摘要:
Multigate transistor devices and methods of their fabrication are disclosed. In accordance with one method, a fin and a gate structure that is disposed on a plurality of surfaces of the fin are formed. In addition, at least a portion of an extension of the fin is removed to form a recessed portion that is below the gate structure, is below a channel region of the fin, and includes at least one angled indentation. Further, a terminal extension is grown in the at least one angled indentation below the channel region and along a surface of the channel region such that the terminal extension provides a stress on the channel region to enhance charge carrier mobility in the channel region.
摘要:
A method of forming a semiconductor structure includes forming a stress inducing layer over one or more partially completed field effect transistor (FET) devices disposed over a substrate, the one or more partially completed FET devices including sacrificial dummy gate structures; planarizing the stress inducing layer and removing the sacrificial dummy gate structures; and following the planarizing the stress inducing layer and removing the sacrificial dummy gate structures, performing an ultraviolet (UV) cure of the stress inducing layer so as to enhance a value of an initial applied stress by the stress inducing layer on channel regions of the one or more partially completed FET devices.
摘要:
Multigate transistor devices and methods of their fabrication are disclosed. In accordance with one method, a fin and a gate structure that is disposed on a plurality of surfaces of the fin are formed. In addition, at least a portion of an extension of the fin is removed to form a recessed portion that is below the gate structure, is below a channel region of the fin, and includes at least one angled indentation. Further, a terminal extension is grown in the at least one angled indentation below the channel region and along a surface of the channel region such that the terminal extension provides a stress on the channel region to enhance charge carrier mobility in the channel region.
摘要:
Techniques for fabricating passive devices in an extremely-thin silicon-on-insulator (ETSOI) wafer are provided. In one aspect, a method for fabricating one or more passive devices in an ETSOI wafer is provided. The method includes the following steps. The ETSOI wafer having a substrate and an ETSOI layer separated from the substrate by a buried oxide (BOX) is provided. The ETSOI layer is coated with a protective layer. At least one trench is formed that extends through the protective layer, the ETSOI layer and the BOX, and wherein a portion of the substrate is exposed within the trench. Spacers are formed lining sidewalls of the trench. Epitaxial silicon templated from the substrate is grown in the trench. The protective layer is removed from the ETSOI layer. The passive devices are formed in the epitaxial silicon.
摘要:
A method of forming a semiconductor structure includes forming a stress inducing layer over one or more partially completed field effect transistor (FET) devices disposed over a substrate, the one or more partially completed FET devices including sacrificial dummy gate structures; planarizing the stress inducing layer and removing the sacrificial dummy gate structures; and following the planarizing the stress inducing layer and removing the sacrificial dummy gate structures, performing an ultraviolet (UV) cure of the stress inducing layer so as to enhance a value of an initial applied stress by the stress inducing layer on channel regions of the one or more partially completed FET devices. A semiconductor structure includes a UV cured tensile nitride layer formed over the substrate and between gate structures of the NFET devices, with portions of the UV cured tensile nitride layer having a trapezoidal profile with a bottom end wider than a top end.
摘要:
The embodiments of the invention disclose an object determining method, a portable device, an object displaying method, an object switching method and an electronic device. Said method is applied to a touch sensitive portable device. Identifications of multiple objects are displayed within a display area of said portable device. Each of the identifications of said multiple objects has a first status of being selected and a second status of being unselected. Said display area has a first area, the identification of a first object is displayed in the first area, and the first object is in the first status. Said method comprises: obtaining a switch instruction; moving the identification of the first object of the first area, switching the identification of the first object from the first status to the second status, moving the identification of the second object into the first area, and switching the identification of the second object from the second status to the first status according to the switch instruction. The embodiments of the invention can simplify the steps of the user's operation.
摘要:
A touch-input device and an electronic device and a cell phone are described and include a touch acquisition module with an input area to execute touch acquisition operations. The input area includes a first area and a second area. A pointing object location module is used to determine the start location of the touch operation according to the data acquired by the touch acquisition module. A process module is used to calculate a first result indicating the coordinate of the pointing object according to the data acquired by the touch acquisition module when the start location of the touch operation is in the first area, and to calculate a second result indicating the movement of the pointing object according to the data acquired by the touch acquisition module when the start location of the touch operation is in the second area.
摘要:
A method of fabricating a semiconductor device and a corresponding semiconductor device are provided. The method can include implanting a species into a silicide region, the silicide region contacting a semiconductor region of a substrate. A stressed liner may then be formed overlying the silicide region having the implanted species therein. In a particular example, prior to forming the stressed liner, a step of annealing can be performed within an interval less than one second to elevate at least a portion of the silicide region to a peak temperature ranging from 800 to 950° C. The method may reduce the chance of deterioration in the silicide region, e.g., the risk of void formation, due to processing used to form the stressed liner.
摘要:
The embodiments of the invention disclose an object determining method, a portable device, an object displaying method, an object switching method and an electronic device. Said method is applied to a touch sensitive portable device. Identifications of multiple objects are displayed within a display area of said portable device. Each of the identifications of said multiple objects has a first status of being selected and a second status of being unselected. Said display area has a first area, the identification of a first object is displayed in the first area, and the first object is in the first status. Said method comprises: obtaining a switch instruction; moving the identification of the first object of the first area, switching the identification of the first object from the first status to the second status, moving the identification of the second object into the first area, and switching the identification of the second object from the second status to the first status according to the switch instruction. The embodiments of the invention can simplify the steps of the user's operation.
摘要:
A method of forming a semiconductor device includes forming a spacer layer over a plurality of transistor gate structures, the transistor gate structures being formed over both active and shallow trench isolation (STI) regions of a substrate. The spacer layer is subjected to a directional etch so as to form sidewall spacers adjacent the plurality of transistor gate structures, and a horizontal fill portion of the spacer layer remains in one more recesses present in the STI regions so as to substantially planarize the STI region prior to subsequent material deposition thereon.