公开(公告)号：US20210036396A1

公开(公告)日：2021-02-04

申请号：US16941862

申请日：2020-07-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kenta SEKI ,  Yasushi SHIGENO ,  Daisuke TOKUDA ,  Ryangsu KIM ,  Katsuya SHIMIZU ,  Kazuhito OSAWA

IPC: H01P5/18

Abstract: A directional coupler includes a main line, a first sub-line to be electromagnetically coupled to the main line, a second sub-line to be electromagnetically coupled to the main line, and a coupling terminal configured to output a detection signal corresponding to a radio frequency signal that is transmitted through the main line, the first sub-line and the second sub-line are different in length from each other, and connection between the first sub-line and the coupling terminal and connection between the second sub-line and the coupling terminal are switched.

公开(公告)号：US20210036395A1

公开(公告)日：2021-02-04

申请号：US16941577

申请日：2020-07-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kenta SEKI ,  Yasushi SHIGENO ,  Daisuke TOKUDA ,  Ryangsu KIM ,  Katsuya SHIMIZU ,  Kazuhito OSAWA

IPC: H01P5/18 ,  H04B1/04 ,  H01G4/40 ,  H03H7/01

Abstract: A directional coupler includes a main line through which a signal is transmitted, first and second sub-lines that are selectively coupled to the main line, and a common output port that outputs a detection signal generated by the signal transmitted through the main line, wherein a first degree of coupling between the main line and the first sub-line is different than a second degree of coupling between the main line and the second sub-line.

公开(公告)号：US20190333887A1

公开(公告)日：2019-10-31

申请号：US16505390

申请日：2019-07-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasunari UMEMOTO ,  Daisuke TOKUDA ,  Tsunekazu SAIMEI ,  Hiroaki TOKUYA

IPC: H01L23/00 ,  H01L29/205 ,  H01L29/732 ,  H01L29/737 ,  H01L29/66 ,  H01L29/20 ,  H01L29/08 ,  H01L29/06 ,  H01L29/417

Abstract: A semiconductor device that includes a bipolar transistor, wherein a third opening, through which a pillar bump and a second wiring line, which is electrically connected to an emitter layer, contact each other, is shifted in a longitudinal direction of the emitter layer away from a position at which the third opening would be directly above the emitter layer. The third opening is arranged, with respect to the emitter layer, such that an end portion of the emitter layer in the longitudinal direction of the emitter layer and the edge of the opening of the third opening are substantially aligned with each other.

公开(公告)号：US20150070107A1

公开(公告)日：2015-03-12

申请号：US14546115

申请日：2014-11-18

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Daisuke TOKUDA

IPC: H03H9/205 ,  H03H9/25

CPC classification number: H03H9/0547 ,  H03H7/0115 ,  H03H7/1708 ,  H03H7/1791 ,  H03H9/0222 ,  H03H9/205 ,  H03H9/25 ,  H03H9/542

Abstract: Provided is a high frequency module capable of reducing size and cost. A high frequency module includes an LC filter having an inductor formed through a thin film process and a capacitor also formed through a thin film process, and a piezoelectric resonator that is connected in series to the LC filter and serves as a trap filter having a resonant frequency at the outside of a passing band of the LC filter.

Abstract translation: 提供了能够减小尺寸和成本的高频模块。 高频模块包括具有通过薄膜工艺形成的电感器和还通过薄膜工艺形成的电容器的LC滤波器，以及与LC滤波器串联连接并用作具有共振的陷波滤波器的压电谐振器 频率在LC滤波器的通带的外侧。