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公开(公告)号：US07763949B2
公开(公告)日：2010-07-27
申请号：US10833527
申请日：2004-04-28
IPC分类号： H01L21/56
CPC分类号： G02B1/14 , B81B7/0012 , B81B2201/042 , G02B1/105 , G02B26/0833 , G03B27/42 , G03F7/70291 , G03F7/70983
摘要： A process for protecting a MEMS device used in a UV illuminated application from damage due to a photochemical activation between the UV flux and package gas constituents, formed from the out-gassing of various lubricants and passivants put in the device package to prevent sticking of the MEMS device's moving parts. This process coats the exposed surfaces of the MEMS device and package's optical window surfaces with a metal-halide film to eliminate this photochemical activation and therefore significantly extend the reliability and lifetime of the MEMS device.
摘要翻译： 用于保护在紫外线照射应用中使用的MEMS器件的过程不会由于UV通量和封装气体成分之间的光化学活化而损坏，所述UV通量和封装气体成分由放置在器件封装中的各种润滑剂和钝化剂的排出物形成，以防止粘附 MEMS器件的运动部件。 该方法用金属卤化物膜涂覆MEMS器件和封装的光学窗表面的暴露表面以消除该光化学活化，因此显着地延长了MEMS器件的可靠性和使用寿命。
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22.发明授权公开(公告)号：US07502155B2
公开(公告)日：2009-03-10
申请号：US11080727
申请日：2005-03-15
申请人： Paul G. Sudak , Robert L. Adams , Jason M. Neidrich , Simon Joshua Jacobs , Lisa Ann Wesneski , Linda M. Wills , William D. Carter , Judith C. Frederic
发明人： Paul G. Sudak , Robert L. Adams , Jason M. Neidrich , Simon Joshua Jacobs , Lisa Ann Wesneski , Linda M. Wills , William D. Carter , Judith C. Frederic
CPC分类号： G02B26/0841 , B81B3/0083 , B81B2201/042 , G02B5/003 , G02B5/22 , G02B27/0018
摘要： According to one embodiment of the present invention, a semiconductor device includes a first layer of dielectric material disposed upon an upper surface of a substrate of a semiconductor device and a first non-conductive layer of metal disposed upon an upper surface of the dielectric material. The first layer of dielectric material and the first non-conductive layer of metal act as an optical trap for electromagnetic radiation received by the first non-conductive layer of metal. In particular embodiments, the semiconductor device may further comprise a second layer of dielectric material disposed upon an upper surface of the first non-conductive layer of metal and a second non-conductive layer of metal disposed upon an upper surface of the second layer of dielectric material.
摘要翻译： 根据本发明的一个实施例，半导体器件包括设置在半导体器件的衬底的上表面上的第一绝缘材料层和设置在电介质材料的上表面上的金属的第一非导电层。 介电材料的第一层和金属的第一非导电层用作由第一非导电金属层接收的用于电磁辐射的光阱。 在特定实施例中，半导体器件还可以包括设置在金属的第一非导电层的上表面上的第二介电材料层和设置在第二绝缘层的上表面上的金属的第二非导电层 材料。
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公开(公告)号：US20080290325A1
公开(公告)日：2008-11-27
申请号：US12185094
申请日：2008-08-03
IPC分类号： H01B1/00
CPC分类号： B81B3/0005 , B81B2201/042 , B81C2201/112 , B82Y30/00
摘要： Phosphonate surfactants are employed to passivate the surfaces of MEMS devices, such as digital micromirror devices. The surfactants are adsorbed from vapor or solution to form self-assembled monolayers at the device surface. The higher binding energy of the phosphonate end groups (as compared to carboxylate surfactants) improves the thermal stability of the resulting layer.
摘要翻译： 磷酸盐表面活性剂用于钝化MEMS器件的表面，例如数字微镜器件。 表面活性剂从蒸气或溶液中吸附，在器件表面形成自组装单层。 膦酸酯端基（与羧酸酯表面活性剂相比）的较高的结合能改善了所得层的热稳定性。
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公开(公告)号：US07009745B2
公开(公告)日：2006-03-07
申请号：US10699410
申请日：2003-10-31
IPC分类号： G02B26/08
CPC分类号： G02B26/0841 , B81B3/0005 , B81B3/0083 , B81B2201/042 , B81C1/0096 , B81C2201/112 , G02B1/115 , Y10S359/90
摘要： A micromechanical device having a deflectable member which contacts a stationary member. An antireflective coating is applied to portions of the micromechanical device to limit undesired reflection from the device. A passivation or lubrication layer is applied to the device to reduce stiction between the deflectable member and the stationary member. An insulator layer is utilized between the antireflective coating and the lubrication layer to prevent photoelectric-induced breakdown of the lubrication layer.
摘要翻译： 一种具有接触固定构件的偏转构件的微机械装置。 将抗反射涂层施加到微机械装置的部分以限制来自装置的不期望的反射。 钝化或润滑层被施加到该装置上以减少可偏转构件与固定构件之间的粘连。 在抗反射涂层和润滑层之间使用绝缘体层以防止润滑层的光电引起的击穿。
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公开(公告)号：US06787187B2
公开(公告)日：2004-09-07
申请号：US10036698
申请日：2001-12-31
申请人： Simon Joshua Jacobs
发明人： Simon Joshua Jacobs
IPC分类号： C23C1650
CPC分类号： B81C1/00896 , G02B26/0841
摘要： A method of fabricating a micromechanical device. Several of the micromechanical devices are fabricated 20 on a common wafer. After the devices are fabricated, the sacrificial layers are removed 22 leaving open spaces where the sacrificial layers once were. These open spaces allow for movement of the components of the micromechanical device. The devices optionally are passivated 24, which may include the application of a lubricant. After the devices have been passivated, they are tested 26 in wafer form. After testing 26, any surface treatments that are not compatible with the remainder of the processing steps are removed 28. The substrate wafer containing the completed devices receives a conformal overcoat 30. The overcoat layer is thick enough to project the micromechanical structures, but thin and light enough to prevent deforming the underlying micromechanical structures. Once the devices on the wafer are overcoated, the wafer is separated 32, and the known good devices are cleaned 34 to remove debris left by the dicing process. Once the devices are separated and cleaned, the overcoat may be removed, however, the overcoat typically is left in place to protect the device during the initial stages of the packaging process. Typically the devices are mounted 36 in the package substrate, the overcoat removed 38 from the devices, and the package containing the micromechanical device finished by sealing the package to enclose the device.
摘要翻译： 一种制造微机械装置的方法。 几个微机械器件在公共晶片上制造20。 在器件制造之后，去除牺牲层22，留下牺牲层一次的开放空间。 这些开放空间允许微机械装置的部件移动。 所述装置可选地被钝化24，其可以包括施加润滑剂。 在器件被钝化之后，它们以晶片形式被测试26。 在测试26之后，除去与其余处理步骤不相容的任何表面处理。含有完成的器件的衬底晶片接收共形外涂层30.该外涂层足够厚以使微机械结构突出，但是薄和 光足以防止底层微机械结构变形。 一旦晶片上的器件被覆盖，晶片被分离32，并且已知的良好器件被清洁34以去除由切割工艺留下的残留物。 一旦设备被分离和清洁，可以去除外涂层，然而，外包层通常留在适当位置以在包装过程的初始阶段保护装置。 通常，将器件安装在封装衬底36中，从器件移除外涂层38，并且将包含微机械器件的封装通过密封封装封闭器件而完成。
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