公开(公告)号：US20220344562A1

公开(公告)日：2022-10-27

申请号：US17712300

申请日：2022-04-04

Applicant: NEC Corporation

Inventor： Katsumi KIKUCHI ,  Akira MIYATA ,  Takanori NISHI ,  Kenji NANBA ,  Ayami YAMAGUCHI

IPC: H01L39/04

Abstract: A quantum device according to an example embodiment includes: a quantum chip with a first surface and a second surface located on a side opposite to the first surface, in the quantum chip, at least a part of a qubit circuit being provided on the second surface; a first interposer with a third surface and a fourth surface located on a side opposite to the third surface, the first interposer being connected to the quantum chip in such a manner that the second surface of the quantum chip is opposed to the third surface of the first interposer; and a second interposer with a fifth surface and a sixth surface located on a side opposite to the fifth surface, the second interposer being connected to the first interposer in such a manner that the fourth surface of the first interpose is opposed to the fifth surface of the second interposer.

公开(公告)号：US20210399195A1

公开(公告)日：2021-12-23

申请号：US17342811

申请日：2021-06-09

Applicant: NEC Corporation

Inventor： Katsumi KIKUCHI ,  Akira MIYATA ,  Suguru WATANABE ,  Takanori NISHI ,  Hideyuki SATOU ,  Kenji NANBA ,  Ayami YAMAGUCHI

IPC: H01L39/04

Abstract: A quantum device capable of effectively cooling a quantum chip and an area (e.g., a space) therearound is provided. A quantum device 1 includes a quantum chip 10 and an interposer 20 on which the quantum chip 10 is located. The interposer 20 includes an interposer substrate 22 and an interposer wiring layer 30. The interposer wiring layer 30 is disposed on a surface 22a of the interposer substrate 22 on a side on which the quantum chip 10 is located. The interposer wiring layer 30 includes, in at least a part thereof, a superconducting material layer 32 formed of a superconducting material and a non-superconducting material layer 34 formed of a non-superconducting material.

公开(公告)号：US20210399193A1

公开(公告)日：2021-12-23

申请号：US17349180

申请日：2021-06-16

Applicant: NEC Corporation

Inventor： Kenji NANBA ,  Ayami YAMAGUCHI ,  Akira MIYATA ,  Katsumi KIKUCHI ,  Suguru WATANABE ,  Takanori NISHI ,  Hideyuki SATOU

IPC: H01L39/04 ,  H01L39/24

Abstract: A quantum device (100) includes: an interposer (112); a quantum chip (111); a first connection part (130) that is provided between the interposer (112) and the quantum chip (111) and electrically connects a wiring layer of the interposer (112) to a wiring layer of the quantum chip (111); and a second connection part (140) that is provided on a main surface of the interposer (112) where the first connection part (130) is arranged and is connected to a cooling plate (115).

公开(公告)号：US20210181057A1

公开(公告)日：2021-06-17

申请号：US16761336

申请日：2018-11-06

Applicant: NEC Corporation

Inventor： Hirofumi INOUE ,  Soichiro TAKATA ,  Shigeki SHINODA ,  Katsumi KIKUCHI

IPC: G01M5/00 ,  G01N3/32

Abstract: In order to provide an estimating device and the like capable of easily estimating the strength of a pipe, this estimating device is provided with a frequency response calculating unit, a pipe rigidity variable estimating unit, and a strength estimating unit. The frequency response calculating unit calculates a frequency response function of the pipe on the basis of excitation force data representing an excitation force when the pipe is excited, and response data obtained by measuring vibrations propagating through the pipe. The pipe rigidity variable estimating unit estimates a parameter relating to the rigidity of the pipe on the basis of a frequency response function model, which is a model representing the frequency response of the pipe, and the frequency response function. The strength estimating unit estimates the strength of the pipe on the basis of a relationship between the parameter and the strength of the pipe.

公开(公告)号：US20200333223A1

公开(公告)日：2020-10-22

申请号：US16766061

申请日：2018-12-10

Applicant: NEC CORPORATION

Inventor： Hirofumi INOUE ,  Soichiro TAKATA ,  Shigeki SHINODA ,  Katsumi KIKUCHI

IPC: G01N3/08

Abstract: An analyzing device including: a material property calculating unit that calculates a material property of a pipeline being inspected, on the basis of measurement information including a load applied to the pipeline being inspected, and a displacement corresponding to the load applied to the pipeline being inspected; and a degree of deterioration calculating unit that calculates a degree of deterioration of the pipeline being inspected, on the basis of the material property of the pipeline being inspected, calculated by the material property calculating unit.

公开(公告)号：US20230276717A1

公开(公告)日：2023-08-31

申请号：US18007765

申请日：2020-06-05

Applicant: NEC Corporation

Inventor： Akira MIYATA ,  Katsumi KIKUCHI ,  Suguru WATANABE ,  Takanori NISHI ,  Hideyuki SATOU ,  Tomohiro YAMAJI ,  Tsuyoshi YAMAMOTO ,  Yoshihito HASHIMOTO

IPC: H10N60/10 ,  G06N10/40

CPC classification number: H10N60/10 ,  G06N10/40

Abstract: Provided are an oscillator and a quantum computer capable of suppressing an occupied area of a circuit. An oscillator (300) includes a resonator (100) including a plurality of loop circuits in which a first superconducting line (112a), a first Josephson junction (111a), a second superconducting line (112b), and a second Josephson junction (111b) are annularly connected, and a magnetic field application circuit (200) including an electrode that goes around in a predetermined shape and configured to apply a magnetic field to the loop circuit, in which the electrode is arranged so as to face at least two of the loop circuits.

公开(公告)号：US20230237687A1

公开(公告)日：2023-07-27

申请号：US17923319

申请日：2020-05-14

Applicant: NEC Corporation

Inventor： Yaeko YONEZAWA ,  Katsumi KIKUCHI ,  Soma SHIRAISHI ,  Yu NABETO

IPC: G06T7/70 ,  G06Q30/0601 ,  G06T7/11 ,  G06T3/40 ,  G06V10/764

CPC classification number: G06T7/70 ,  G06Q30/0639 ,  G06T7/11 ,  G06T3/4038 ,  G06V10/764 ,  G06T2207/30242 ,  G06T2207/20212

Abstract: A product identification apparatus (20) includes an acquisition unit (210), an image processing unit (220), and a storage processing unit (230). The acquisition unit (210) acquires an image generated by an image capturing apparatus 10. The image includes a product shelf (40) and a product (50). The image processing unit (220) determines a position where continuity of the product shelf (40) is broken by processing the image acquired by the acquisition unit (210), and divides the product shelf (40) into a unit region by using the position. Further, the image processing unit (220) determines a kind and a product name of the product (50) by processing the image acquired by the acquisition unit (210). The storage processing unit (230) causes a storage unit (240) to store product identification information of the product (50) located in the unit region, for each unit region of the product shelf (40).

公开(公告)号：US20230186736A1

公开(公告)日：2023-06-15

申请号：US17924738

申请日：2020-05-20

Applicant: NEC Corporation

Inventor： Yu NABETO ,  Soma SHIRAISHI ,  Takami SATO ,  Katsumi KIKUCHI

IPC: G07G1/00 ,  G06V10/74 ,  G06Q20/20

CPC classification number: G07G1/0045 ,  G06V10/761 ,  G06Q20/208 ,  G06V2201/07

Abstract: An image acquisition unit (11) acquires a recognition processing image. A recognition unit (12) recognizes a product in the recognition processing image based on an estimation model. A registration unit (13) registers a result of the recognition in recognized product information. An output unit (14) outputs a result of the recognition. A correction reception unit (16) receives an input for correcting a result of the recognition. A correction unit (17) changes a result of the recognition to a result of the recognition after a correction, and also stores correction information in which a result of the recognition after a correction and the recognition processing image are associated with each other. A learning unit (18) performs relearning by using the recognition processing image stored as the correction information and updates the estimation model, when a number of the recognition processing image stored exceeds a predetermined value.

公开(公告)号：US20230179817A1

公开(公告)日：2023-06-08

申请号：US17923935

申请日：2020-05-18

Applicant: NEC Corporation

Inventor： Katsumi KIKUCHI ,  Haruna WATANABE ,  Yu NABETO ,  Soma SHIRAISHI

IPC: H04N21/2668 ,  H04N21/845 ,  H04N21/239

CPC classification number: H04N21/2668 ,  H04N21/2393 ,  H04N21/8456

Abstract: An information processing apparatus generates structural information of a digest video from a video material. In the information processing apparatus, a video acquisition means acquires a video material. A condition acquisition means acquires a generation condition for generating the digest video from the creator. A generation means generates structural information indicating a structure of the digest video that is generated based on the video material based on the generation condition, and outputs the generated structural information.

公开(公告)号：US20230092640A1

公开(公告)日：2023-03-23

申请号：US17802363

申请日：2020-03-19

Applicant: NEC Corporation

Inventor： Soma SHIRAISHI ,  Katsumi KIKUCHI ,  Takami SATO ,  Yu NABETO

IPC: G06T7/60 ,  G06V10/764 ,  G06V40/10

Abstract: A body height estimating apparatus (10) includes an acquisition unit (110), an image processing unit (120), and an estimation unit (130). The acquisition unit (110) acquires an image generated by an image capture unit (20). The image processing unit (120) processes the image generated by the image capture unit (20), and thereby generates analysis data. The analysis data include a height of a palm and an angle of an arm of a person included in the image. The estimation unit (130) computes an estimated value of a body height of the person by using the height of the palm and the angle of the arm included in the analysis data.