ELECTRONIC COMPONENT
    21.
    发明申请

    公开(公告)号:US20220384097A1

    公开(公告)日:2022-12-01

    申请号:US17752897

    申请日:2022-05-25

    Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at a pair of multilayer body end surfaces and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the board. The interposer board is an alumina board. The board main surface in the vicinity of the electronic element includes a fired layer thereon in the vicinity of the pair of board end surfaces of the interposer board.

    MULTILAYER CERAMIC CAPACITOR
    22.
    发明申请

    公开(公告)号:US20220108844A1

    公开(公告)日:2022-04-07

    申请号:US17489887

    申请日:2021-09-30

    Abstract: A multilayer ceramic capacitor includes a capacitor main body including a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, and external electrodes each at one of two end surfaces of the multilayer body and connected to the internal electrode layers, and two interposers on a surface of the capacitor main body, and opposed and spaced apart from each other. The two interposers include a nickel-plated layer and a tin-plated layer on an outer periphery thereof. The two interposers each include a non-plated region without the nickel-plated layer on an end surface at which the two interposers face each other.

    MULTILAYER CERAMIC CAPACITOR
    23.
    发明申请

    公开(公告)号:US20220108841A1

    公开(公告)日:2022-04-07

    申请号:US17489876

    申请日:2021-09-30

    Abstract: A multilayer ceramic capacitor includes a capacitor main body including a multilayer body including dielectric layers and internal electrode layers alternately laminated, and external electrodes at two end surfaces of the multilayer body and connected to the internal electrode layers, and two interposers on a surface of the capacitor main body in a lamination direction and opposed and spaced apart from each other. The interposers each include a first surface at or adjacent to the capacitor main body, and a second surface parallel or substantially parallel to each other, and the first surface is sloped with respect to the second surface at a predetermined angle approaching the surface of the capacitor main body toward a side at which the two interposers face each other.

    MULTILAYER CAPACITOR AND INSTALLATION STRUCTURE OF MULTILAYER CAPACITOR

    公开(公告)号:US20190304699A1

    公开(公告)日:2019-10-03

    申请号:US16443908

    申请日:2019-06-18

    Abstract: In a multilayer capacitor, a multilayer capacitor main body includes first and second main surfaces, first and second side surfaces, and first and second end surfaces, the first and second main surfaces extending in a length direction and a width direction, the first and second side surfaces extending in the length direction and a thickness direction, and the first and second end surfaces extending in the width direction and the thickness direction. The second main surface is depressed in a portion extending from opposite ends of the second main surface toward a center of the second main surface in the length direction.

    MULTILAYER CAPACITOR AND INSTALLATION STRUCTURE OF MULTILAYER CAPACITOR
    25.
    发明申请
    MULTILAYER CAPACITOR AND INSTALLATION STRUCTURE OF MULTILAYER CAPACITOR 审中-公开
    多层电容器的多层电容器和安装结构

    公开(公告)号:US20160049253A1

    公开(公告)日:2016-02-18

    申请号:US14813204

    申请日:2015-07-30

    CPC classification number: H01G4/30 H01G4/012 H01G4/12 H01G4/232

    Abstract: In a multilayer capacitor, both a minimum distance in a thickness direction between a first effective portion of a first inner electrode and a second main surface and a minimum distance in the thickness direction between a second effective portion of a second inner electrode and the second main surface are shorter than any of a dimension in the thickness direction of a first extending portion of the first inner electrode, a dimension in the thickness direction of a second extending portion of the first inner electrode and a dimension in the thickness direction of the third extending portion of the second inner electrode.

    Abstract translation: 在层叠电容器中,在第一内部电极的第一有效部分和第二主要表面之间的厚度方向上的最小距离和第二内部电极的第二有效部分与第二主体之间的厚度方向上的最小距离 表面比第一内部电极的第一延伸部分的厚度方向上的尺寸小,第一内部电极的第二延伸部分的厚度方向上的尺寸和第三延伸部分的厚度方向上的尺寸 第二内部电极的一部分。

    ELECTRONIC COMPONENT
    26.
    发明公开

    公开(公告)号:US20240276646A1

    公开(公告)日:2024-08-15

    申请号:US18643092

    申请日:2024-04-23

    CPC classification number: H05K1/181 H01G4/008 H01G4/012 H01G4/1227 H01G4/30

    Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is in a vicinity of the electronic element and is joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. A maximum length of the interposer board is smaller than a length of the electronic element. A width of the interposer board is smaller than a width of the electronic element.

    ELECTRONIC COMPONENT
    27.
    发明公开

    公开(公告)号:US20240203643A1

    公开(公告)日:2024-06-20

    申请号:US18416983

    申请日:2024-01-19

    Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at a pair of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. A mark portion is provided on one of the board main surfaces.

    ELECTRONIC COMPONENT
    28.
    发明申请

    公开(公告)号:US20220384101A1

    公开(公告)日:2022-12-01

    申请号:US17752905

    申请日:2022-05-25

    Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes each at a respective one of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The external electrodes each include a first Sn plated layer that covers an outer surface of the interposer board in a vicinity of at least one board end surface.

    MULTILAYER CERAMIC CAPACITOR
    30.
    发明申请

    公开(公告)号:US20220108843A1

    公开(公告)日:2022-04-07

    申请号:US17489881

    申请日:2021-09-30

    Abstract: A multilayer ceramic capacitor includes a capacitor main body, and two interposers on both sides in a length direction of a surface of the capacitor main body. When a distance between a side surface of one interposer on one side in the length direction, and a side surface of the capacitor main body is defined as X1, a distance between another side surface of the one interposer, and another side surface of the capacitor main body is defined as X4, a distance between a side surface of another interposer on another side in the length direction, and the side surface of the capacitor main body is defined as X2, and a distance between another side surface of the other interposer on the other side in the length direction, and the other side surface of the capacitor main body is defined as X3; X2>X3 and X1>X4 are satisfied.

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