公开(公告)号：US11262498B2

公开(公告)日：2022-03-01

申请号：US16945569

申请日：2020-07-31

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Gerald Cois Byrd ,  Chia-Te Chou ,  Karlheinz Muth

IPC: G02B6/12 ,  G02B6/42 ,  H01L25/16 ,  H04B10/25 ,  H04B10/40

Abstract: An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.

公开(公告)号：US20210141172A1

公开(公告)日：2021-05-13

申请号：US17092151

申请日：2020-11-06

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Yi Zhang ,  Chia-Te Chou ,  William Vis ,  Amit Singh Nagra ,  Hooman Abediasl

IPC: G02B6/42 ,  B41F16/00

Abstract: An optoelectronic device. The device comprising: a silicon-on-insulator, SOI, wafer, the SOI wafer including a cavity and an input waveguide, the input waveguide being optically coupled into the cavity; and a mirror, located within the cavity and bonded to a bed thereof, the mirror including a reflector configured to reflect light received from the input waveguide in the SOI wafer.

公开(公告)号：US20200161243A1

公开(公告)日：2020-05-21

申请号：US16690054

申请日：2019-11-20

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： SEUNGJAE LEE ,  Brett Sawyer ,  Chia-Te Chou

IPC: H01L23/538 ,  H01L23/31 ,  H01L21/56 ,  H01L21/78

Abstract: A system integrating a fan-out package, including a first semiconductor die, with a second semiconductor die. In some embodiments the fan-out package includes the first semiconductor die, a mold compound, covering the first semiconductor die on at least two sides, and an electrical contact, on a lower surface of the first semiconductor die. The fan-out package may have a rabbet along a portion of a lower edge of the fan-out package.