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公开(公告)号：US20100073859A1
公开(公告)日：2010-03-25
申请号：US12238316
申请日：2008-09-25
申请人： Richard Hung Minh Dinh , Wei Yao , Erik Wang
发明人： Richard Hung Minh Dinh , Wei Yao , Erik Wang
CPC分类号： H04M1/0266
摘要： Methods and apparatus for aligning a display stack with respect to a housing associated with a portable electronic device are disclosed. According to one aspect of the present invention, a chassis arrangement suitable for use in aligning a display stack with respect to a housing includes a first portion, a second portion, and a coupling arrangement. The first portion is configured to engage the display stack, and the second portion is configured to enable the display stack to be manipulated when the display stack is engaged by the first portion. The coupling arrangement couples the first portion with the second portion, and is configured to enable the second portion to be detached from the first portion.
摘要翻译： 公开了用于使显示器堆叠相对于与便携式电子设备相关联的壳体对准的方法和装置。 根据本发明的一个方面，一种适于用于将显示器叠层相对于壳体对准的底盘装置包括第一部分，第二部分和联接装置。 第一部分被配置为接合显示堆叠，并且第二部分被配置为使得当显示堆叠被第一部分接合时能够操纵显示堆栈。 联接装置将第一部分与第二部分相结合，并且构造成使第二部分能够从第一部分脱离。
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公开(公告)号：US20090266699A1
公开(公告)日：2009-10-29
申请号：US12150684
申请日：2008-04-29
CPC分类号： H05K3/323 , H01H13/48 , H01H13/7006 , H01H13/78 , H01H13/785 , H01H2201/024 , H01H2201/03 , H01H2203/038 , H01H2205/016 , H01H2207/008 , H01H2207/014 , H05K1/141 , H05K2201/10053
摘要： An electrical contact area on a printed circuit board (“PCB”), that would otherwise be subject to abrasion and possibly also corrosion, can be protected by covering it with another, more durable contact structure that is bonded to the first-mentioned contact area using an anistropic conductive adhesive (“ACA”). The more durable contact structure may include a member of PCB material or the like with electrically connected electrical contacts on its upper and lower surfaces. At least the upper one of these contacts (which is exposed for the service that involves possible abrasion and/or corrosion) may be given high durability by plating it with hard gold. The lower of these contacts is adhered to the main PCB via the above-mentioned ACA.
摘要翻译： 印刷电路板（“PCB”）上的电接触区域可以通过用另一种更耐用的接合结构来覆盖，该接触区域被粘合到首先提及的接触区域 使用不导电导电粘合剂（“ACA”）。 更耐用的接触结构可以包括在其上表面和下表面上具有电连接的电触点的PCB材料等的构件。 至少这些触点中的上部（为了可能的磨损和/或腐蚀而被暴露的服务）可以通过用硬金镀覆来获得高耐久性。 这些触点的下部通过上述ACA粘附到主PCB。
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公开(公告)号：US10180732B2
公开(公告)日：2019-01-15
申请号：US13605544
申请日：2012-09-06
IPC分类号： G06F3/041 , G06F3/0338 , G06F3/0362 , H01H25/04 , H01H3/02
摘要： An input device that includes both a movement detector, such as mechanical switch, and positional indicator, such as touch pad touch screen, and/or touch sensing housing is disclosed. These two input devices can be used substantially simultaneously to provide a command to the device. In this manner, different commands can be associated with depressing a moveable member in different areas and a single moveable member can perform like several buttons.
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公开(公告)号：US08989824B2
公开(公告)日：2015-03-24
申请号：US11824208
申请日：2007-06-28
申请人： Erik L. Wang , Tang Yew Tan , Adam Duckworth Mittleman , Richard Hung Minh Dinh , Philip Michael Hobson , Andrew Lewis Johnston
发明人： Erik L. Wang , Tang Yew Tan , Adam Duckworth Mittleman , Richard Hung Minh Dinh , Philip Michael Hobson , Andrew Lewis Johnston
IPC分类号： H04M1/00 , G06F3/0362 , G06F1/16
CPC分类号： G06F3/0362 , G06F1/1626 , G06F1/1656 , G06F1/1671 , G06F2200/1633
摘要： Electronic devices are provided with housings that can have smoother profiles and with switch assembly input components with knobs that can move along tracks in directions at least partially offset from the directions of anticipated resistive forces. The housings can include switch assembly input components with knobs that may move along linear tracks and switch assembly input components with knobs that may move along curved tracks.
摘要翻译： 电子设备设置有可以具有更平滑轮廓的外壳和具有旋钮的开关组件输入部件，该旋钮可以沿着至少部分地偏离预期阻力方向偏移的方向沿轨道移动。 壳体可以包括具有旋钮的开关组件输入部件，其可以沿着线性轨道移动，并且开关组件输入部件具有可沿弯曲轨道移动的旋钮。
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公开(公告)号：US08965449B2
公开(公告)日：2015-02-24
申请号：US13082118
申请日：2011-04-07
CPC分类号： G06F1/1656 , G06F1/1684 , G06F21/32 , G06F21/83 , G06F2221/2101 , H04L63/0861 , H04W12/06
摘要： Systems, methods, and devices are disclosed for applying concealment of components of an electronic device. In one embodiment, an electronic device may include a component that is disposed behind a window configured to selectively become transparent or opaque, such as a polymer-dispersed liquid crystal (PLDC) window. The component includes an image capture device, a strobe flash, a biometric sensor, a light sensor, a proximity sensor, or a solar panel, or a combination thereof. Additionally, the electronic device includes data processing circuitry configured to determine when an event requesting that the component be exposed occurs. Furthermore, the electronic device includes a window controller that may control the window to become transparent, to expose the component upon the occurrence of the event requesting that the component be exposed.
摘要翻译： 公开了用于应用电子设备的组件的隐藏的系统，方法和设备。 在一个实施例中，电子设备可以包括配置在选择性地变得透明或不透明的窗口后面的组件，例如聚合物分散液晶（PLDC）窗口。 该组件包括图像捕获装置，闪光灯闪光灯，生物测定传感器，光传感器，接近传感器或太阳能电池板，或其组合。 另外，电子设备包括数据处理电路，配置为确定何时发生请求暴露组件的事件。 此外，电子设备包括可以控制窗口变得透明的窗口控制器，以在事件发生时暴露组件以请求组件被暴露。
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公开(公告)号：US08879266B2
公开(公告)日：2014-11-04
申请号：US13480458
申请日：2012-05-24
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F1/182 , H05K1/0207 , H05K3/30 , H05K2201/0338
摘要： Electronic devices having a multi-layer structure that provides enhanced conductivity (thermal and/or electrical conductivity) are disclosed. The multi-layer structure can have a plurality of adjacent layers. At least one layer can primarily provide structural rigidity, and at least another layer can primarily provide enhanced conductivity. The layer of high conductivity can serve to provide the electronic device with greater ability to disperse generated heat and/or to provide an accessible voltage potential (e.g., ground plane). Advantageously, the multi-layer structure can provide enhanced conductivity using an otherwise required structural component and without necessitating an increase in thickness.
摘要翻译： 公开了具有提供增强的导电性（热和/或导电性）的多层结构的电子器件。 多层结构可以具有多个相邻的层。 至少一层可以主要提供结构刚性，并且至少另一层可主要提供增强的导电性。 高导电性层可用于为电子器件提供更大的分散产生的热量和/或提供可接近的电压电位（例如接地平面）的能力。 有利地，多层结构可以使用另外需要的结构部件提供增强的导电性，而不需要增加厚度。
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公开(公告)号：US08610822B2
公开(公告)日：2013-12-17
申请号：US12794664
申请日：2010-06-04
申请人： Trent Weber , Scott Myers , David A. Pakula , Matthew Hill , Erik L. Wang , Richard Hung Minh Dinh
发明人： Trent Weber , Scott Myers , David A. Pakula , Matthew Hill , Erik L. Wang , Richard Hung Minh Dinh
IPC分类号： H04N5/225
CPC分类号： G03B17/02 , B23K26/351 , H04N5/2251
摘要： An electronic device may be provided with a housing. A camera module may be mounted within the housing. The housing may have a camera window with which a lens in the camera module is aligned. To rotationally and laterally align the camera module with respect to the camera window and the electronic device housing, an alignment structure may be mounted to the housing in alignment with the camera window and housing. The alignment structure may be formed form a ring-shaped structure with an opening. The alignment structures may have sidewalls that form an alignment groove for the camera module. The camera window may be formed from a circular opening in a layer of opaque material deposited on a transparent housing member such as a planar layer of glass. During the process, a laser tool may be used to trim the opening in the opaque material.
摘要翻译： 电子设备可以设置有壳体。 相机模块可以安装在壳体内。 外壳可以具有相机窗口，照相机模块中的透镜与其对准。 为了相对于照相机窗口和电子设备外壳旋转和横向对准照相机模块，对准结构可以安装到壳体上，与摄像机窗口和外壳对准。 对准结构可以形成为具有开口的环形结构。 对准结构可以具有形成相机模块的对准凹槽的侧壁。 相机窗口可以由沉积在诸如平面玻璃层的透明外壳构件上的不透明材料层中的圆形开口形成。 在该过程中，可以使用激光工具来修整不透明材料中的开口。
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公开(公告)号：US20130314875A1
公开(公告)日：2013-11-28
申请号：US13480458
申请日：2012-05-24
CPC分类号： G06F1/20 , G06F1/182 , H05K1/0207 , H05K3/30 , H05K2201/0338
摘要： Electronic devices having a multi-layer structure that provides enhanced conductivity (thermal and/or electrical conductivity) are disclosed. The multi-layer structure can have a plurality of adjacent layers. At least one layer can primarily provide structural rigidity, and at least another layer can primarily provide enhanced conductivity. The layer of high conductivity can serve to provide the electronic device with greater ability to disperse generated heat and/or to provide an accessible voltage potential (e.g., ground plane). Advantageously, the multi-layer structure can provide enhanced conductivity using an otherwise required structural component and without necessitating an increase in thickness.
摘要翻译： 公开了具有提供增强的导电性（热和/或导电性）的多层结构的电子器件。 多层结构可以具有多个相邻的层。 至少一层可以主要提供结构刚性，并且至少另一层可主要提供增强的导电性。 高导电性层可用于为电子器件提供更大的分散产生的热量和/或提供可接近的电压电位（例如接地平面）的能力。 有利地，多层结构可以使用另外需要的结构部件提供增强的导电性，而不需要增加厚度。
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公开(公告)号：US08532722B2
公开(公告)日：2013-09-10
申请号：US12814034
申请日：2010-06-11
IPC分类号： H04M1/00
CPC分类号： H04M1/0274 , H04M2250/12
摘要： Systems and methods are provided for media devices including a housing, a frame disposed adjacent to the housing, a support panel that is integrated with the frame, and a flexible circuit that is disposed adjacent to the support panel such that the support panel provides support for the flexible circuit.
摘要翻译： 提供了用于媒体设备的系统和方法，包括壳体，邻近壳体设置的框架，与框架一体化的支撑面板以及与支撑面板相邻设置的柔性电路，使得支撑面板为 灵活电路。
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公开(公告)号：US20130077282A1
公开(公告)日：2013-03-28
申请号：US13607567
申请日：2012-09-07
CPC分类号： H05K9/003 , G06F1/1656 , H05K9/0032 , H05K13/04 , Y10T29/4913
摘要： Electronic devices having integrated thermal and EMI shields for providing thermal dissipation and EMI shielding of one or more circuitry components, and methods for making the same, are provided. The integrated shield combines both thermal and EMI shielding properties into a single layer material that saves space within the electronic device. The integrated shield can be constructed from a silicon material having one or more EMI shielding additives incorporated therein.
摘要翻译： 提供具有用于提供一个或多个电路部件的散热和EMI屏蔽的集成热和EMI屏蔽的电子设备及其制造方法。 集成屏蔽将热屏蔽和EMI屏蔽特性组合成单层材料，从而节省电子设备的空间。 集成屏蔽可以由其中结合有一个或多个EMI屏蔽添加剂的硅材料构成。
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