Abstract:
A display module having an improved heatsink effect may include a display panel reproducing an image, a chassis supporting the display panel, a driving circuit board disposed on a surface of the chassis opposite to the display panel to generate an electrical signal for driving the display panel, the driving circuit board including at least one heat emissive circuit element, a first heatsink disposed on the heat emissive circuit element and a second heatsink disposed on the chassis. The first heatsink and the second heatsink may be thermally connected by a foldable connecting member.
Abstract:
A plasma display apparatus including: a plasma display panel; a non-conductive chassis disposed on a rear portion of the plasma display panel to support the plasma display panel; a circuit unit disposed on a rear portion of the chassis to drive the plasma display panel; and a conductive member disposed between the plasma display panel and the chassis, having at least a part that is slit and protruded toward the chassis. In addition, the circuit unit includes a grounding portion having a grounding voltage and the grounding portion is electrically connected to the protruding portion of the conductive member.
Abstract:
A plasma display module includes a plasma display panel displaying images using a gas discharge phenomenon, and a color temperature compensation filter in a viewing path of the plasma display panel, the color temperature compensation filter having at least one transparent region, e.g., a hole, in the viewing path.
Abstract:
A heat dissipating apparatus for an IC chip, having a structure capable of effectively dissipating heat created by an IC chip to the outside, and a display module including the same are disclosed. In one embodiment, the display module includes a panel that forms an image, a chassis disposed at the rear of the panel to support the panel, at least one IC chip that emits heat mounted on at least one circuit board installed at the rear of the chassis, and a heat dissipating apparatus that dissipates heat emitted by the IC chip to the outside. The heat dissipating apparatus is attached to contact the IC chip, and has a heat conducting chip contact plate, and a heat conducting heat discharging plate formed in one piece with a plurality of mutually proximal joining portions joined to the chip contact plate, and a plurality of heat dissipating portions bent to protrude outward from the joining portions to connect the joining portions.
Abstract:
A touch screen plasma display includes: a Plasma Display Panel (PDP) adapted to display images by a gas discharge, and including a front substrate, front electrodes extending in a predetermined direction on a rear portion of the front substrate, a rear substrate facing the front substrate, rear electrodes extending in a direction crossing the front electrodes on a front portion of the rear substrate, barrier ribs arranged between the front substrate and the rear substrate to define discharge spaces where the front and rear electrodes are commonly disposed, phosphor layers arranged in the discharge spaces, and a discharge gas contained within the discharge spaces; an image displaying circuit unit adapted to supply driving control signals to the front electrodes and the rear electrodes to cause the PDP to display the images; and a position detecting circuit unit adapted to communicate with the image displaying circuit unit, to detect position information signals from the front and rear electrodes generating induced currents by an electronic pen that changes a magnetic flux, to process the signals into a position coordinate signal of the electronic pen, and to transmit the position coordinate signal to the image displaying circuit unit.
Abstract:
A heat dissipation structure of an intelligent power module includes a chassis base, a drive circuit board arranged on the chassis base, an intelligent power module arranged at a side of the drive circuit board, the intelligent power module comprising a plurality of circuit devices, a first heat dissipater having one surface contacting a surface of the intelligent power module, the first heat dissipater being adapted to dissipate heat generated by operation of the plurality of circuit devices, and a second heat dissipater having one side arranged in contact with another surface of the first heat dissipater and another side arranged to contact a surface of the chassis base.
Abstract:
A backlight assembly includes a first light guide plate, a second light guide plate, a light source part and a cover part. The second light guide plate is spaced apart from the first light guide plate. The light source part includes a first light source providing light to the first light guide plate and a second light source providing light to the second light guide plate. The cover part is disposed over the light source part. The cover part overlaps with a portion of the first light guide plate and a portion of the second light guide plate. A display apparatus having the above configuration has a narrow bezel and a thin profile.
Abstract:
A backlight assembly includes a first light guide plate, a second light guide plate, a light source part and a cover part. The second light guide plate is spaced apart from the first light guide plate. The light source part includes a first light source providing light to the first light guide plate and a second light source providing light to the second light guide plate. The cover part is disposed over the light source part. The cover part overlaps with a portion of the first light guide plate and a portion of the second light guide plate. A display apparatus having the above configuration has a narrow bezel and a thin profile.
Abstract:
Provided is a backlight unit within a liquid crystal display (LCD) device where the backlight unit includes one or more light-emitting diodes (LEDs) mounted on a printed circuit board (PCB). Positioning of the PCB and its LEDs is provided by a PCB fixing member which includes a base portion and a support portion extending upward from a surface of the base portion. The PCB fixing member is structured to transfer heat energy away from the PCB and to an attached portion of the LCD device such as to a lower housing which houses the PCB and the PCB fixing member. The PCB fixing member includes a press-fit insertion groove into which at least part of the PCB can be easily inserted, thus simplifying manufacturing while assuring appropriate heat dissipation.
Abstract:
A plasma display apparatus that includes a plasma display panel adapted to display an image, a chassis base arranged at a rear of the plasma display panel, a circuit unit arranged on the chassis base and adapted to drive the plasma display panel and a heat dissipation unit arranged between the plasma display panel and the chassis base, the heat dissipation unit comprising a first heat dissipation element comprised of a material that produces debris, a first heat dissipation element arranged parallel to both the plasma display panel and the chassis base and adapted to dissipate heat generated by the plasma display panel and a second heat dissipation element covering at least a portion of the first heat dissipation element and being adapted to prevent debris from being released from the first heat dissipation element.