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公开(公告)号:US20250069790A1
公开(公告)日:2025-02-27
申请号:US18633825
申请日:2024-04-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Boum Seock KIM , Byeong Cheol MOON , Sang Jin KIM , Ju Hyoung PARK
Abstract: A coil component, may include: a body having a first surface and a second surface facing each other in a first direction; a support member disposed within the body; a coil disposed on the support member; an external electrode disposed on the first surface of the body; and a connection portion disposed within the body to connect the coil and the external electrode, the connection portion having one surface in contact with the coil and another surface in contact with the external electrode, in which the connection portion may include a fused portion formed at an end in contact with the coil.
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公开(公告)号:US20240221989A1
公开(公告)日:2024-07-04
申请号:US18387792
申请日:2023-11-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Byeong Cheol MOON , Han LEE , Sang Jin KIM , Boum Seock KIM
CPC classification number: H01F27/006 , H01F27/2823 , H01F27/29
Abstract: A coil component includes a body, a first coil and a second coil disposed within the body to be spaced apart from each other in a first direction, parallel to a central axis, a first conductive via connecting the first and second coils to each other, a third coil and a fourth coil disposed within the body to be spaced apart from each other in the first direction, a second conductive via connecting the third and fourth coils to each other, a first additional pattern connected to the first coil by a first additional via, first and second external electrodes disposed on the body and respectively connected to the first and second coils, and third and fourth external electrodes disposed on the body and respectively connected to the third and fourth coils.
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公开(公告)号:US20150195457A1
公开(公告)日:2015-07-09
申请号:US14218358
申请日:2014-03-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Sang Jin KIM , Hee Yong YOO
CPC classification number: H04N5/23287 , H04N5/23258 , H04N2101/00
Abstract: An apparatus for image correction may include a first sensor sensing movement of a camera module, a lens control unit adjusting a position of a lens in the camera module in accordance with the movement of the camera module sensed by the first sensor; a second sensor sensing the position of the lens, an error vector calculation unit calculating an error vector based on the movement of the camera module sensed by the first sensor and the position of the lens sensed by the second sensor, and a correction unit correcting an image from the camera module based on the error vector.
Abstract translation: 用于图像校正的装置可以包括:感测相机模块的移动的第一传感器,透镜控制单元,其根据由第一传感器感测到的相机模块的移动来调整相机模块中的透镜的位置; 感测透镜位置的第二传感器,基于由第一传感器感测到的相机模块的移动和由第二传感器感测的透镜的位置来计算误差向量的误差向量计算单元,以及校正单元 基于误差向量的相机模块的图像。
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公开(公告)号:US20140234955A1
公开(公告)日:2014-08-21
申请号:US13866821
申请日:2013-04-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Bo Sung KU , Sang Jin KIM
IPC: C12M1/34
Abstract: There is provided a cell culture device including a cell chip receiving part coupled to a cell chip and having at least one passage through which a liquid-type medium is circulated, and a vortex generation part formed in the passage to generate a vortex in the liquid-type medium.
Abstract translation: 提供了一种细胞培养装置,其包括与细胞芯片连接的细胞芯片接收部分,并且具有至少一个通过液体介质循环的通道,以及形成在通道中以在液体中产生涡流的涡流发生部分 型介质。
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公开(公告)号:US20140113364A1
公开(公告)日:2014-04-24
申请号:US13735483
申请日:2013-01-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Sang Jin KIM , Dong Woo LEE , Bo Sung KU
IPC: C12Q1/02
CPC classification number: C12M29/00 , B01L3/502715 , B01L2200/027 , B01L2200/028 , B01L2200/16 , B01L2300/0816 , B01L2300/088 , B01L2300/0883 , B01L2300/10 , B01L2300/185 , C12M23/04 , C12M23/34 , C12M27/20
Abstract: There is provided a cell culture device including: a cell chip receiving part receiving a cell chip; a drug storing part storing a drug; and a circulation part connecting the cell chip receiving part and the drug storing part to one another and circulating the drug therebetween. The cell culture device may allow for the observation or examination of a reaction between a cell and a drug in an environment similar to that of the inside of a body.
Abstract translation: 提供了一种细胞培养装置,包括:接收细胞芯片的细胞芯片接收部; 存储药物的药物储存部; 以及将细胞芯片接收部和药物储存部彼此连接并使药物循环的循环部。 细胞培养装置可以允许在类似于身体内部的环境中观察或检查细胞和药物之间的反应。
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公开(公告)号:US20140045256A1
公开(公告)日:2014-02-13
申请号:US13934941
申请日:2013-07-03
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Dong Woo LEE , Bo Sung KU , Sang Jin KIM , Moo-Yeal LEE
IPC: C12M3/06
Abstract: There is provided a cell chip including: a first substrate having biomaterials fixed thereto; a second substrate provided with one or more receiving space in which a culture medium is stored; and a circulation unit circulating the culture medium stored in the receiving space.
Abstract translation: 提供了一种电池芯片,包括:固定有生物材料的第一基板; 设置有存储培养基的一个或多个接收空间的第二基板; 以及循环单元,循环存储在接收空间中的培养基。
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公开(公告)号:US20130299081A1
公开(公告)日:2013-11-14
申请号:US13801062
申请日:2013-03-13
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Sang Jin KIM , Byung Jae Kim , Sung Jae Lee , Seung Hee Cho
IPC: H05K13/04
CPC classification number: H05K13/0413 , H05K13/0469 , H05K13/0812 , Y10T156/10 , Y10T156/17
Abstract: An apparatus and a method for manufacturing a camera module. The method for manufacturing a camera module includes: picking up an image sensor by the bonding head and mounting the image sensor on a PCB; compensating for a tilt deviation between the PCB and the image sensor by the gyro unit of the PCB support unit simultaneously when the image sensor is mounted on the PCB; applying heat by the heating unit of the bonding head to cure an adhesive applied between the image sensor and the PCB; and after the image sensor is mounted and the adhesive is cured, picking up a lens housing module by a lens housing module pickup unit and mounting the lens housing module on the PCB and attaching contact portions of the PCB to the lens housing module to complete the manufacture of a camera module.
Abstract translation: 一种用于制造相机模块的装置和方法。 制造相机模块的方法包括:通过接合头拾取图像传感器并将图像传感器安装在PCB上; 当图像传感器安装在PCB上时,通过PCB支撑单元的陀螺仪单元同时补偿PCB和图像传感器之间的倾斜偏差; 通过接合头的加热单元施加热量以固化施加在图像传感器和PCB之间的粘合剂; 并且在安装了图像传感器并且粘合剂固化之后,通过透镜壳体模块拾取单元拾取透镜壳体模块并将透镜壳体模块安装在PCB上,并将PCB的接触部分附接到透镜壳体模块以完成 制造相机模块。
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