Substrate processing method
    22.
    发明申请
    Substrate processing method 审中-公开
    基板加工方法

    公开(公告)号:US20060231124A1

    公开(公告)日:2006-10-19

    申请号:US11433616

    申请日:2006-05-15

    IPC分类号: B08B3/00

    摘要: Provided is a processing method capable of reliably processing the inside of a depression such as a trench, a contact hole, a deep pattern, or a pore of a porous substrate. A chemical solution M is supplied into a processing bath 1 placing a substrate W, and the processing bath 1 is repetitively evacuated and pressurized several times at a pressure lower than the atmospheric pressure. Alcohol X is brought into contact with the surface of the substrate W and supplied into a depression W−1. The chemical solution M is supplied into the processing bath 1 containing the substrate W until the chemical solution M reaches a water level at which the substrate W is dipped, thereby allowing the chemical solution M to enter the depression W−1. The chemical solution M is discharged from the processing bath 1, and a portion of the chemical solution M entering the depression W−1 and mixed with the alcohol X is evaporated by evacuating the processing bath 1. This process is repeated several times.

    摘要翻译: 提供了能够可靠地处理诸如沟槽,接触孔,深图案或多孔基材的孔的凹陷的内部的处理方法。 将化学溶液M供给到放置基板W的处理槽1中,并且处理槽1在低于大气压的压力下重复抽真空并加压数次。 使酒精X与基板W的表面接触并供给到凹部W-1中。 将化学溶液M供给到含有基板W的处理槽1中,直到化学溶液M达到浸渍基板W的水位,从而使化学溶液M进入凹部W-1。 从处理槽1排出化学溶液M,通过抽出处理槽1蒸发进入凹部W-1并与醇X混合的部分化学溶液M. 这个过程重复几次。