公开(公告)号：US5137343A

公开(公告)日：1992-08-11

申请号：US688111

申请日：1991-04-19

申请人： Gerhard Kelch ,  Hans Lahres ,  Helmut Wietschorke

发明人： Gerhard Kelch ,  Hans Lahres ,  Helmut Wietschorke

IPC分类号： G02C7/06 ,  G02C7/02

CPC分类号： G02C7/063 ,  G02C7/061 ,  G02C7/065

摘要： The invention is directed to a multifocal surface for a multifocal lens which, for a short progression zone between a far-vision zone and near-vision zone, has a large usable width of this zone and the near-vision zone, and for which the maximum value, which the surface astigmatism reaches on the multifocal surface, is less than the 1.1 multiple of the surface increment. Such a multifocal surface is obtained when this surface is configured as twice continuously differentiable and satisfies a combination of six features which relate to the distribution of surface astigmatism and mean surface refractive power across the multifocal surface.

摘要翻译： 本发明涉及一种用于多焦点透镜的多焦点表面，对于远视区域和近视区域之间的短进展区域，该多焦点透镜具有该区域和近视区域的大的可用宽度， 表面散光达到多焦点表面的最大值小于表面增量的1.1倍。 当该表面被构造为可连续两次并且满足涉及多焦点表面上的表面散光分布和平均表面屈光力的六个特征的组合时，获得这样的多焦点表面。

公开(公告)号：US09151809B2

公开(公告)日：2015-10-06

申请号：US13249301

申请日：2011-09-30

申请人： Berthold Astegher ,  Helmut Wietschorke

发明人： Berthold Astegher ,  Helmut Wietschorke

IPC分类号： G01R33/06 ,  G01R33/07

CPC分类号： G01R33/07 ,  A61B2090/0818 ,  G01R33/093

摘要： In various embodiments, a Hall sensor arrangement for the redundant measurement of a magnetic field may include a first Hall sensor on a top side of a first semiconductor substrate; a second Hall sensor on a top side of a second semiconductor substrate; a carrier having a top side and an underside; wherein the first Hall sensor is arranged on the top side of the carrier and the second Hall sensor is arranged on the underside of the carrier; and wherein the measuring area of the first Hall sensor projected perpendicularly onto the carrier at least partly overlaps the measuring area of the second Hall sensor projected perpendicularly onto the carrier.

摘要翻译： 在各种实施例中，用于磁场的冗余测量的霍尔传感器装置可以包括在第一半导体衬底的顶侧上的第一霍尔传感器; 在第二半导体衬底的顶侧上的第二霍尔传感器; 具有顶侧和下侧的载体; 其中所述第一霍尔传感器布置在所述载体的顶侧上，并且所述第二霍尔传感器布置在所述载体的下侧上; 并且其中垂直地投影到载体上的第一霍尔传感器的测量区域至少部分地与垂直投影到载体上的第二霍尔传感器的测量区域重叠。

公开(公告)号：US08205987B2

公开(公告)日：2012-06-26

申请号：US12763716

申请日：2010-04-20

申请人： Darryl Meister ,  Timo Kratzer ,  Jesús Miguel Cabeza Guillén ,  Ray Steven Spratt ,  Markus Welscher ,  Gerhard Kelch ,  Helmut Wietschorke

发明人： Darryl Meister ,  Timo Kratzer ,  Jesús Miguel Cabeza Guillén ,  Ray Steven Spratt ,  Markus Welscher ,  Gerhard Kelch ,  Helmut Wietschorke

IPC分类号： G02C7/02

CPC分类号： G02C7/061 ,  G02C7/024 ,  G02C7/025 ,  G02C2202/22

摘要： The current invention is directed to a method for designing an ophthalmic lens element, the method comprising the steps of determining a wavefront aberration of an eye in a reference plane, wherein the wavefront aberration of the eye can be described by a first series of polynomials of ascending order up to a first specific order and corresponding first coefficients; determining a first vision correction of a second specific order; determining at least one specific point over an aperture of the adapted ophthalmic lens element; determining a high-order wavefront aberration in the reference plane for each specified point of the adapted ophthalmic lens element, wherein the high-order wavefront aberration can be described by a third series of polynomials of ascending order above the second specific order up to and including the first specific order and corresponding third coefficients; and determining a second vision correction of the second specific order.

摘要翻译： 本发明涉及一种用于设计眼科镜片元件的方法，该方法包括以下步骤：确定眼睛在参考平面中的波前像差，其中眼睛的波前像差可以通过第一系列多项式来描述 升序到第一特定顺序和对应的第一系数; 确定第二特定顺序的第一视力矫正; 确定经过适配的眼科镜片元件的孔的至少一个特定点; 为所述适合的眼科镜片元件的每个特定点确定所述参考平面中的高阶波前像差，其中所述高阶波前像差可以通过高于所述第二特定顺序的升序的第三系列多项式来描述，并且包括 第一个具体顺序和相应的第三个系数; 以及确定所述第二特定顺序的第二视力校正。

公开(公告)号：US20080308886A1

公开(公告)日：2008-12-18

申请号：US11763472

申请日：2007-06-15

申请人： Udo Ausserlechner ,  Siegfried Krainer ,  Helmut Wietschorke

发明人： Udo Ausserlechner ,  Siegfried Krainer ,  Helmut Wietschorke

IPC分类号： H01L29/82 ,  H01L43/00

CPC分类号： B81C1/00333 ,  B81C2203/0154 ,  B81C2203/032 ,  G01R15/207 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： This application relates to a semiconductor sensor comprising a carrier that comprises a first surface and a second surface; a sensor chip attached to the first surface; attachment means on the second surface; and mould material applied over the sensor chip and the attachment means.

摘要翻译： 本申请涉及一种包括载体的半导体传感器，该载体包括第一表面和第二表面; 附接到第一表面的传感器芯片; 附着装置在第二表面上; 以及施加在传感器芯片和附接装置上的模具材料。