公开(公告)号：US20060139840A1

公开(公告)日：2006-06-29

申请号：US11317049

申请日：2005-12-27

申请人： Takayoshi Yasuda ,  Hideki Oshima ,  Hiroyuki Ichikawa ,  Daichi Mizushima ,  Takehiko Fushimi ,  Kenichi Sato

发明人： Takayoshi Yasuda ,  Hideki Oshima ,  Hiroyuki Ichikawa ,  Daichi Mizushima ,  Takehiko Fushimi ,  Kenichi Sato

IPC分类号： H01H47/00

CPC分类号： G05B13/041 ,  F16F13/26 ,  F16F15/03 ,  F16F2230/24 ,  G05B23/0243

摘要： An active vibration insulator includes an electromagnetic actuator, a control-signals generating device, a driver, a calculator, and a judging device. The electromagnetic actuator generates vibrating forces depending on electric-current supplies. The control-signals generating device generates cyclic control signals based on cyclic pulsating signals output from a vibration generating source of a vehicle. The cyclic control signals actively inhibit vibrations generated by the vibration generating source from transmitting to a specific part of the vehicle. The driver drives the electromagnetic actuator by making the electric-current supplies variable based on the cyclic control signals. The calculator calculates an estimated transfer function composed of estimated values of a transfer function for a transfer system including the electromagnetic actuator and the driver. The judging device judges an inoperative malfunction of the electromagnetic actuator based the estimated transfer function.

摘要翻译： 主动振动绝缘体包括电磁致动器，控制信号产生装置，驱动器，计算器和判断装置。 电磁执行器根据电流供应产生振动。 控制信号生成装置基于从车辆的振动发生源输出的循环脉动信号生成循环控制信号。 循环控制信号主动地抑制振动发生源产生的振动，从而传递到车辆的特定部分。 驱动器通过使电流供应器基于循环控制信号而变化来驱动电磁致动器。 计算器计算由包括电磁致动器和驱动器的传送系统的传递函数的估计值组成的估计传递函数。 判断装置基于估计的传递函数来判断电磁致动器的不操作故障。

公开(公告)号：US5872050A

公开(公告)日：1999-02-16

申请号：US919158

申请日：1997-08-28

申请人： Takahiro Haga ,  Yoshinori Kaido ,  Takayoshi Yasuda

发明人： Takahiro Haga ,  Yoshinori Kaido ,  Takayoshi Yasuda

IPC分类号： H01L21/60 ,  H01L23/00 ,  H01L23/31 ,  H01L31/04 ,  H01L21/44

CPC分类号： H01L24/05 ,  H01L23/3164 ,  H01L23/564 ,  H01L24/48 ,  H01L31/0201 ,  H01L31/02013 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05647 ,  H01L2224/4847 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12036 ,  H01L2924/12042 ,  Y02E10/50

摘要： A semiconductor device has a semiconductor element, an output terminal coupled to the semiconductor element and a thin metal member or foil secured to an output terminal. A protective layer covers the semiconductor element including the periphery of the metal foil to define an opening located at the metal foil. By covering the periphery of the metal foil, the protective layer secures the metal foil to the semiconductor element. A lead element is affixed to the metal foil by soldering through the opening. The resulting structure increases the adhesion of the lead element. Furthermore, because the protective film covers and seals the periphery of the metal foil, the advance of moisture into the inside of the semiconductor device is retarded. Accordingly the moisture resistance of the semiconductor device is improved.

摘要翻译： 半导体器件具有半导体元件，耦合到半导体元件的输出端子和固定到输出端子的薄金属构件或箔。 保护层覆盖包括金属箔的周边的半导体元件，以限定位于金属箔的开口。 通过覆盖金属箔的周边，保护层将金属箔固定在半导体元件上。 引线元件通过开口焊接固定在金属箔上。 所得到的结构增加了引线元件的附着力。 此外，由于保护膜覆盖并密封金属箔的周边，所以延迟了进入半导体器件内部的水分。 因此，提高了半导体器件的耐湿性。

公开(公告)号：US5717255A

公开(公告)日：1998-02-10

申请号：US386232

申请日：1995-02-09

申请人： Takahiro Haga ,  Yoshinori Kaido ,  Takayoshi Yasuda

发明人： Takahiro Haga ,  Yoshinori Kaido ,  Takayoshi Yasuda

IPC分类号： H01L21/60 ,  H01L23/00 ,  H01L23/31 ,  H01L31/04 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/05 ,  H01L23/3164 ,  H01L23/564 ,  H01L24/48 ,  H01L31/0201 ,  H01L31/02013 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05647 ,  H01L2224/4847 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12036 ,  H01L2924/12042 ,  Y02E10/50

摘要： A semiconductor device has a semiconductor element, an output terminal coupled to the semiconductor element and a thin metal member or foil secured to an output terminal. A protective layer covers the semiconductor element including the periphery of the metal foil to define an opening located at the metal foil. By covering the periphery of the metal foil, the protective layer secures the metal foil to the semiconductor element. A lead element is affixed to the metal foil by soldering through the opening. The resulting structure increases the adhesion of the lead element. Furthermore, because the protective film covers and seals the periphery of the metal foil, the advance of moisture into the inside of the semiconductor device is retarded. Accordingly the moisture resistance of the semiconductor device is improved.

摘要翻译： 半导体器件具有半导体元件，耦合到半导体元件的输出端子和固定到输出端子的薄金属构件或箔。 保护层覆盖包括金属箔的周边的半导体元件，以限定位于金属箔的开口。 通过覆盖金属箔的周边，保护层将金属箔固定在半导体元件上。 引线元件通过开口焊接固定在金属箔上。 所得到的结构增加了引线元件的附着力。 此外，由于保护膜覆盖并密封金属箔的周边，所以延迟了进入半导体器件内部的水分。 因此，提高了半导体器件的耐湿性。