摘要:
A voltage regulator integrated in a chip of semiconductor material is provided. The regulator has a first input terminal for receiving a first voltage and an output terminal for providing a regulated voltage being obtained from the first voltage, the regulator including: a differential amplifier for receiving a comparison voltage and a feedback signal being a function of the regulated voltage, and for proving a regulation signal according to a comparison between the comparison voltage and the feedback signal, the differential amplifier having a first supply terminal being coupled with a reference terminal for receiving a reference voltage and a second supply terminal, a regulation transistor having a control terminal for receiving the regulation signal, and a conduction first terminal and a conduction second terminal being coupled through loading means between the reference terminal and the first input terminal of the regulator, the second terminal of the regulation transistor being coupled with the output terminal of the regulator, wherein the second supply terminal of the differential amplifier is coupled with a second input terminal of the regulator for receiving a second voltage being lower than the first voltage in absolute value, and wherein the regulator further includes a set of auxiliary transistors being connected in series between the second terminal of the regulation transistor and the output terminal of the regulator, and control means for controlling the auxiliary transistors according to the regulated voltage.
摘要:
Voltage-boosting device having a supply input receiving a supply voltage, and a high-voltage output. The device is formed by a plurality of charge-pump stages series-connected between the supply input and the high-voltage output. Each charge-pump stage has a respective enabling input receiving an enabling signal. A control circuit formed by a plurality of comparators is connected to the high-voltage output and generates the enabling signals on the basis of the comparison between the voltage on the high-voltage output and a plurality of reference voltages, one for each comparator. The charge-pump stages are grouped into sets of stages, and the stages belonging to a same set receive a same enabling signal; thus, as many comparators as there are sets of stages are present.
摘要:
A semiconductor memory device is provided that includes memory cells, sense amplifiers, signal lines, isolating circuits, and a precharging circuit. Each signal line is coupled to an output of at least one of the sense amplifiers and each of the isolating circuits isolates an associated signal line from the output of the corresponding sense amplifier at least during an evaluating phase of the datum stored in the memory cell. The signal lines include at least two groups of signal lines, arranged such that coupling capacitances between the lines of the first group and the lines of the second group are substantially negligible. The precharging circuit precharges the first group of signal lines to a first voltage level and the second group of signal lines to a second voltage level.
摘要:
A circuit comprises at least one memory cell adapted to store data in terms of values of an electrical characteristic thereof, which exhibits a variability with temperature according to a first variation law; a voltage generator is provided for generating a voltage to be supplied to the at least one memory cell for retrieving the data stored therein, the voltage generator including first means adapted to cause the generated voltage take a value in a set of target values including at least one target value, corresponding to an operation to be performed on the memory cell. The voltage generator comprises second means for causing the value taken by the generated voltage vary with temperature according to a prescribed second variation law exploiting a compensation circuit element having said electrical characteristic.
摘要:
A semiconductor memory device is provided that includes memory cells, sense amplifiers, signal lines, isolating circuits, and a precharging circuit. Each signal line is coupled to an output of at least one of the sense amplifiers and each of the isolating circuits isolates an associated signal line from the output of the corresponding sense amplifier at least during an evaluating phase of the datum stored in the memory cell. The signal lines include at least two groups of signal lines, arranged such that coupling capacitances between the lines of the first group and the lines of the second group are substantially negligible. The precharging circuit precharges the first group of signal lines to a first voltage level and the second group of signal lines to a second voltage level.
摘要:
A multistage circuit for regulating the charge voltage or the discharge current of a capacitance of an integrated device at a certain charge-pump generated boosted voltage is implemented without integrating high voltage transistor structures having a type of conductivity corresponding to the same sign of the boosted voltage (high-side transistors). The multistage circuit current includes at least a first stage, and an output stage in cascade to the first stage and coupled to the capacitance. The first stage is supplied at an unboosted power supply voltage of the integrated device, and the output stage is supplied at an unregulated charge-pump generated boosted voltage. The first stage includes a transistor having a type of conductivity corresponding to an opposite sign of the boosted voltage and of the power supply voltage. The drain of the output stage transistor is coupled to the boosted voltage either through a resistive pull-up or a voltage limiter.
摘要:
The output voltage ripple of a single stage or a multi-stage charge pump may be significantly reduced by introducing in the voltage generator a cascode connected output transistor. In operation, this output transistor may be in a conduction state and may be controlled with a voltage having a smaller ripple than the voltage output by the charge pump.
摘要:
A multistage circuit for regulating the charge voltage or the discharge current of a capacitance of an integrated device at a certain charge-pump generated boosted voltage is implemented without integrating high voltage transistor structures having a type of conductivity corresponding to the same sign of the boosted voltage (high-side transistors). The multistage circuit current includes at least a first stage, and an output stage in cascade to the first stage and coupled to the capacitance. The first stage is supplied at an unboosted power supply voltage of the integrated device, and the output stage is supplied at an unregulated charge-pump generated boosted voltage. The first stage includes a transistor having a type of conductivity corresponding to an opposite sign of the boosted voltage and of the power supply voltage. The drain of the output stage transistor is coupled to the boosted voltage either through a resistive pull-up or a voltage limiter.
摘要:
A high-voltage switch has a high-voltage input terminal, receiving a high voltage, and an output terminal. A pass transistor, having a control terminal, is connected between the high-voltage input terminal and the output terminal. The output of a voltage-multiplying circuit of the charge-pump type is connected to the control terminal. The voltage-multiplying circuit is of a symmetrical type, has first and second charge-storage means, receiving a clock signal of a periodic type, and has a first circuit branch and a second circuit branch, which are symmetrical to one another and operate in phase opposition with respect to the clock signal.
摘要:
A trimming structure for trimming functional parameters of an Integrated Circuit—IC—(100) includes a first (115a) and at least one second functional blocks (115b, . . . ,115n) with which a first (Vrg,a) and at least one second IC functional parameters (Vrg,b, . . . ,Vrg,n) are respectively associated. The trimming structure includes respective trimmable circuit structures (205a,210a, . . . ,205n,210n) included in the first and at least one second functional blocks, and trimming configuration storage (110) for storing trimming configurations for the trimmable circuit structures. A change in the trimming configuration of the first functional block causes a corresponding change in the trimming configuration of the second functional block. Further, a change in the second IC functional parameter in response to the corresponding change in the trimming configuration of the second functional block is proportional to the change in the first IC functional parameter consequent to the change in the trimming configuration of the first functional block.