Peeling Method
    28.
    发明申请
    Peeling Method 审中-公开

    公开(公告)号:US20170358782A1

    公开(公告)日:2017-12-14

    申请号:US15671453

    申请日:2017-08-08

    CPC classification number: H01L51/56 H01L51/0024 H01L51/003 H01L51/524

    Abstract: To improve the yield in a peeling process and improve the yield in a manufacturing process of a flexible light-emitting device or the like, a peeling method includes a first step of forming a peeling layer over a first substrate, a second step of forming a layer to be peeled including a first layer in contact with the peeling layer over the peeling layer, a third step of curing a bonding layer in an overlapping manner with the peeling layer and the layer to be peeled, a fourth step of removing part of the first layer overlapping with the peeled layer and the bonding layer to form a peeling starting point, and a fifth step of separating the peeling layer and the layer to be peeled. The peeling starting point is preferably formed by laser light irradiation.

    Light-emitting device and method for manufacturing light-emitting device

    公开(公告)号:US09773998B2

    公开(公告)日:2017-09-26

    申请号:US14476154

    申请日:2014-09-03

    CPC classification number: H01L51/5246 H01L51/0097

    Abstract: A highly reliable flexible light-emitting device is provided. The light-emitting device includes a first flexible substrate, a second flexible substrate, a light-emitting element between the first flexible substrate and the second flexible substrate, a first bonding layer; and a second bonding layer in a frame shape surrounding the first bonding layer. The first bonding layer and the second bonding layer are between the second flexible substrate and the light-emitting element. The light-emitting element includes layer containing a light-emitting organic compound between the pair of electrodes. The second bonding layer has a higher gas barrier property than the first bonding layer.

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