公开(公告)号：US20210337632A1

公开(公告)日：2021-10-28

申请号：US17270817

申请日：2019-08-27

Applicant: LINTEC CORPORATION

Inventor： Masaharu ITO ,  Takashi MORIOKA ,  Yoshiaki HAGIHARA

IPC: H05B3/34 ,  H05B3/54 ,  H05B3/14

Abstract: A sheet-shaped conductive member includes a pseudo sheet structure having a plurality of conductive linear bodies arranged to be spaced from each other, in which the sheet-shaped conductive member has stretchability, and a minimum interval between the conductive linear bodies is 50 μm or more.

公开(公告)号：US20190136094A1

公开(公告)日：2019-05-09

申请号：US16096610

申请日：2017-04-28

Applicant: LINTEC CORPORATION ,  LINTEC OF AMERICA, INC.

Inventor： Takahiro UEDA ,  Masaharu ITO ,  Kanzan INOUE

IPC: C09J7/29 ,  C01B32/168 ,  C09J7/38 ,  C09J9/02

Abstract: L1 is a maximum distance across a non-contacting section between intersection points of a straight line crossing the non-contacting section in parallel with an alignment direction of a carbon nanotubes in a plan view of a mounting section with a border between the non-contacting section and a contacting section. L2 is a maximum distance across the non-contacting section between intersection points of a straight line crossing the non-contacting section and intersecting the alignment direction of the carbon nanotubes in the plan view of the mounting section with the border between the non-contacting section and the contacting section. When L1 is larger than L2, at least L2 is more than 0 mm and less than 10 mm. When smaller, at least L1 is more than 0 mm and less than 10 mm. When equal, L1 and L2 are each more than 0 mm and less than 10 mm.

公开(公告)号：US20150357225A1

公开(公告)日：2015-12-10

申请号：US14760220

申请日：2013-03-04

Applicant: LINTEC CORPORATION

Inventor： Naoki TAYA ,  Masashi UEDA ,  Masaharu ITO

IPC: H01L21/683 ,  C09J7/02 ,  C08L23/06

CPC classification number: H01L21/6836 ,  C08L23/06 ,  C09J7/243 ,  C09J7/29 ,  C09J2201/162 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2423/046 ,  C09J2433/006 ,  H01L21/68 ,  H01L2221/68327 ,  Y10T428/28 ,  Y10T428/31938

Abstract: A base film for a dicing sheet is provided which can suppress dicing debris from generating during the dicing of a cut object in the full-cut dicing without imparting physical energy, such as electron beam or γ ray, and which has an enhanced expanding property in the expanding process. The base film for a dicing sheet comprises a resin layer that contains a polyethylene and an ethylene-tetracyclododecene copolymer. A dicing sheet that comprises the base film for a dicing sheet is also provided.

Abstract translation: 提供了一种用于切割片的基膜，其能够抑制在全切割切割中的切割物体的切割期间产生的切割屑，而不会施加诸如电子束或γ射线的物理能量，并且其具有增强的膨胀性能 扩大的过程。 用于切割片的基膜包括含有聚乙烯和乙烯 - 四环十二碳烯共聚物的树脂层。 还提供了包括用于切割片的基底膜的切割片。

公开(公告)号：US20150348820A1

公开(公告)日：2015-12-03

申请号：US14654967

申请日：2013-10-09

Applicant: LINTEC CORPORATION

Inventor： Naoki TAYA ,  Masashi UEDA ,  Masaharu ITO

IPC: H01L21/683 ,  B32B27/30 ,  B32B27/32 ,  C08J5/18 ,  B32B27/08

CPC classification number: H01L21/6836 ,  B32B27/08 ,  B32B27/308 ,  B32B27/32 ,  B32B2405/00 ,  C08J5/18 ,  C08J2309/06 ,  C08J2323/06 ,  C09J7/29 ,  C09J2201/162 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2423/046 ,  C09J2425/006 ,  C09J2433/006 ,  H01L21/683 ,  Y10T428/31913

Abstract: A dicing sheet base film includes a resin layer (A). The resin layer (A) contains: a polyethylene (a1) that has a density of 0.900 g/cm3 or more; and a styrene-based elastomer (a2). The polyethylene (a1) has a content of 50 mass % or more and 90 mass % or less to a total resin component contained in the resin layer (A), while the styrene-based elastomer (a2) has a content of 10 mass % or more and 50 mass % or less to the total resin component. The dicing sheet base film suppresses the occurrence of dicing debris during the dicing of a cut object without imparting physical energy such as electron rays and γ rays, and has sufficient expandability in the expanding process.

Abstract translation: 切割片基膜包括树脂层（A）。 树脂层（A）含有：密度为0.900g / cm 3以上的聚乙烯（a1） 和苯乙烯系弹性体（a2）。 聚乙烯（a1）相对于树脂层（A）中含有的树脂成分总含量为50质量％以上90质量％以下，苯乙烯系弹性体（a2）的含量为10质量％ 以上且50质量％以下。 切割片基膜在切割物体切割时抑制切割碎屑的发生，而不会施加诸如电子射线和γ射线的物理能量，并且在膨胀过程中具有充分的可扩展性。