公开(公告)号：US20160344969A1

公开(公告)日：2016-11-24

申请号：US15226449

申请日：2016-08-02

Applicant: OLYMPUS CORPORATION

Inventor： Eiji Furukawa ,  Toru Kondo

IPC: H04N5/3745 ,  H03M1/56 ,  H04N9/04 ,  H04N5/378 ,  H04N5/355

CPC classification number: H04N5/37455 ,  H03M1/123 ,  H03M1/56 ,  H04N5/347 ,  H04N5/3559 ,  H04N5/37452 ,  H04N5/37457 ,  H04N5/378 ,  H04N9/045 ,  H04N2209/045

Abstract: A solid-state imaging device includes a pixel signal processing unit including a plurality of pixels; a plurality of first charge storage circuits which are configured to hold the first signal charges generated by the photoelectric conversion units and output first signal voltages as first pixel signals; and a plurality of second charge storage circuits which are configured to hold second signal charges and output second signal voltages, and a differential analog/digital conversion unit includes: a plurality of first differential calculation units; a plurality of first analog/digital conversion units which are configured to perform analog/digital conversion to the first differential pixel signals and output digital values indicating magnitudes of the first differential pixel signals; and a plurality of second analog/digital conversion units which are configured to perform analog/digital conversion to the second pixel signal and output digital values indicating magnitudes of the second pixel signals.

Abstract translation: 固态成像装置包括：像素信号处理单元，包括多个像素; 多个第一电荷存储电路，被配置为保持由光电转换单元生成的第一信号电荷，并输出第一信号电压作为第一像素信号; 以及多个第二电荷存储电路，被配置为保持第二信号电荷并输出第二信号电压，并且差分模拟/数字转换单元包括：多个第一差分计算单元; 多个第一模拟/数字转换单元，被配置为对第一差分像素信号执行模拟/数字转换，并输出指示第一差分像素信号的幅度的数字值; 以及多个第二模拟/数字转换单元，被配置为对第二像素信号执行模拟/数字转换，并输出指示第二像素信号幅度的数字值。

公开(公告)号：US09142689B2

公开(公告)日：2015-09-22

申请号：US13959179

申请日：2013-08-05

Applicant: OLYMPUS CORPORATION

Inventor： Toru Kondo

IPC: H01L27/146 ,  H01L31/02

CPC classification number: H01L31/02 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464

Abstract: A solid-state imaging apparatus in which a first substrate, a second substrate electrically connected to the first substrate through a connector and circuit elements disposed in the first substrate and in the second substrate, and forming pixels, each of the pixels includes a photoelectric conversion element disposed in the first substrate and configured to generate a signal corresponding to an amount of incident light, and a signal holder disposed in the second substrate in correspondence with the photoelectric conversion element and configured to hold an output signal corresponding to the signal generated by the corresponding photoelectric conversion element, and the signal holder is formed by laminating a capacitance element including a plurality of electrodes on a plurality of layers within the second substrate.

Abstract translation: 一种固态成像装置，其中第一基板，通过连接器电连接到第一基板的第二基板和设置在第一基板和第二基板中的电路元件以及形成像素，每个像素包括光电转换 元件，设置在第一基板中，并且被配置为产生对应于入射光量的信号;以及信号保持器，其与光电转换元件对应地设置在第二基板中，并且被配置为保持与由该光电转换元件产生的信号相对应的输出信号 相应的光电转换元件，并且信号保持器通过在第二基板内的多个层上层叠包括多个电极的电容元件而形成。

公开(公告)号：US09059056B2

公开(公告)日：2015-06-16

申请号：US13677952

申请日：2012-11-15

Applicant: OLYMPUS CORPORATION

Inventor： Toru Kondo

IPC: H04N3/14 ,  H01L27/146 ,  H04N5/335 ,  H04N5/369

CPC classification number: H01L27/14609 ,  H01L27/14634 ,  H01L27/14636 ,  H04N5/369

Abstract: A solid-state imaging device and an imaging device are capable of transferring a control signal to pixels formed in each chip of the solid-state imaging device, in which the plurality of chips are connected to each other, without an increase in a circuit size of the solid-state imaging device or an increase in the number of connectors between the chips. The solid-state imaging device, in which first and second substrates are electrically connected to each other via the connectors, includes a pixel unit in which a plurality of pixels each including a photoelectric conversion element disposed in the first substrate and a reading circuit disposed in the second substrate are arrayed two-dimensionally, and a read control circuit that controls reading of a signal from the pixels. The read control circuit includes a pulse generation unit and a logical unit.

Abstract translation: 固态成像装置和成像装置能够将控制信号传送到固态成像装置的每个芯片中形成的像素，其中多个芯片彼此连接，而不增加电路尺寸 的固态成像装置或芯片之间的连接器数量的增加。 其中第一和第二基板经由连接器彼此电连接的固态成像装置包括像素单元，其中包括设置在第一基板中的光电转换元件和设置在第一基板中的读取电路的多个像素 第二基板二维排列，以及读取控制电路，其控制来自像素的信号的读取。 读取控制电路包括脉冲产生单元和逻辑单元。

公开(公告)号：US20130229560A1

公开(公告)日：2013-09-05

申请号：US13786023

申请日：2013-03-05

Applicant: OLYMPUS CORPORATION

Inventor： Toru Kondo

IPC: H04N5/374

CPC classification number: H04N5/374 ,  H04N5/3745 ,  H04N5/37452

Abstract: A solid-state image pickup device according to one aspect of the present invention includes, but is not limited to: first and second substrates on which circuit elements constituting a pixel; a coupler electrically coupling the first and second substrates; a first photoelectric conversion element on the first substrate; a first amplifier circuit on the first substrate; a first storing unit on the second substrate; and an output circuit on the second substrate. The first photoelectric conversion element performs photoelectric conversion on a first incident light to generate a first signal. The first amplifier circuit is coupled in series to the first photoelectric conversion element. The first amplifier circuit amplifies the first signal to generate a first amplified signal and output the first amplified signal to the coupler. The first storing unit stores the first amplified signal. The output circuit sequentially outputs the first amplified signal stored.

Abstract translation: 根据本发明的一个方面的固态图像拾取装置包括但不限于：构成像素的电路元件的第一和第二基板; 电耦合所述第一和第二基板的耦合器; 第一基板上的第一光电转换元件; 第一基板上的第一放大电路; 在所述第二基板上的第一存储单元; 以及在第二基板上的输出电路。 第一光电转换元件在第一入射光上进行光电转换以产生第一信号。 第一放大器电路与第一光电转换元件串联耦合。 第一放大器电路放大第一信号以产生第一放大信号，并将第一放大信号输出到耦合器。 第一存储单元存储第一放大信号。 输出电路依次输出存储的第一放大信号。