公开(公告)号：US20100327709A1

公开(公告)日：2010-12-30

申请号：US12822403

申请日：2010-06-24

申请人： Hideki MINATO ,  Hideki Kabune ,  Atsushi Furumoto ,  Ayako Iwai

发明人： Hideki MINATO ,  Hideki Kabune ,  Atsushi Furumoto ,  Ayako Iwai

IPC分类号： H02K5/22 ,  H02K11/00 ,  H05K1/02

CPC分类号： H05K1/18 ,  H01L2224/73221 ,  H01L2924/0002 ,  H02K11/33 ,  H02K2211/03 ,  H02M7/003 ,  H05K2201/1003 ,  H05K2201/1053 ,  H05K2201/10659 ,  H01L2924/00

摘要： A V1 semiconductor module has a coil terminal, which is directly connectable to a lead wire of a coil. As a result, the number of parts required to connect electronic parts is reduced. Further, since no printed circuit board is required, the coil terminal can be shaped in any size without being limited in correspondence to the thickness of a copper film of the substrate. The coil terminal and control terminals, which are connected to the printed circuit board having a control circuit for controlling current supply to the coil, are provided on different wall surfaces of a resin part. Thus, the coil and the printed circuit board can be readily connected to the coil terminal and the control terminals, respectively, resulting in simplification of the device.

摘要翻译： V1半导体模块具有可直接连接到线圈的引线的线圈端子。 结果，减少了连接电子部件所需的部件数量。 此外，由于不需要印刷电路板，所以线圈端子可以成形为任何尺寸，而不受对应于基板的铜膜厚度的限制。 连接到具有用于控制向线圈供电的控制电路的印刷电路板的线圈端子和控制端子设置在树脂部件的不同壁面上。 因此，线圈和印刷电路板可以分别容易地连接到线圈端子和控制端子，从而简化了装置。

公开(公告)号：US20100327679A1

公开(公告)日：2010-12-30

申请号：US12822614

申请日：2010-06-24

申请人： Toshihiro Fujita ,  Hiroyasu Kidokoro ,  Atsushi Furumoto ,  Hideki Kabune ,  Hideki Minato

发明人： Toshihiro Fujita ,  Hiroyasu Kidokoro ,  Atsushi Furumoto ,  Hideki Kabune ,  Hideki Minato

IPC分类号： H02K11/00

CPC分类号： H02K3/522 ,  B62D5/0406 ,  H01L25/115 ,  H01L2924/0002 ,  H02K11/33 ,  H01L2924/00

摘要： A motor case is formed in a tubular shape. A semiconductor module includes a semiconductor chip of switching elements, a resin part and a coil terminal. The resin part embeds the semiconductor chip therein. The coil terminal is protruded from the resin part and directly connected to a coil. A connection part between the coil terminal and the coil is arranged at a position, which is between a top wall surface and a bottom wall surface of the resin part facing each other in the axial direction of a motor.

摘要翻译： 马达壳体形成为管状。 半导体模块包括开关元件的半导体芯片，树脂部件和线圈端子。 树脂部件将半导体芯片嵌入其中。 线圈端子从树脂部分突出并直接连接到线圈。 线圈端子和线圈之间的连接部分布置在位于电动机的轴向上彼此面对的树脂部分的顶壁表面和底壁表面之间的位置处。

公开(公告)号：US06273317B1

公开(公告)日：2001-08-14

申请号：US09420579

申请日：1999-10-19

申请人： Kenji Arai ,  Ataru Ichikawa ,  Atsushi Furumoto ,  Tatuya Kubo ,  Misao Tanaka ,  Mitsuhiro Sugiura

发明人： Kenji Arai ,  Ataru Ichikawa ,  Atsushi Furumoto ,  Tatuya Kubo ,  Misao Tanaka ,  Mitsuhiro Sugiura

IPC分类号： B23K1600

CPC分类号： B23K1/085 ,  B23K3/0653 ,  B23K3/087

摘要： In a flow soldering apparatus, a substrate is clamped by a pair of nails of a chuck mechanism and transferred over a molten solder barrel while being held in contact with a molten solder. The nails are held resiliently to each other, so that the substrate is allowed to expand thermally between the nails without bowing. The chuck mechanism has a scraper nail which extends transversely over the entire lateral length of the substrate at the front side of the substrate in a substrate transfer direction to push away an oxide film formed on the molten solder. The chuck mechanism is constructed to allow the molten solder to enter underneath the substrate in the lateral direction with respect to the substrate transfer direction. After completing one soldering operation, the nails change the set of the opposing two sides to another set of two opposing sides of the substrate, so that the substrate is subjected to the soldering operation from a direction different from the preceding soldering operation.

摘要翻译： 在流动焊接装置中，通过卡盘机构的一对钉子夹持基板，并在与熔融焊料保持接触的同时在熔融焊料滚筒上转移。 钉子彼此弹性地保持，使得允许基底在指甲之间热不断地膨胀而不弯曲。 卡盘机构具有在基板传送方向上在基板的前侧横向延伸到基板的整个横向长度的刮刀，以推动形成在熔融焊料上的氧化膜。 卡盘机构构造成允许熔融焊料相对于基板传送方向在横向方向上进入基板的下方。 在完成一次焊接操作之后，指甲将相对的两侧的一组改变成另一组两个相对的基板，使得基板从与前面的焊接操作不同的方向进行焊接操作。

公开(公告)号：US06412682B2

公开(公告)日：2002-07-02

申请号：US09886042

申请日：2001-06-22

申请人： Ataru Ichikawa ,  Tatsuya Kubo ,  Atsushi Furumoto ,  Kenji Arai ,  Mitsuhiro Sugiura ,  Misao Tanaka

发明人： Ataru Ichikawa ,  Tatsuya Kubo ,  Atsushi Furumoto ,  Kenji Arai ,  Mitsuhiro Sugiura ,  Misao Tanaka

IPC分类号： B23K3112

CPC分类号： B23K1/085 ,  B23K3/0653 ,  H05K3/3468

摘要： In a method of soldering a work-piece in a state where the work-piece contacts a wave molten solder, a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant. The immersion depth control is performed by changing one of a height position of the work-piece and a wave height of the wave molten solder based on a displacement amount of the work-piece in a height direction thereof. Accordingly, the soldering process can be performed with high quality even when the work-piece is thermally warped.

摘要翻译： 在工件与波熔融焊料接触的状态下焊接工件的方法中，在将工件浸入波熔融焊料中的浸入深度保持恒定的同时进行焊接工艺。 通过根据工件在其高度方向上的位移量来改变工件的高度位置和波熔融焊料的波高之一来进行浸入深度控制。 因此，即使当工件发生热翘曲时，也可以以高质量执行焊接工艺。

公开(公告)号：US06273319B1

公开(公告)日：2001-08-14

申请号：US09229444

申请日：1999-01-13

申请人： Ataru Ichikawa ,  Tatsuya Kubo ,  Atsushi Furumoto ,  Kenji Arai ,  Mitsuhiro Sugiura ,  Misao Tanaka

发明人： Ataru Ichikawa ,  Tatsuya Kubo ,  Atsushi Furumoto ,  Kenji Arai ,  Mitsuhiro Sugiura ,  Misao Tanaka

IPC分类号： B23K3112

CPC分类号： B23K1/085 ,  B23K3/0653 ,  H05K3/3468

摘要： In a method of soldering a work-piece in a state where the work-piece contacts a wave molten solder, a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant. The immersion depth control is performed by changing one of a height position of the work-piece and a wave height of the wave molten solder based on a displacement amount of the work-piece in a height direction thereof. Accordingly, the soldering process can be performed with high quality even when the work-piece is thermally warped.