System for search and analysis of systematic defects in integrated circuits
    23.
    发明授权
    System for search and analysis of systematic defects in integrated circuits 有权
    集成电路系统缺陷的搜索和分析系统

    公开(公告)号:US07415695B2

    公开(公告)日:2008-08-19

    申请号:US11748575

    申请日:2007-05-15

    IPC分类号: G06F17/50

    CPC分类号: G06T7/001 G06T2207/30148

    摘要: Disclosed is a method of locating systematic defects in integrated circuits. The invention first performs a preliminary extracting and index processing of the circuit design and then performs feature searching. When performing the preliminary extracting and index processing the invention establishes a window grid for the circuit design and merges basis patterns with shapes in the circuit design within each window of the window grid. The invention transforms shapes in a each window into feature vectors by finding intersections between the basis patterns and the shapes in the windows. Then, the invention clusters the feature vectors to produce an index of feature vectors. After performing the extracting and index processing, the invention performs the process of feature searching by first identifying a defect region window of the circuit layout and similarly merging basis patterns with shapes in the defect region window. This merging process can include rotating and mirroring the shapes in the defect region. The invention similarly transforms shapes in the defect region window into defect vectors by finding intersections between basis patterns and the shapes in the defect region. Then, the invention can easily find feature vectors that are similar to the defect vector using, for example, representative feature vectors from the index of feature vectors. Then, the similarities and differences between the defect vectors and the feature vectors can be analyzed.

    摘要翻译: 公开了一种定位集成电路系统缺陷的方法。 本发明首先进行电路设计的初步提取和索引处理,然后执行特征搜索。 当执行初步提取和索引处理时,本发明建立了用于电路设计的窗口网格,并且将窗体网格的每个窗口内的电路设计中的形状与基本图案合并。 本发明通过在窗口中找到基本图案和形状之间的交点来将每个窗口中的形状转换为特征向量。 然后,本发明聚集特征向量以产生特征向量的索引。 在执行提取和索引处理之后,本发明通过首先识别电路布局的缺陷区域窗口并且将基本模式与缺陷区域窗口中的形状类似地合并来执行特征搜索的处理。 该合并过程可以包括旋转和镜像缺陷区域中的形状。 本发明类似地通过在缺陷区域中找到基础图案和形状之间的交点来将缺陷区域窗口中的形状转换为缺陷向量。 然后,本发明可以使用例如来自特征向量的索引的代表性特征向量容易地找到与缺陷向量相似的特征向量。 然后,可以分析缺陷向量和特征向量之间的相似性和差异。

    Multilayer OPC for design aware manufacturing
    24.
    发明授权
    Multilayer OPC for design aware manufacturing 有权
    多层OPC用于设计感知制造

    公开(公告)号:US08214770B2

    公开(公告)日:2012-07-03

    申请号:US12357648

    申请日:2009-01-22

    IPC分类号: G06F17/50

    CPC分类号: G03F1/36

    摘要: A method is provided for designing a mask layout for an integrated circuit that ensures proper functional interaction among circuit features by including functional inter-layer and intra-layer constraints on the wafer. The functional constraints used according to the present invention are applied among the simulated wafer images to ensure proper functional interaction, while relaxing or eliminating the EPE constraints on the location of the wafer images.

    摘要翻译: 提供了一种用于设计用于集成电路的掩模布局的方法,其通过在晶片上包括功能层间和层内约束来确保电路特征之间的适当的功能交互。 根据本发明使用的功能约束应用于模拟晶片图像中,以确保正确的功能交互,同时放松或消除对晶片图像的位置的EPE约束。

    FAST AND ACCURATE METHOD TO SIMULATE INTERMEDIATE RANGE FLARE EFFECTS
    25.
    发明申请
    FAST AND ACCURATE METHOD TO SIMULATE INTERMEDIATE RANGE FLARE EFFECTS 有权
    快速和准确的方法来模拟中间范围的瓦斯效应

    公开(公告)号:US20100175043A1

    公开(公告)日:2010-07-08

    申请号:US12349108

    申请日:2009-01-06

    IPC分类号: G06F17/50

    CPC分类号: G03F1/36 G03F1/70

    摘要: A method is provided for modeling lithographic processes in the design of photomasks for the manufacture of semiconductor integrated circuits, and more particularly for simulating intermediate range flare effects. For a region of influence (ROI) from first ROI1 of about 5λ/NA to distance ROI2 when the point spread function has a slope that is slowly varying according to a predetermined criterion, then mask shapes at least within the distance range from ROI1 to ROI2 are smoothed prior to computing the SOCS convolutions. The method provides a fast method for simulating intermediate range flare effects with sufficient accuracy.

    摘要翻译: 提供了一种用于在用于制造半导体集成电路的光掩模的设计中对光刻工艺进行建模的方法,更具体地说,用于模拟中间范围闪光效应。 对于当点扩散函数具有根据预定标准缓慢变化的斜率时,从约5λ/ NA的第一ROI1到距离ROI2的影响区域(ROI),则至少在从ROI1到ROI2的距离范围内的掩模形状 在计算SOCS卷积之前进行平滑处理。 该方法提供了一种用于以足够的精度模拟中等范围闪光效果的快速方法。

    Fast and accurate method to simulate intermediate range flare effects
    26.
    发明授权
    Fast and accurate method to simulate intermediate range flare effects 有权
    快速准确的模拟中程​​火炬效果的方法

    公开(公告)号:US08161422B2

    公开(公告)日:2012-04-17

    申请号:US12349108

    申请日:2009-01-06

    IPC分类号: G06F17/50

    CPC分类号: G03F1/36 G03F1/70

    摘要: A method is provided for modeling lithographic processes in the design of photomasks for the manufacture of semiconductor integrated circuits, and more particularly for simulating intermediate range flare effects. For a region of influence (ROI) from first ROI1 of about 5λ/NA to distance ROI2 when the point spread function has a slope that is slowly varying according to a predetermined criterion, then mask shapes at least within the distance range from ROI1 to ROI2 are smoothed prior to computing the SOCS convolutions. The method provides a fast method for simulating intermediate range flare effects with sufficient accuracy.

    摘要翻译: 提供了一种用于在用于制造半导体集成电路的光掩模的设计中对光刻工艺进行建模的方法,更具体地说,用于模拟中间范围闪光效应。 对于当点扩散函数具有根据预定标准缓慢变化的斜率时,从约5λ/ NA的第一ROI1到距离ROI2的影响区域(ROI),则至少在从ROI1到ROI2的距离范围内的掩模形状 在计算SOCS卷积之前进行平滑处理。 该方法提供了一种用于以足够的精度模拟中等范围闪光效果的快速方法。

    Verifying mask layout printability using simulation with adjustable accuracy
    27.
    发明授权
    Verifying mask layout printability using simulation with adjustable accuracy 失效
    使用可调精度的模拟验证面具布局的可印刷性

    公开(公告)号:US07565633B2

    公开(公告)日:2009-07-21

    申请号:US11619320

    申请日:2007-01-03

    IPC分类号: G06F17/50

    CPC分类号: G03F1/36

    摘要: A method, system and computer program product for verifying printability of a mask layout for a photolithographic process are disclosed. A simulation of the photolithographic process for the designed mask layout is simulated using a simplified version of the mask layout with a lower accuracy to generate a lower accuracy simulated image. Where the lower accuracy simulated image is determined as potentially including an error, a further simulation of the designated portion of the mask layout with a higher accuracy will be performed.

    摘要翻译: 公开了一种用于验证光刻工艺的掩模布局的可印刷性的方法,系统和计算机程序产品。 使用精度较低的掩模布局的简化版本来模拟设计的掩模布局的光刻工艺的模拟,以产生较低精度的模拟图像。 在将低精度模拟图像确定为潜在地包括错误的情况下,将执行具有更高精度的掩模布局的指定部分的进一步模拟。

    MULTILAYER OPC FOR DESIGN AWARE MANUFACTURING
    28.
    发明申请
    MULTILAYER OPC FOR DESIGN AWARE MANUFACTURING 有权
    MULTILERER OPC FOR DESIGN AWARE MANUFACTURING

    公开(公告)号:US20090125868A1

    公开(公告)日:2009-05-14

    申请号:US12357648

    申请日:2009-01-22

    IPC分类号: G06F17/50

    CPC分类号: G03F1/36

    摘要: A method is provided for designing a mask layout for an integrated circuit that ensures proper functional interaction among circuit features by including functional inter-layer and intra-layer constraints on the wafer. The functional constraints used according to the present invention are applied among the simulated wafer images to ensure proper functional interaction, while relaxing or eliminating the EPE constraints on the location of the wafer images.

    摘要翻译: 提供了一种用于设计用于集成电路的掩模布局的方法,其通过在晶片上包括功能层间和层内约束来确保电路特征之间的适当的功能交互。 根据本发明使用的功能约束应用于模拟晶片图像中,以确保正确的功能交互,同时放松或消除对晶片图像的位置的EPE约束。

    Multilayer OPC for design aware manufacturing
    29.
    发明授权
    Multilayer OPC for design aware manufacturing 失效
    多层OPC用于设计感知制造

    公开(公告)号:US07503028B2

    公开(公告)日:2009-03-10

    申请号:US11306750

    申请日:2006-01-10

    IPC分类号: G06F17/50

    CPC分类号: G03F1/36

    摘要: A method is provided for designing a mask layout for an integrated circuit that ensures proper functional interaction among circuit features by including functional inter-layer and intra-layer constraints on the wafer. The functional constraints used according to the present invention are applied among the simulated wafer images to ensure proper functional interaction, while relaxing or eliminating the EPE constraints on the location of the wafer images.

    摘要翻译: 提供了一种用于设计用于集成电路的掩模布局的方法,其通过在晶片上包括功能层间和层内约束来确保电路特征之间的适当的功能交互。 根据本发明使用的功能约束应用于模拟晶片图像中,以确保正确的功能交互,同时放松或消除对晶片图像的位置的EPE约束。

    VERIFYING MASK LAYOUT PRINTABILITY USING SIMULATION WITH ADJUSTABLE ACCURACY
    30.
    发明申请
    VERIFYING MASK LAYOUT PRINTABILITY USING SIMULATION WITH ADJUSTABLE ACCURACY 失效
    使用可调整精度模拟验证掩模布局可打印性

    公开(公告)号:US20080163153A1

    公开(公告)日:2008-07-03

    申请号:US11619320

    申请日:2007-01-03

    IPC分类号: G06F17/50

    CPC分类号: G03F1/36

    摘要: A method, system and computer program product for verifying printability of a mask layout for a photolithographic process are disclosed. A simulation of the photolithographic process for the designed mask layout is simulated using a simplified version of the mask layout with a lower accuracy to generate a lower accuracy simulated image. Where the lower accuracy simulated image is determined as potentially including an error, a further simulation of the designated portion of the mask layout with a higher accuracy will be performed.

    摘要翻译: 公开了一种用于验证光刻工艺的掩模布局的可印刷性的方法,系统和计算机程序产品。 使用精度较低的掩模布局的简化版本来模拟设计的掩模布局的光刻工艺的模拟,以产生较低精度的模拟图像。 在将低精度模拟图像确定为潜在地包括错误的情况下,将执行具有更高精度的掩模布局的指定部分的进一步模拟。