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25 条记录 (耗时 0.028 秒)

    Flow soldering apparatus having resilient substrate clamping mechanism and solder oxide film removing mechanism
    1.
    发明授权
    Flow soldering apparatus having resilient substrate clamping mechanism and solder oxide film removing mechanism 有权
    具有弹性基板夹持机构和焊剂氧化膜去除机构的流焊装置

    公开(公告)号：US06273317B1

    公开(公告)日：2001-08-14

    申请号：US09420579

    申请日：1999-10-19

    申请人： Kenji Arai ,  Ataru Ichikawa ,  Atsushi Furumoto ,  Tatuya Kubo ,  Misao Tanaka ,  Mitsuhiro Sugiura

    发明人： Kenji Arai ,  Ataru Ichikawa ,  Atsushi Furumoto ,  Tatuya Kubo ,  Misao Tanaka ,  Mitsuhiro Sugiura

    IPC分类号： B23K1600

    CPC分类号： B23K1/085 ,  B23K3/0653 ,  B23K3/087

    摘要： In a flow soldering apparatus, a substrate is clamped by a pair of nails of a chuck mechanism and transferred over a molten solder barrel while being held in contact with a molten solder. The nails are held resiliently to each other, so that the substrate is allowed to expand thermally between the nails without bowing. The chuck mechanism has a scraper nail which extends transversely over the entire lateral length of the substrate at the front side of the substrate in a substrate transfer direction to push away an oxide film formed on the molten solder. The chuck mechanism is constructed to allow the molten solder to enter underneath the substrate in the lateral direction with respect to the substrate transfer direction. After completing one soldering operation, the nails change the set of the opposing two sides to another set of two opposing sides of the substrate, so that the substrate is subjected to the soldering operation from a direction different from the preceding soldering operation.

    摘要翻译： 在流动焊接装置中，通过卡盘机构的一对钉子夹持基板，并在与熔融焊料保持接触的同时在熔融焊料滚筒上转移。 钉子彼此弹性地保持，使得允许基底在指甲之间热不断地膨胀而不弯曲。 卡盘机构具有在基板传送方向上在基板的前侧横向延伸到基板的整个横向长度的刮刀，以推动形成在熔融焊料上的氧化膜。 卡盘机构构造成允许熔融焊料相对于基板传送方向在横向方向上进入基板的下方。 在完成一次焊接操作之后，指甲将相对的两侧的一组改变成另一组两个相对的基板，使得基板从与前面的焊接操作不同的方向进行焊接操作。

    Wave soldering method and system used for the method
    2.
    发明授权
    Wave soldering method and system used for the method 失效
    波峰焊方法和系统用于该方法

    公开(公告)号：US06412682B2

    公开(公告)日：2002-07-02

    申请号：US09886042

    申请日：2001-06-22

    申请人： Ataru Ichikawa ,  Tatsuya Kubo ,  Atsushi Furumoto ,  Kenji Arai ,  Mitsuhiro Sugiura ,  Misao Tanaka

    发明人： Ataru Ichikawa ,  Tatsuya Kubo ,  Atsushi Furumoto ,  Kenji Arai ,  Mitsuhiro Sugiura ,  Misao Tanaka

    IPC分类号： B23K3112

    CPC分类号： B23K1/085 ,  B23K3/0653 ,  H05K3/3468

    摘要： In a method of soldering a work-piece in a state where the work-piece contacts a wave molten solder, a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant. The immersion depth control is performed by changing one of a height position of the work-piece and a wave height of the wave molten solder based on a displacement amount of the work-piece in a height direction thereof. Accordingly, the soldering process can be performed with high quality even when the work-piece is thermally warped.

    摘要翻译： 在工件与波熔融焊料接触的状态下焊接工件的方法中，在将工件浸入波熔融焊料中的浸入深度保持恒定的同时进行焊接工艺。 通过根据工件在其高度方向上的位移量来改变工件的高度位置和波熔融焊料的波高之一来进行浸入深度控制。 因此，即使当工件发生热翘曲时，也可以以高质量执行焊接工艺。

    DRIVE APPARATUS
    4.
    发明申请
    DRIVE APPARATUS 有权
    驱动装置

    公开(公告)号：US20120098361A1

    公开(公告)日：2012-04-26

    申请号：US13379096

    申请日：2010-06-23

    申请人： Masashi Yamasaki ,  Atsushi Furumoto ,  Hideki Kabune

    发明人： Masashi Yamasaki ,  Atsushi Furumoto ,  Hideki Kabune

    IPC分类号： H02K9/00

    CPC分类号： H02K11/0073 ,  B62D5/0406 ,  H02K5/225 ,  H02K11/33 ,  H02K2211/03

    摘要： A heat sink has two heat radiation blocks. The heat radiation block is formed in a wide column shape. The heat radiation block has connection parts at both ends. The connection parts have respective holes formed to pass through in the axial direction of a motor. One screw is inserted in one connection part and threaded into a motor case. The other screw is inserted in the other connection part and threaded into the motor case together with a cover. A power module forming an inverter circuit of each of two power supply systems is arranged on each heat radiation blocks.

    摘要翻译： 散热片有两个散热块。 散热块形成为宽的柱状。 散热块在两端具有连接部分。 连接部具有形成为沿电动机的轴向通过的各个孔。 一个螺丝插入一个连接部分并拧入电机外壳。 另一个螺钉插入另一个连接部分，并与盖子一起拧入电机外壳。 形成两个电源系统中的每一个的逆变器电路的功率模块布置在每个散热块上。

    Drive apparatus
    5.
    发明授权
    Drive apparatus 有权
    驱动装置

    公开(公告)号：US08710705B2

    公开(公告)日：2014-04-29

    申请号：US13336492

    申请日：2011-12-23

    申请人： Masashi Yamasaki ,  Hideki Kabune ,  Atsushi Furumoto

    发明人： Masashi Yamasaki ,  Hideki Kabune ,  Atsushi Furumoto

    IPC分类号： H02K9/00

    CPC分类号： H02K11/0073 ,  B62D5/0406 ,  H02K3/50 ,  H02K5/225 ,  H02K9/22 ,  H02K11/33

    摘要： An electronic control unit (50, 70) including semiconductor modules (501 to 506) and capacitors (701 to 706) is disposed in the axial direction of a motor (30). The semiconductor modules (501 to 506) are placed longitudinally and brought into contact with a heat sink (601). The vertical line to each of surfaces of semiconductor chips included in the semiconductor modules (501 to 506) is perpendicular to the axial line of the motor (30). Accordingly, the capacitors (701 to 706) are disposed so that at least a part of the capacitors (701 to 706) overlap the semiconductor modules (501 to 506) and heat sink (601) in the axial direction of the motor (30).

    摘要翻译： 包括半导体模块（501至506）和电容器（701至706）的电子控制单元（50,70）设置在电动机（30）的轴向上。 半导体模块（501至506）被纵向放置并与散热器（601）接触。 包括在半导体模块（501至506）中的半导体芯片的每个表面的垂直线垂直于电动机（30）的轴线。 因此，电容器（701〜706）的配置使得至少一部分电容器（701〜706）在电动机（30）的轴向上与半导体模块（501〜506）和散热片（601）重叠， 。

    DRIVE APPARATUS
    7.
    发明申请
    DRIVE APPARATUS 有权

    公开(公告)号：US20120098391A1

    公开(公告)日：2012-04-26

    申请号：US13336492

    申请日：2011-12-23

    申请人： Masashi YAMASAKI ,  Hideki Kabune ,  Atsushi Furumoto

    发明人： Masashi YAMASAKI ,  Hideki Kabune ,  Atsushi Furumoto

    IPC分类号： H02K5/22

    CPC分类号： H02K11/0073 ,  B62D5/0406 ,  H02K3/50 ,  H02K5/225 ,  H02K9/22 ,  H02K11/33

    摘要： An electronic control unit (50, 70) including semiconductor modules (501 to 506) and capacitors (701 to 706) is disposed in the axial direction of a motor (30). The semiconductor modules (501 to 506) are placed longitudinally and brought into contact with a heat sink (601). The vertical line to each of surfaces of semiconductor chips included in the semiconductor modules (501 to 506) is perpendicular to the axial line of the motor (30). Accordingly, the capacitors (701 to 706) are disposed so that at least a part of the capacitors (701 to 706) overlap the semiconductor modules (501 to 506) and heat sink (601) in the axial direction of the motor (30).

    DRIVE APPARATUS
    9.
    发明申请
    DRIVE APPARATUS 有权
    驱动装置

    公开(公告)号：US20100327678A1

    公开(公告)日：2010-12-30

    申请号：US12822396

    申请日：2010-06-24

    申请人： Masashi YAMASAKI ,  Hideki Kabune ,  Atsushi Furumoto

    发明人： Masashi YAMASAKI ,  Hideki Kabune ,  Atsushi Furumoto

    IPC分类号： H02K11/00 ,  H02K5/22 ,  H02K9/22 ,  H02P6/16

    CPC分类号： H02K11/024 ,  H02K3/522 ,  H02K11/05 ,  H02K11/33 ,  H02K2203/09 ,  H02K2211/03

    摘要： A drive apparatus has a motor device having a tubular motor case. A stator is arranged radially inside the motor case. A rotor is arranged radially inside the stator. A shaft is rotatable with the rotor. An electronic circuit is arranged in the central axis direction of the shaft relative to the motor case. A choke coil has a hole in a central part thereof, in which the shaft is inserted.

    摘要翻译： 驱动装置具有具有管状电动机壳体的电动机装置。 电动机壳体内径向配置定子。 转子径向布置在定子内。 轴可随转子旋转。 电子电路相对于电动机壳体设置在轴的中心轴线方向上。 扼流线圈在其中心部分具有孔，其中插入有轴。

    Electronic circuit-integrated motor apparatus
    10.
    发明授权
    Electronic circuit-integrated motor apparatus 有权
    电子电路集成电机装置

    公开(公告)号：US08338998B2

    公开(公告)日：2012-12-25

    申请号：US12822627

    申请日：2010-06-24

    申请人： Masashi Yamasaki ,  Hideki Kabune ,  Atsushi Furumoto

    发明人： Masashi Yamasaki ,  Hideki Kabune ,  Atsushi Furumoto

    IPC分类号： H02K9/00 ,  H02K11/00

    CPC分类号： H02K9/22 ,  H01L23/36 ,  H01L25/11 ,  H01L2924/0002 ,  H02K11/33 ,  H01L2924/00

    摘要： An electronic circuit including semiconductor modules and capacitors is positioned in the axial direction of a motor. Each semiconductor module is longitudinally positioned in contact with a heat sink. More specifically, a line perpendicular to the surface of a semiconductor chip included in the semiconductor module is perpendicular to the axis line of the motor. Consequently, each capacitor is positioned so that at least a part of the positional range of the capacitor in the axial direction of the motor coincides with the positional ranges of the semiconductor module and the heat sink in the axial direction.

    摘要翻译： 包括半导体模块和电容器的电子电路位于电机的轴向。 每个半导体模块纵向定位成与散热器接触。 更具体地，垂直于包括在半导体模块中的半导体芯片的表面的线垂直于电动机的轴线。 因此，每个电容器被定位成使得电动机在电动机轴向上的位置范围的至少一部分与半导体模块和散热器在轴向方向上的位置范围一致。