one surface of the support substrate and having a plurality of holding regions adhesively holding elements; and a coating film provided on a surface of the adhesive resin layer opposite to the support substrate to cover an outer region of the holding region of the adhesive resin layer and having lower surface adhesiveness than surface adhesiveness of the adhesive resin layer.

公开(公告)号：US20220209084A1

公开(公告)日：2022-06-30

申请号：US17551182

申请日：2021-12-15

Applicant: Japan Display Inc.

Inventor： Kenichi TAKEMASA ,  Kazuyuki YAMADA ,  Keisuke ASADA ,  Daiki ISONO

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/38

Abstract: An LED module includes a first electrode, a second electrode arranged isolated from the first electrode, a first bump on the first electrode, a second bump on the second electrode, a protrusion between the first electrode and the second electrode, and an LED chip having a first pad electrode and a second pad electrode. The protrusion has insulating properties, the first pad electrode of the LED chip is disposed opposite the first electrode, the second pad electrode is disposed opposite the second electrode, the first pad electrode is connected to the first electrode through the first bump, and the second pad electrode is connected to the second electrode through the second bump.

公开(公告)号：US20240405188A1

公开(公告)日：2024-12-05

申请号：US18672388

申请日：2024-05-23

Applicant: Japan Display Inc.

Inventor： Daiki ISONO ,  Kazuyuki YAMADA ,  Keisuke ASADA ,  Kenichi TAKEMASA

IPC: H01L33/64 ,  G09G3/32 ,  H01L25/075

Abstract: A technique for more appropriately adjusting a temperature of an electronic apparatus is provided. Temperatures of a panel substrate are detected in a plurality of measurement regions set in the panel substrate, and temperatures in a plurality of adjustment regions set in the panel substrate are individually adjusted in accordance with the temperatures of the panel substrate detected in the plurality of measurement regions.

公开(公告)号：US20240405059A1

公开(公告)日：2024-12-05

申请号：US18675253

申请日：2024-05-28

Applicant: Japan Display Inc.

Inventor： Daiki ISONO ,  Kazuyuki YAMADA ,  Keisuke ASADA ,  Kenichi TAKEMASA

IPC: H01L27/15

Abstract: A display device includes a substrate having a first main surface on which a plurality of light emitting elements spaced apart from each other are provided and a second main surface located on a side opposite to the first main surface, a cooling unit having a third main surface and a fourth main surface located on a side opposite to the third main surface, a heat dissipation sheet located between the second main surface and the third main surface and in contact with the second main surface and the third main surface, and a connection portion arranged at a position sandwiching the heat dissipation sheet in a direction along the second main surface and bonded to each of the substrate and the cooling unit, and the connection portion is made of a heat shrinkable resin.

公开(公告)号：US20240405001A1

公开(公告)日：2024-12-05

申请号：US18655479

申请日：2024-05-06

Applicant: Japan Display Inc.

Inventor： Kenichi TAKEMASA ,  Kazuyuki YAMADA ,  Keisuke ASADA ,  Daiki ISONO

IPC: H01L25/075 ,  H01L33/20 ,  H01L33/38

Abstract: A display device includes a first substrate having a first surface and a plurality of LED elements mounted on the first surface of the first substrate. Each of the plurality of LED elements includes a main body portion having a second surface facing the first surface of the first substrate and a third surface on a side opposite to the second surface, an anode electrode and a cathode electrode provided on the second surface of the main body portion, and an organic film bonded to the third surface of the main body portion. The organic film has a fourth surface facing and bonded to the third surface and a fifth surface on a side opposite to the fourth surface. The fifth surface of the organic film has a plurality of depressions.

公开(公告)号：US20240047605A1

公开(公告)日：2024-02-08

申请号：US18356321

申请日：2023-07-21

Applicant: Japan Display Inc.

Inventor： Kazuyuki YAMADA ,  Keisuke ASADA ,  Kenichi TAKEMASA ,  Daiki ISONO

IPC: H01L33/00 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L33/0093 ,  H01L25/167 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13021 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/16145

Abstract: Disclosed is a manufacturing method of a display device including: transferring at least one inorganic light-emitting diode formed over a base substrate onto a first carrier substrate; arranging a plurality of spacers configured to be elastically deformed over a substrate over which a pixel including a plurality of sub-pixels is arranged; and transforming the at least one inorganic light-emitting diode over the first carrier substrate onto the substrate. The manufacturing method may further include removing the plurality of spacers.