公开(公告)号：US09953933B1

公开(公告)日：2018-04-24

申请号：US15474904

申请日：2017-03-30

Applicant: STMicroelectronics, Inc.

Inventor： Aaron Cadag ,  Rennier Rodriguez ,  Ela Mia Cadag

IPC: H01L23/552 ,  H01L23/00 ,  B32B7/12 ,  H01L21/78 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L23/552 ,  B32B7/12 ,  B32B2457/14 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/29 ,  H01L24/48 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48229 ,  H01L2224/48992 ,  H01L2924/15311 ,  H01L2924/3025

Abstract: A semiconductor package includes a substrate, a die, an insulating die attach film, a dummy die, a conductive layer, and an electrically conductive molding compound or encapsulant. The first surface of the substrate includes a plurality of internal leads, and the second surface of the substrate includes a plurality of external electrically conductive pads and an electrically conductive ground terminal. A non-conductive flow over wire die attach film is placed to surround and encase the die. The dummy die overlies the die and a conductive layer overlies the dummy die. The electrically conductive molding compound is formed to encase the various components of the semiconductor device. The electrically conductive molding compound is electrically coupled to the electrically conductive ground terminal and the conductive layer forming an EMI shield for the die in the package.