公开(公告)号：US09274273B2

公开(公告)日：2016-03-01

申请号：US13951633

申请日：2013-07-26

Applicant: NITTO DENKO CORPORATION

Inventor： Shotaro Masuda ,  Toshikazu Baba ,  Yasuto Ishimaru

IPC: G02B6/12 ,  H05K1/02 ,  G02B6/138

CPC classification number: G02B6/12002 ,  G02B6/138 ,  H05K1/0274 ,  H05K1/028 ,  H05K2201/09236 ,  H05K2201/09909 ,  H05K2201/09972 ,  H05K2203/1572

Abstract: An opto-electric hybrid board which is capable of significantly reducing stresses applied to a bent portion thereof is provided. The opto-electric hybrid board includes a stacked electric circuit board and an optical waveguide. The electric circuit board includes an insulative layer having front and back surfaces, electrical interconnect lines formed on the front surface of the insulative layer, and an insulative coverlay formed on the front surface of the insulative layer and for covering and protecting the electrical interconnect lines. The optical waveguide includes a first cladding layer having a front surface, cores formed in a pattern on the front surface of the first cladding layer, and a second cladding layer covering the cores. Part of the opto-electric hybrid board is defined as a to-be-bent portion in which the coverlay and the optical waveguide are disposed in non-overlapping relation.

Abstract translation: 提供能够显着降低施加到其弯曲部分的应力的光电混合板。 光电混合基板包括堆叠电路板和光波导。 该电路板包括具有前表面和后表面的绝缘层，形成在绝缘层的前表面上的电互连线，以及形成在绝缘层的前表面上并用于覆盖和保护电互连线的绝缘覆盖层。 光波导包括具有前表面的第一包层，在第一包层的表面上以图案形成的芯和覆盖芯的第二包覆层。 光电混合板的一部分被定义为其中覆盖层和光波导以非重叠关系设置的弯曲部分。

公开(公告)号：US09046646B2

公开(公告)日：2015-06-02

申请号：US13775891

申请日：2013-02-25

Applicant: Nitto Denko Corporation

Inventor： Yuichi Tsujita ,  Yasuto Ishimaru ,  Akihito Matsutomi ,  Naoyuki Tanaka ,  Yasufumi Yamamoto ,  Mayu Ozaki

IPC: G02B6/12 ,  G02B6/42 ,  G02B6/125 ,  G02B6/43 ,  G02B6/136 ,  G02B6/138

CPC classification number: G02B6/12004 ,  G02B6/136 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/43

Abstract: An opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide includes a first cladding layer and cores, and the optical waveguide is formed on the back surface of the insulative layer of the electric circuit board. The metal layer is formed between the first cladding layer of the optical waveguide and the back surface of the insulative layer of the electric circuit board. Part of the opto-electric hybrid board is formed as a to-be-bent portion. The metal layer is partially removed in a portion corresponding to the to-be-bent portion. A first cladding layer of the optical waveguide fills a site where the metal layer is removed.

Abstract translation: 光电混合基板包括电路板，光波导和金属层。 电路板包括具有前表面和后表面的绝缘层，以及形成在绝缘层的前表面上的电互连线。 光波导包括第一包层和芯，并且光波导形成在电路板的绝缘层的背面上。 金属层形成在光波导的第一包层和电路板的绝缘层的背面之间。 光电混合板的一部分形成为弯曲部。 在对应于被弯曲部分的部分中部分去除金属层。 光波导的第一包层填充去除金属层的位置。