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公开(公告)号:US10263221B2
公开(公告)日:2019-04-16
申请号:US15922288
申请日:2018-03-15
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Akihiro Chida , Kaoru Hatano , Tomoya Aoyama , Ryu Komatsu , Masatoshi Kataniwa
Abstract: A method for exposing an electrode terminal covered with an organic film in a light-emitting device without damaging the electrode terminal is provided. In a region of the electrode terminal to which electric power from an external power supply or an external signal is input, an island-shaped organic compound-containing layer is formed and the organic film is formed thereover. The organic film is removed by utilizing low adhesion of an interface between the organic compound-containing layer and the electrode terminal, whereby the electrode terminal can be exposed without damage to the electrode terminal.
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公开(公告)号:US10241630B2
公开(公告)日:2019-03-26
申请号:US15041426
申请日:2016-02-11
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Akihiro Chida
Abstract: Provided is a novel functional panel that is highly convenient or reliable, a manufacturing method of the novel functional panel that is highly convenient or reliable, a novel light-emitting device that is highly convenient or reliable, or a novel data processing device that is highly convenient or reliable. One embodiment of the present invention includes a release layer, a first base including a region overlapping with the release layer, a terminal between the release layer and the first base, a second base including a region overlapping with the first base, a bonding layer between the first base and the second base. The terminal includes a region not overlapping with the bonding layer.
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公开(公告)号:US10080302B2
公开(公告)日:2018-09-18
申请号:US14255183
申请日:2014-04-17
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Akihiro Chida , Hisao Ikeda , Yoshiharu Hirakata
CPC classification number: H05K7/14 , G06F1/1616 , G06F1/1683 , G09F9/30 , G09F9/301 , G09F9/33 , G09F9/35 , H05K1/028 , H05K1/0283 , H05K1/147 , H05K1/189
Abstract: A novel foldable and highly portable display device is provided. Further, a novel display device capable of displaying information or the like on a seamless large screen is provided. The display device includes a flexible display panel, a first housing provided with a storage portion that includes a space in which pulled one end of the display panel is stored, a folding mechanism connected to the first housing, and a second housing connected to the folding mechanism. The other end of the display panel is connected to the second housing so that the display panel can be drawn in accordance with an opening operation of the folding mechanism and stored in accordance with a closing operation of the folding mechanism.
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公开(公告)号:US09997576B2
公开(公告)日:2018-06-12
申请号:US15456887
申请日:2017-03-13
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Yasuhiro Jinbo , Kohei Yokoyama , Yuki Tamatsukuri , Naoto Goto , Masami Jintyou , Masayoshi Dobashi , Masataka Nakada , Akihiro Chida , Naoyuki Senda
CPC classification number: H01L27/3258 , H01L51/5253 , H01L2251/301 , H01L2251/5338
Abstract: To provide a display device with a manufacturing yield and/or a display device with suppressed mixture of colors between adjacent pixels. The display device includes a first pixel electrode, a second pixel electrode, a first insulating layer, a second insulating layer, and an adhesive layer. The first insulating layer includes a first opening. The second insulating layer includes a second opening. The first opening and the second opening are provided between the first pixel electrode and the second pixel electrode. In a top view, a periphery of the second opening is positioned on an inner side than a periphery of the first opening. The adhesive layer has a region overlapping with the second insulating layer below the second insulating layer.
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25.
公开(公告)号:US20180114942A1
公开(公告)日:2018-04-26
申请号:US15839059
申请日:2017-12-12
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Akihiro Chida
CPC classification number: H01L51/5246 , H01L27/322 , H01L27/3262 , H01L27/3276 , H01L51/0097 , H01L51/56 , H01L2227/323 , H01L2251/5338 , H01L2251/558 , Y02E10/549 , Y02P70/521
Abstract: A light-emitting element, a bonding layer, and a frame-like partition are formed over a substrate. The partition is provided to surround the bonding layer and the light-emitting element, with a gap left between the partition and the bonding layer. A pair of substrates overlap with each other under a reduced-pressure atmosphere and then exposed to an air atmosphere or a pressurized atmosphere, whereby the reduced-pressure state of a space surrounded by the pair of substrates and the partition is maintained and atmospheric pressure is applied to the pair of substrates. Alternatively, a light-emitting element and a bonding layer are formed over a substrate. A pair of substrates overlap with each other, and then, pressure is applied to the bonding layer with the use of a member having a projection before or at the same time as curing of the bonding layer.
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公开(公告)号:US09887392B2
公开(公告)日:2018-02-06
申请号:US14628461
申请日:2015-02-23
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Tatsuya Sakuishi , Daiki Nakamura , Akihiro Chida , Tomoya Aoyama
CPC classification number: H01L51/56 , B32B38/105 , B32B2310/0843 , B32B2457/20 , H01L27/1218 , H01L27/1225 , H01L27/124 , H01L27/1266 , H01L27/322 , H01L27/3276 , H01L29/78603 , H01L51/0024 , H01L51/003 , H01L51/0097 , H01L2227/323 , H01L2227/326 , H01L2251/5338
Abstract: A method for manufacturing a display device is provided. The method includes forming a display element interposed between a first substrate and a second substrate and peeling the second substrate from the first substrate so that an electrode, which is located between the first and second substrates and to be connected to an external electrode, is exposed simultaneously with the peeling of the second substrate.
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27.
公开(公告)号:US09847505B2
公开(公告)日:2017-12-19
申请号:US14882918
申请日:2015-10-14
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Akihiro Chida
CPC classification number: H01L51/5246 , H01L27/322 , H01L27/3262 , H01L27/3276 , H01L51/0097 , H01L51/56 , H01L2227/323 , H01L2251/5338 , H01L2251/558 , Y02E10/549 , Y02P70/521
Abstract: A light-emitting element, a bonding layer, and a frame-like partition are formed over a substrate. The partition is provided to surround the bonding layer and the light-emitting element, with a gap left between the partition and the bonding layer. A pair of substrates overlap with each other under a reduced-pressure atmosphere and then exposed to an air atmosphere or a pressurized atmosphere, whereby the reduced-pressure state of a space surrounded by the pair of substrates and the partition is maintained and atmospheric pressure is applied to the pair of substrates. Alternatively, a light-emitting element and a bonding layer are formed over a substrate. A pair of substrates overlap with each other, and then, pressure is applied to the bonding layer with the use of a member having a projection before or at the same time as curing of the bonding layer.
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公开(公告)号:US20170358782A1
公开(公告)日:2017-12-14
申请号:US15671453
申请日:2017-08-08
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Tomoya Aoyama , Akihiro Chida , Ryu Komatsu
CPC classification number: H01L51/56 , H01L51/0024 , H01L51/003 , H01L51/524
Abstract: To improve the yield in a peeling process and improve the yield in a manufacturing process of a flexible light-emitting device or the like, a peeling method includes a first step of forming a peeling layer over a first substrate, a second step of forming a layer to be peeled including a first layer in contact with the peeling layer over the peeling layer, a third step of curing a bonding layer in an overlapping manner with the peeling layer and the layer to be peeled, a fourth step of removing part of the first layer overlapping with the peeled layer and the bonding layer to form a peeling starting point, and a fifth step of separating the peeling layer and the layer to be peeled. The peeling starting point is preferably formed by laser light irradiation.
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公开(公告)号:US09773998B2
公开(公告)日:2017-09-26
申请号:US14476154
申请日:2014-09-03
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Akihiro Chida , Tomoya Aoyama
CPC classification number: H01L51/5246 , H01L51/0097
Abstract: A highly reliable flexible light-emitting device is provided. The light-emitting device includes a first flexible substrate, a second flexible substrate, a light-emitting element between the first flexible substrate and the second flexible substrate, a first bonding layer; and a second bonding layer in a frame shape surrounding the first bonding layer. The first bonding layer and the second bonding layer are between the second flexible substrate and the light-emitting element. The light-emitting element includes layer containing a light-emitting organic compound between the pair of electrodes. The second bonding layer has a higher gas barrier property than the first bonding layer.
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公开(公告)号:US09772706B2
公开(公告)日:2017-09-26
申请号:US14692121
申请日:2015-04-21
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Tatsuya Sakuishi , Tomoya Aoyama , Akihiro Chida , Daiki Nakamura
CPC classification number: G06F3/0412 , G02F1/13338 , G06F3/044 , G06F2203/04103 , H01L27/1214 , H01L33/62 , H01L51/0097 , H01L2221/101 , H01L2251/5338
Abstract: A display device with high design flexibility is provided. The display device includes a display element, a touch sensor, and a transistor between two flexible substrates. An external electrode that supplies a signal to the display element and an external electrode that supplies a signal to the touch sensor are connected from the same surface of one of the substrates.
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