公开(公告)号：US20150120216A1

公开(公告)日：2015-04-30

申请号：US14490408

申请日：2014-09-18

Applicant: KLA-Tencor Corporation

Inventor： Pradeep Vukkadala ,  Haiguang Chen ,  Jaydeep Sinha ,  Sathish Veeraraghavan

IPC: G01N19/08 ,  G01L1/00

CPC classification number: G01N19/08 ,  C23C14/54 ,  G01L1/00 ,  G01L5/0047 ,  G03F7/705 ,  G03F7/70633 ,  G03F7/70783 ,  H01L22/12 ,  H01L22/20

Abstract: Systems and methods for prediction and measurement of overlay errors are disclosed. Process-induced overlay errors may be predicted or measured utilizing film force based computational mechanics models. More specifically, information with respect to the distribution of film force is provided to a finite element (FE) model to provide more accurate point-by-point predictions in cases where complex stress patterns are present. Enhanced prediction and measurement of wafer geometry induced overlay errors are also disclosed.

Abstract translation: 公开了用于预测和测量重叠误差的系统和方法。 可以使用基于薄膜力的计算力学模型来预测或测量过程引起的重叠误差。 更具体地，关于膜力的分布的信息被提供给有限元（FE）模型，以在存在复应力模式的情况下提供更准确的逐点预测。 还公开了晶片几何感应重叠误差的增强预测和测量。