摘要:
This application relates to a semiconductor sensor comprising a carrier that comprises a first surface and a second surface; a sensor chip attached to the first surface; attachment means on the second surface; and mould material applied over the sensor chip and the attachment means.
摘要:
Some aspects of the present disclosure provide for a sensor system having a large range between minimum and maximum allowed input quantities. In some embodiments, the sensor system has a nonlinear sensor and a linear sensor. The nonlinear sensor is generates a first nonlinear signal corresponding to a detected physical input quantity. The linear sensor generates a second linear signal corresponding to the detected physical input quantity. A signal processor receives the first nonlinear signal and the second linear signal and generates a composite output signal that corresponds to the detected physical input quantity. The composite output signal is a combination of the first nonlinear signal and the second linear signal that provides for a signal having a high sensitivity to small physical input quantities while avoiding saturation at large physical input quantities.
摘要:
Embodiments relate to magnetic field current sensors having sensor elements for sensing at least two magnetic field components, for example Bx and By. The current in a conductor is estimated by Bx and Bx/By, wherein Bx is the primary measurement and Bx/By is a corrective term used to account for position tolerances between the sensor and the conductor. In other embodiments, the corrective term can be dBx/By, where dBx is a difference in between components sensed at different sensor elements. The particular field components can vary in embodiments; for example, the current can be estimated by By and By/Bx, or dBy/Bx or some other arrangement.
摘要:
An electronic device includes a number of n Hall effect regions with n>1, wherein the n Hall effect regions are isolated from each other. The electronic device also includes at least eight contacts in or on surfaces of the n Hall effect regions, wherein the contacts include: a first and a second contact of each Hall effect region. A first contact of the (k+1)-th Hall effect region is connected to the second contact of the k-th Hall effect region for k=1 to n−1, and the first contact of the first Hall effect region is connected to the second contact of the n-th Hall effect region. The at least eight contacts include at least two supply contacts and at least two sense contacts. Each Hall effect region includes at most one of the at least two supply contacts and at most one of the at least two sense contacts.
摘要:
A vertical Hall sensor includes first and second vertical Hall effect regions in a semiconductor substrate, with first and second pluralities of contacts arranged at one side of the first or second vertical Hall effect regions, respectively. The second vertical Hall effect region is connected in series with the first vertical Hall effect region regarding a power supply. The vertical Hall sensor further includes first and second layers adjacent to the first and second vertical Hall effect regions at a side other than a side of the first or second pluralities of contacts. The first and second layers have different doping properties than the first and second vertical Hall effect regions and insulate the first and second vertical Hall effect regions from a bulk of the semiconductor substrate by at least one reverse-biased p-n junction per vertical Hall effect region during an operation of the vertical Hall sensor.
摘要:
A semiconductor chip package and a method to manufacture a semiconductor chip package are disclosed. An embodiment of the present invention comprises a substrate and a semiconductor chip disposed on the substrate and laterally surrounded by a packaging material. The package further comprises a current rail adjacent the semiconductor chip, the current rail isolated from the semiconductor chip by an isolation layer, a first external pad, and a via contact contacting the current rail with the first external pad.
摘要:
One embodiment of the present invention relates to a device, such as a sensor device. The device includes a sensor die and a circuit die. The sensor die includes a sensor and a feedback component. The circuit die includes circuitry. The circuit die is varied from the sensor die, such as comprising a varied substrate material. The circuitry is coupled to the sensor and the feedback component. The circuitry and the feedback component can communicate correlation information.
摘要:
An apparatus includes a sensor arrangement with a sensor chip. A magnetic field generator is configured to generate a secondary magnetic field opposing an external primary magnetic field at the sensor chip. The magnetic field generator protects the sensor arrangement against the external primary magnetic field.
摘要:
A magnetic-field sensor and a method of calibrating a magnetic-field sensor are disclosed. In one embodiment the method includes supplying the measurement arrangements with an excitation signal to generate a tappable measuring signal at each measurement tap of the measurement arrangements, detecting the measuring signals, evaluating the detected measuring signals by comparing the detected measuring signals with a comparison value, determining the measurement arrangement with a smallest difference, in terms of magnitude, between the detected measuring signals and the comparison value, and choosing the measurement arrangement with the smallest difference for a measurement operation of the magnetic-field sensor. The magnetic-field sensor includes a plurality of magnetoresistive sensor elements connected to form measurement arrangements each measurement arrangement including a measurement tap, wherein the magnetoresistive sensor elements are laterally distributed on a chip of the magnetic field sensor.
摘要:
A vertical Hall sensor circuit includes an arrangement comprising a vertical Hall effect region of a first doping type, formed within a semiconductor substrate and having a stress dependency with respect to a Hall effect-related electrical characteristic. The vertical Hall sensor circuit further includes a stress compensation circuit which comprises at least one of a lateral resistor arrangement and a vertical resistor arrangement for generating a stress-dependent lateral resistor arrangement signal based on a reference signal provided to the stress compensation circuit, and for generating a stress-dependent vertical resistor arrangement signal based on the reference signal, respectively. The vertical Hall sensor circuit further includes a first circuit for providing a first signal to the arrangement based on at least one of the stress-dependent lateral resistor arrangement signal and the stress-dependent vertical resistor arrangement signal.