公开(公告)号：US11953833B2

公开(公告)日：2024-04-09

申请号：US16843232

申请日：2020-04-08

Applicant: NIKON CORPORATION ,  KANAGAWA UNIVERSITY

Inventor： Yusuke Kawakami ,  Kazuo Yamaguchi ,  Michiko Itou

IPC: G03F7/075 ,  C07F7/18 ,  C23C18/20 ,  C23C18/44 ,  H10K10/46 ,  H10K71/00 ,  G03F7/20 ,  H10K10/84

CPC classification number: G03F7/0755 ,  C07F7/1804 ,  C23C18/204 ,  C23C18/44 ,  H10K10/466 ,  H10K71/621 ,  G03F7/20 ,  H10K10/481 ,  H10K10/84

Abstract: A compound represented by Formula (1). [In the formula, X represents a halogen atom or an alkoxy group, R1 represents any one group selected from an alkyl group having 1 to 5 carbon atoms, a group represented by Formula (R2-1), and a group represented by Formula (R2-2), R2 represents a group represented by Formula (R2-1) or (R2-2), n0 represents an integer of 0 or greater, n1 represents an integer of 0 to 5, and n2 represents a natural number of 1 to 5.]

公开(公告)号：US20180073149A1

公开(公告)日：2018-03-15

申请号：US15263655

申请日：2016-09-13

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Hung Tat Chan ,  Ka Ming Yip ,  Chit Yiu Chan ,  Kwok Wai Yee

IPC: C23C18/16 ,  C08J7/04 ,  B05D1/02 ,  B05D1/18 ,  B05D3/00 ,  B05D3/06 ,  C23C18/38 ,  B05D5/08

CPC classification number: C23C18/1612 ,  B05D1/02 ,  B05D1/18 ,  B05D3/007 ,  B05D3/06 ,  B05D5/068 ,  B05D5/08 ,  B05D2201/02 ,  B05D2505/00 ,  C08J7/045 ,  C08J2379/02 ,  C23C18/1605 ,  C23C18/1641 ,  C23C18/165 ,  C23C18/2013 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C23C18/38

Abstract: Shielding coatings are applied to polymer substrates for selective metallization of the substrates. The shielding coatings include a primer component and a hydrophobic top coat. The primer is first applied to the polymer substrate followed by application of the top coat component. The shielding coating is then selectively etched to form an outline of a desired current pattern. A catalyst is applied to the patterned polymer substrate followed by electroless metal plating in the etched portions. The portions of the polymer substrate which contain the shielding coating inhibit electroless metal plating. The primers contain polyamines and the top coat contains hydrophobic alky organic compounds.

公开(公告)号：US09889471B2

公开(公告)日：2018-02-13

申请号：US14533126

申请日：2014-11-05

Applicant: Cuptronic Technology Ltd.

Inventor： Sven Göthe ,  Björn Atthoff

IPC: B05D7/00 ,  C23C18/16 ,  C23C18/20 ,  C23C18/30 ,  C23C18/18 ,  B05D3/06 ,  B05D5/00 ,  C08J7/04

CPC classification number: B05D7/548 ,  B05D3/06 ,  B05D5/00 ,  C08J7/045 ,  C08J2355/02 ,  C08J2369/00 ,  C08J2433/02 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/182 ,  C23C18/1844 ,  C23C18/1868 ,  C23C18/1882 ,  C23C18/2006 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/30 ,  Y10T428/24355

Abstract: A process for application of metal on a substrate surface comprises applying a mixture of a solvent, a polymerizable monomer, and a photoinitiator on a substrate surface, wherein the photoinitiator does not form two phases together with the monomer and the solvent, i.e. it forms an amorphous mixture without any crystals. The monomer is able to polymerize to a polymer comprising at least one carboxylic group. Thereafter the solvent is evaporated. Polymerization is induced by irradiating the applied dried mixture. Ions are applied and reduced to metal and thereafter further metal can be deposited. The method can be used in industrial processes, both 2D and 3D surfaces can be coated with metal. Materials sensitive to standard grafting chemicals and/or polymers containing halogen atoms can be coated.

公开(公告)号：US20170208685A1

公开(公告)日：2017-07-20

申请号：US15477667

申请日：2017-04-03

Applicant: MITSUBISHI CHEMICAL EUROPE GMBH

Inventor： Bernardus Antonius Gerardus SCHRAUWEN

IPC: H05K1/03 ,  C23C18/16 ,  C23C18/20 ,  H05K3/18 ,  H01Q1/36 ,  H05K3/00 ,  H05K3/10 ,  C08K3/22 ,  C23C18/38

CPC classification number: C08K3/22 ,  C08K3/2279 ,  C08K2003/2231 ,  C08K2003/2241 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1646 ,  C23C18/204 ,  C23C18/38 ,  H01Q1/36 ,  H05K1/0373 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/181 ,  H05K2201/0129 ,  H05K2201/0215 ,  H05K2201/09118 ,  H05K2203/107

Abstract: A thermoplastic composition including a) a thermoplastic resin and b) a laser direct structuring (LDS) additive in an amount of at least 1 wt. % with respect to the weight of the total composition, wherein the LDS additive includes a mixed metal oxide including at least tin and a second metal selected from the group consisting of antimony, bismuth, aluminium and molybdenum, wherein the LDS additive includes at least 40 wt. % of tin and wherein the weight ratio of the second metal to tin is at least 0.02:1.

公开(公告)号：US20170175271A1

公开(公告)日：2017-06-22

申请号：US15448066

申请日：2017-03-02

Applicant: BYD COMPANY LIMITED

Inventor： WEI ZHOU ,  BIFENG MAO

IPC: C23C18/16 ,  C25D3/12 ,  C09D11/03 ,  C09D11/52 ,  C09D177/10 ,  C09D169/00 ,  C09D167/02 ,  C09D11/38 ,  C23C18/20 ,  C09D11/102

CPC classification number: C23C18/1612 ,  B01J23/20 ,  B01J35/0013 ,  B01J35/026 ,  B01J37/0072 ,  B01J37/08 ,  C08K3/22 ,  C08K9/02 ,  C08K2003/2231 ,  C08L77/06 ,  C09D11/03 ,  C09D11/10 ,  C09D11/102 ,  C09D11/322 ,  C09D11/38 ,  C09D11/52 ,  C09D167/02 ,  C09D169/00 ,  C09D177/10 ,  C23C18/1608 ,  C23C18/1633 ,  C23C18/1641 ,  C23C18/1646 ,  C23C18/1653 ,  C23C18/1655 ,  C23C18/1893 ,  C23C18/20 ,  C23C18/204 ,  C23C18/2066 ,  C23C18/40 ,  C25D3/12 ,  H05K3/182 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2203/0709 ,  H05K2203/107

Abstract: Provided is a doped tin oxide that can be used as a chemical plating promoter in a method for selectively metallizing a surface of an insulating substrate. Also provided are a polymer composition that includes the doped tin oxide, a polymer molded body, an ink composition, and a method for selectively metallizing a surface of an insulating substrate. The doped tin oxide has a light color, and does not interfere with the color of the substrate while presetting thereof. The doped tin oxide has a strong ability of promoting chemical plating. Using the disclosed doped tin oxide as a chemical plating promoter, a continuous metal layer can be formed with a high plating speed, together with enhanced adhesivity between the metal layer and the insulating substrate.

公开(公告)号：US09650716B2

公开(公告)日：2017-05-16

申请号：US14602500

申请日：2015-01-22

Applicant: Eastman Kodak Company

Inventor： Marcus Stephen Bermel ,  Lisa Baxter Todd ,  Linda Mae Franklin ,  Thomas Henry Mourey ,  Christine Joanne Landry-Coltrain

IPC: G03C1/09 ,  C23C18/16 ,  G03F7/20 ,  C23C18/40 ,  B32B15/00 ,  C09D11/101 ,  C23C18/20 ,  C23C18/44 ,  C09D11/03 ,  C09D11/037 ,  C23C18/30 ,  H05K3/18

CPC classification number: C23C18/1608 ,  B32B15/00 ,  C09D11/03 ,  C09D11/037 ,  C09D11/101 ,  C23C18/204 ,  C23C18/206 ,  C23C18/30 ,  C23C18/405 ,  C23C18/44 ,  G03F7/20 ,  H05K3/185 ,  H05K2201/09681

Abstract: A method is used to provide an electrically conductive article. The method includes: (i) providing a continuous polymeric web of a transparent polymeric substrate; (ii) forming a first photocurable pattern on at least a first portion on a first supporting side of the continuous polymeric web using a photocurable composition comprising metal particles; (iii) exposing the photocurable pattern to form a photocured pattern on the first portion of the first supporting side; (iv) electrolessly plating the photocured pattern with an electrically-conductive metal to form an electrically-conductive metal pattern; and (v) forming a dry outermost polymeric coating over at least part but not all of the electrically-conductive pattern, the dry polymeric coating having a dry thickness of less than 5 μm, an integrated transmittance of at least 80%, and comprising a non-crosslinked thermoplastic polymer having a glass transition temperature (Tg) that is equal to or greater than 65° C.

公开(公告)号：US20170107348A1

公开(公告)日：2017-04-20

申请号：US15126361

申请日：2015-03-23

Applicant: DSM IP ASSETS B.V.

Inventor： Ren BAO ,  Robert Hendrik Catharina JANSSEN

IPC: C08K3/22 ,  B29B7/90 ,  B29B9/06 ,  B29C45/00 ,  H05K3/10 ,  C23C18/38 ,  C23C18/16 ,  B29B7/48 ,  H05K1/03 ,  H05K1/09 ,  C08K7/14 ,  C23C18/20

CPC classification number: C08K3/22 ,  B29B7/48 ,  B29B7/90 ,  B29B9/06 ,  B29C45/0001 ,  B29C45/0005 ,  B29K2101/12 ,  B29K2105/12 ,  B29K2309/08 ,  C08K3/24 ,  C08K7/02 ,  C08K7/14 ,  C08K2003/2265 ,  C08K2201/001 ,  C23C18/1641 ,  C23C18/1689 ,  C23C18/204 ,  C23C18/38 ,  H05K1/032 ,  H05K1/09 ,  H05K3/10

Abstract: Present application discloses a thermoplastic composition comprising a) 42.5 wt. % to 94 wt. % of thermoplastic matrix resin; b) 1 wt. % to 7.5 wt. % of a laser direct structuring additive; and c) 5 wt. % to 50 wt. % fibrous reinforcement agent; wherein the wt. % is relative to the total weight of the composition; wherein the laser direct structuring additive is represented by formula ZnxNi(1-x)Fe2O4, wherein the x is higher than 0.60 and lower than 0.85; wherein the composition is capable of being plated after being activated using a laser.

公开(公告)号：US09587315B2

公开(公告)日：2017-03-07

申请号：US14571410

申请日：2014-12-16

Applicant: Deepak Shukla ,  Kevin M. Donovan

Inventor： Deepak Shukla ,  Kevin M. Donovan

IPC: C08F2/50 ,  C08K5/3432 ,  C08K5/45 ,  C23C18/16 ,  C23C18/31 ,  C23C18/18 ,  C09D11/101 ,  C23C18/20 ,  C23C18/30 ,  G06F3/044 ,  C23C18/38 ,  H05K3/18

CPC classification number: C23C18/1603 ,  C09D11/037 ,  C09D11/101 ,  C09D11/52 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/1637 ,  C23C18/182 ,  C23C18/1831 ,  C23C18/1868 ,  C23C18/1879 ,  C23C18/204 ,  C23C18/30 ,  C23C18/31 ,  C23C18/38 ,  G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K3/185

Abstract: A non-aqueous metal catalytic composition includes (a) a complex of silver and an oxime comprising reducible silver ions in an amount of at least 2 weight %, (b) a silver ion photoreducing composition in an amount of at least 1 weight %, and (c) a photocurable component, a non-curable polymer, or a combination of a photocurable component and a non-curable polymer. This non-aqueous metal catalytic composition can be used to form silver metal particles in situ during suitable reducing conditions. The silver metal can be provided in a suitable layer or pattern on a substrate, which can then be subsequently subjected to electroless plating to form electrically-conductive layers or patterns for use in various articles or as touch screen displays in electronic devices.

Abstract translation: 非水性金属催化剂组合物包括（a）含有至少2重量％量的可还原银离子的银和肟的配合物，（b）至少1重量％的银离子光还原组合物， 和（c）可光固化组分，不可固化聚合物，或光固化性组分和不可固化聚合物的组合。 该非水金属催化剂组合物可用于在合适的还原条件下原位形成银金属颗粒。 银金属可以以合适的层或图案提供在基底上，然后可随后对其进行化学镀以形成用于各种制品的导电层或图案或用作电子设备中的触摸屏显示器。

公开(公告)号：US20160198569A1

公开(公告)日：2016-07-07

申请号：US14912005

申请日：2015-04-16

Applicant: LG CHEM, LTD.

Inventor： Shin Hee Jun ,  Jae Hyun Kim ,  Cheol-Hee Park ,  Chee-Sung Park ,  Jae Jin Kim ,  Han Nah Jeong ,  Eun Kyu Seong ,  Su Jeong Lee

IPC: H05K1/02 ,  H05K1/03 ,  C09D5/24 ,  H05K3/18

CPC classification number: H05K1/0296 ,  C09D5/24 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/405 ,  H05K1/0373 ,  H05K3/181 ,  C08K3/22 ,  C08L69/00

Abstract: The present invention relates to a composition for forming a conductive pattern capable of forming a fine conductive pattern reducing degradation of mechanical physical properties and having excellent adhesion strength, on a polymeric resin product or resin layer, a method for forming a conductive pattern using the same, and a resin component having the conductive pattern. The composition for forming a conductive pattern includes: a polycarbonate-based resin; and particles of a non-conductive metal compound including a first metal and a second metal and having a spinel structure, wherein the particles have a particle diameter of 0.1 to 6 μm; wherein a metal nuclei including the first metal, the second metal, or an ion thereof is formed from the particles of the non-conductive metal compound by electromagnetic wave irradiation. The non-conductive metal compound may have an average specific surface area of about 0.5 to 10 m2/g, preferably about 0.5 to 8 m2/g, more preferably about 0.7 to about 3 m2/g.

Abstract translation: 本发明涉及一种用于形成导电图案的组合物，其能够形成导电图案，从而降低机械物理性能降低并且对聚合树脂产品或树脂层具有优异的粘合强度，使用该组合物形成导电图案的方法 ，以及具有导电图案的树脂成分。 用于形成导电图案的组合物包括：聚碳酸酯基树脂; 以及包含第一金属和第二金属并具有尖晶石结构的非导电金属化合物的颗粒，其中所述颗粒具有0.1至6μm的粒径; 其中通过电磁波照射由非导电金属化合物的颗粒形成包括第一金属，第二金属或其离子的金属核。 非导电金属化合物的平均比表面积可以为约0.5至10m 2 / g，优选约0.5至8m 2 / g，更优选约0.7至约3m 2 / g。

公开(公告)号：US09375704B1

公开(公告)日：2016-06-28

申请号：US14571393

申请日：2014-12-16

Applicant: Deepak Shukla

Inventor： Deepak Shukla

IPC: C25D5/54 ,  G03F7/004 ,  B01J23/50 ,  C09D5/24 ,  B01J35/02 ,  C09D135/02 ,  C23C18/14

CPC classification number: B01J23/50 ,  B01J31/24 ,  B01J37/0219 ,  B01J37/345 ,  C09D4/00 ,  C09D135/02 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/182 ,  C23C18/1831 ,  C23C18/1868 ,  C23C18/1879 ,  C23C18/204 ,  C23C18/30 ,  H05K3/185 ,  H05K2203/107 ,  H05K2203/125 ,  C08F2222/102 ,  C08F2222/1033

Abstract: A non-aqueous metal catalytic composition includes (a) a silver carboxylate-trialkyl(triaryl)phosphite complex comprising reducible silver ions in an amount of at least 2 weight %, (b) a silver ion photoreducing composition in an amount of at least 1 weight %, and (c) a photocurable component or a non-curable polymer or a combination of a photocurable component and a non-curable polymer. This non-aqueous metal catalytic composition can be used to form silver metal particles in situ during suitable reducing conditions. The silver metal can be provided in a suitable layer or pattern on a substrate, which can then be subsequently subjected to electroless plating to form electrically-conductive layers or patterns for use in various articles or as touch screen displays in electronic devices.

Abstract translation: 非水性金属催化剂组合物包括（a）含有至少2重量％量的可还原银离子的羧酸银 - 三烷基（三芳基）亚磷酸酯络合物，（b）银离子光还原组合物的量至少为1 重量％，（c）可光固化成分或非固化性聚合物，或光固化性成分与不可固化聚合物的组合。 该非水金属催化剂组合物可用于在合适的还原条件下原位形成银金属颗粒。 银金属可以以合适的层或图案提供在基底上，然后可随后对其进行化学镀以形成用于各种制品的导电层或图案或用作电子设备中的触摸屏显示器。