DICING SHEET BASE FILM AND DICING SHEET
    3.
    发明申请
    DICING SHEET BASE FILM AND DICING SHEET 审中-公开
    电工电路板及电路图

    公开(公告)号:US20150348820A1

    公开(公告)日:2015-12-03

    申请号:US14654967

    申请日:2013-10-09

    Abstract: A dicing sheet base film includes a resin layer (A). The resin layer (A) contains: a polyethylene (a1) that has a density of 0.900 g/cm3 or more; and a styrene-based elastomer (a2). The polyethylene (a1) has a content of 50 mass % or more and 90 mass % or less to a total resin component contained in the resin layer (A), while the styrene-based elastomer (a2) has a content of 10 mass % or more and 50 mass % or less to the total resin component. The dicing sheet base film suppresses the occurrence of dicing debris during the dicing of a cut object without imparting physical energy such as electron rays and γ rays, and has sufficient expandability in the expanding process.

    Abstract translation: 切割片基膜包括树脂层(A)。 树脂层(A)含有:密度为0.900g / cm 3以上的聚乙烯(a1) 和苯乙烯系弹性体(a2)。 聚乙烯(a1)相对于树脂层(A)中含有的树脂成分总含量为50质量%以上90质量%以下,苯乙烯系弹性体(a2)的含量为10质量% 以上且50质量%以下。 切割片基膜在切割物体切割时抑制切割碎屑的发生,而不会施加诸如电子射线和γ射线的物理能量,并且在膨胀过程中具有充分的可扩展性。

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