公开(公告)号：US10084158B2

公开(公告)日：2018-09-25

申请号：US15160001

申请日：2016-05-20

Applicant: OSRAM OLED GmbH

Inventor： Evelyn Trummer-Sailer ,  Simon Schicktanz ,  Tobias Pohl-Zander

IPC: H01L51/52 ,  H01L51/56

CPC classification number: H01L51/529 ,  H01L51/0096 ,  H01L51/52 ,  H01L51/5206 ,  H01L51/524 ,  H01L51/56 ,  H01L2251/5323 ,  Y02E10/549 ,  Y02P70/521

Abstract: The invention relates to an optoelectronic component (100) comprising an organic light emitting diode (1) designed for emitting radiation and/or heat, a substrate (2), on which the organic light emitting diode is arranged, wherein the substrate (2) comprises a first substrate material (21) and at least one substrate cavity (22) which is filled with a second substrate material (23) different than the first substrate material (21), wherein the second substrate material (23) is designed to dissipate the heat emitted by the organic light emitting diode (1).

公开(公告)号：US20180205041A1

公开(公告)日：2018-07-19

申请号：US15874745

申请日：2018-01-18

Applicant: OSRAM OLED GmbH

Inventor： Richard Baisl ,  Philipp Schwamb ,  Simon Schicktanz ,  Johannes Rosenberger

IPC: H01L51/56 ,  H01L51/50 ,  H01L51/52 ,  H01L51/00

Abstract: A method for producing an organic electronic device is disclosed. In an embodiment the method includes applying an organic material to a substrate to form at least one organic functional layer, applying a patterned electrode material to the at least one organic functional layer by a first mask, and removing the organic material from regions which are free of the electrode material.

公开(公告)号：US09887360B2

公开(公告)日：2018-02-06

申请号：US15541720

申请日：2016-01-05

Applicant: OSRAM OLED GmbH

Inventor： Stefan Hartinger ,  Simon Schicktanz ,  Thorsten Vehoff

IPC: H01L21/00 ,  H01L51/00 ,  H01L51/52

CPC classification number: H01L51/0023 ,  H01L51/5203 ,  H01L51/5209 ,  H01L51/5225

Abstract: A method for producing an organic light-emitting component is disclosed with providing a carrier, forming a first electrode over the carrier, forming an organic functional layer structure over the first electrode, and forming a second electrode over the functional layer structure. The first and second electrodes and the functional layer structure overlap in an optically active region which extends in the lateral direction and is embodied to generate light. In an optically inactive region extending over the carrier in the lateral direction, an electrically conductive contact layer is formed over the carrier, so that it is in direct physical and electrical contact with the first electrode and/or the second electrode. A first contact section and at least one second contact section of the layer are separated from one another by a lithographic process, so that they are electrically insulated from one another. The layer is structured by a laser beam.

公开(公告)号：US09692004B2

公开(公告)日：2017-06-27

申请号：US14909066

申请日：2014-07-30

Applicant: OSRAM OLED GmbH

Inventor： Benjamin Claus Krummacher ,  Simon Schicktanz

IPC: H01L51/52 ,  H01L23/00 ,  H01L25/04 ,  H01L27/32

CPC classification number: H01L51/52 ,  H01L24/01 ,  H01L25/048 ,  H01L27/3202 ,  H01L27/3204 ,  H01L51/5203 ,  H01L51/524 ,  H01L2251/5361 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention relates to an optoelectronic component with a first substrate, a second substrate, a functional layer stack, a lateral first recess and a first contact surface, the layer stack being arranged between the first substrate and the second substrate. Said layer stack comprises an organically active area for producing electromagnetic radiation, and the component has a first lateral surface. The first recess extends in the lateral direction to the first lateral surface and in the vertical direction through the second substrate.

公开(公告)号：US09583740B2

公开(公告)日：2017-02-28

申请号：US15029678

申请日：2014-10-16

Applicant: OSRAM OLED GmbH

Inventor： Joerg Farrnbacher ,  Simon Schicktanz

IPC: H01L33/00 ,  H01L51/56 ,  H01L23/00 ,  H01L51/52

CPC classification number: H01L51/56 ,  H01L24/72 ,  H01L51/5203 ,  H01L51/524 ,  H01L51/5243 ,  H01L51/5246 ,  H01L51/5253 ,  H01L2224/32225 ,  H01L2251/5361 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/00

Abstract: An optoelectronic component include a carrier body, an optoelectronic layer structure formed above the carrier body and having at least one contact region for contacting the optoelectronic layer structure, a covering body arranged above the optoelectronic layer structure, at least one contact cutout extending through the covering body and/or the carrier body. The contact cutout has a first and a second cutout regions, which lead into one another and which extend from an outer surface of the covering body and/or of the carrier body in a layer plane direction where the contact region is formed. A first clear width of the contact cutout near the corresponding outer surface in the first cutout region is greater than a second clear width in the second cutout region near the corresponding outer surface. The second clear width is less than a third clear width of the second cutout region near the contact region.

Abstract translation: 光电子部件包括载体主体，形成在载体主体上方的光电子层结构，并具有用于接触光电子层结构的至少一个接触区域，布置在光电子层结构上方的覆盖体，延伸穿过覆盖层的至少一个触点切口 身体和/或载体体。 接触切口具有第一和第二切口区域，该第一切口区域和第二切口区域彼此引导，并且在形成接触区域的层平面方向上从覆盖体和/或载体主体的外表面延伸。 在第一切除区域中相应的外表面附近的接触切口的第一透明宽度大于相应外表面附近的第二切口区域中的第二透明宽度。 第二透明宽度小于接触区域附近的第二切除区域的第三透明宽度。

公开(公告)号：US20160276630A1

公开(公告)日：2016-09-22

申请号：US15029678

申请日：2014-10-16

Applicant: OSRAM OLED GMBH

Inventor： Joerg Farrnbacher ,  Simon Schicktanz

IPC: H01L51/56 ,  H01L51/52

CPC classification number: H01L51/56 ,  H01L24/72 ,  H01L51/5203 ,  H01L51/524 ,  H01L51/5243 ,  H01L51/5246 ,  H01L51/5253 ,  H01L2224/32225 ,  H01L2251/5361 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/00

Abstract: An optoelectronic component include a carrier body, an optoelectronic layer structure formed above the carrier body and having at least one contact region for contacting the optoelectronic layer structure, a covering body arranged above the optoelectronic layer structure, at least one contact cutout extending through the covering body and/or the carrier body. The contact cutout has a first and a second cutout regions, which lead into one another and which extend from an outer surface of the covering body and/or of the carrier body in a layer plane direction where the contact region is formed. A first clear width of the contact cutout near the corresponding outer surface in the first cutout region is greater than a second clear width in the second cutout region near the corresponding outer surface. The second clear width is less than a third clear width of the second cutout region near the contact region.

Abstract translation: 光电子部件包括载体主体，形成在载体主体上方的光电子层结构，并具有用于接触光电子层结构的至少一个接触区域，布置在光电子层结构上方的覆盖体，延伸穿过覆盖层的至少一个触点切口 身体和/或载体体。 接触切口具有第一和第二切口区域，该第一切口区域和第二切口区域彼此引导，并且在形成接触区域的层平面方向上从覆盖体和/或载体主体的外表面延伸。 在第一切除区域中相应的外表面附近的接触切口的第一透明宽度大于相应外表面附近的第二切口区域中的第二透明宽度。 第二透明宽度小于接触区域附近的第二切除区域的第三透明宽度。

公开(公告)号：US09299748B2

公开(公告)日：2016-03-29

申请号：US14648888

申请日：2013-11-18

Applicant: OSRAM OLED GmbH

Inventor： Simon Schicktanz ,  Erwin Lang

IPC: H01L27/30 ,  H01L27/32 ,  H01L27/28

CPC classification number: H01L27/288 ,  H01L2251/5361 ,  H01L2251/562

Abstract: An organic optoelectronic component includes a substrate embodied in a light-transmissive fashion, an organic light-emitting element having an organic light-emitting layer between two electrodes, and an organic light-detecting element having an organic light-detecting layer. The organic light-emitting element and the organic light-detecting element are arranged on the substrate. Part of the light generated by the organic light-emitting element during operation enters into the substrate, emerges from the substrate and is detected by the organic light-detecting element.

Abstract translation: 有机光电子部件包括以透光方式实现的基板，在两个电极之间具有有机发光层的有机发光元件和具有有机光检测层的有机光检测元件。 有机发光元件和有机光检测元件设置在基板上。 在操作期间由有机发光元件产生的光的一部分进入基板，从基板出射并被有机光检测元件检测。

公开(公告)号：US11114648B2

公开(公告)日：2021-09-07

申请号：US15109030

申请日：2015-01-20

Applicant: Covestro Deutschland AG ,  OSRAM OLED GmbH

Inventor： Heinz Pudleiner ,  Klaus Meyer ,  Benjamin Krummacher ,  Simon Schicktanz

IPC: H01L51/52 ,  H01L51/56

Abstract: The present invention relates to an organic radiation-emitting component with an active organic layer constituted to generate radiation and one or two radiation-output sides, characterised in that, on at least one radiation-output side of the component, a UV protective film is arranged and connected to the component, wherein the UV protective film contains at least one first layer (A) and a second layer (B), wherein the first layer (A) contains 0.01 to 20% by weight, with reference to the total weight of the first layer (A), of a UV absorber, and wherein the second layer (B) contains polycarbonate. Furthermore, the invention relates to the use of a component according to the invention as an organic light-emitting diode, and for lighting, especially for general lighting.

公开(公告)号：US20180358574A1

公开(公告)日：2018-12-13

申请号：US15538692

申请日：2015-12-23

Applicant: OSRAM OLED GmbH

Inventor： Dieter Musa ,  Simon Schicktanz ,  Stefan Hartinger ,  Tobias Pohl-Zander

IPC: H01L51/52 ,  H01L51/44 ,  H01L51/00

Abstract: According to the present disclosure, an organic optoelectronic component provides with a first electrode, an organic functional layer structure above the first electrode, a second electrode above the organic functional layer structure, at least one contact section for electrically contacting the organic optoelectronic component, and an electrically conductive elastomer connector which is arranged above the contact section and is electrically connected to the contact section. The contact section is electrically connected to one of the electrodes.

公开(公告)号：US10153453B2

公开(公告)日：2018-12-11

申请号：US15032879

申请日：2014-11-26

Applicant: OSRAM OLED GmbH

Inventor： Egbert Höfling ,  Simon Schicktanz

IPC: H01L51/52 ,  H01L51/00

Abstract: An electronic component includes a connection carrier having a cover surface, a first electric connection point and a second electric connection point, and an organic active area. A first electrode interconnects in an electrically conductive manner the active area and the first electric connection point. An encapsulation layer protects the active area against humidity and atmospheric gases. The electronic component can be contacted from the outside by the electric connection points and the encapsulation layer is in direct contact, in places, with the connection carrier.