公开(公告)号：US5153023A

公开(公告)日：1992-10-06

申请号：US621687

申请日：1990-12-03

申请人： Thomas E. Orlowski ,  James Duff ,  Joan R. Ewing ,  Joseph A. Swift ,  Raymond E. Bailey

发明人： Thomas E. Orlowski ,  James Duff ,  Joan R. Ewing ,  Joseph A. Swift ,  Raymond E. Bailey

IPC分类号： B41J29/00 ,  C23C18/08 ,  C23C18/16 ,  C23C18/30 ,  H05K3/18

CPC分类号： H05K3/185 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/2033 ,  C23C18/204 ,  C23C18/206 ,  C23C18/30 ,  C23C18/405

摘要： A method of forming at least one electrically conductive path in a plastic substrate comprising providing a thermoplastic substrate having a melting point below 325.degree. C., coating said substrate with a precursor of a catalyst for the electroless deposition of conductive metals, said catalyst precursor having a decomposition temperature below the melting point of said thermoplastic and within the temperature range where said thermoplastic softens, heating the portion of said coated thermoplastic substrate corresponding to said conductive path to a temperature sufficient to decompose said catalyst precursor to said catalyst and soften said thermoplastic; said substrate, catalyst precursor and temperature being selected such that on heating to the temperature the precursor decomposes to the catalyst, the thermoplastic softens and at least partially melts without substantial decomposition to enable the catalyst to penetrate the surface of the thermoplastic and become anchored thereto to provide nucleation sites for the subsequent electroless deposition of conductive metal and depositing conductive metal by electroless deposition on said heated portion to form said conductive path.