公开(公告)号：US08097121B2

公开(公告)日：2012-01-17

申请号：US12207139

申请日：2008-09-09

申请人： Masayuki Yamamoto ,  Saburo Miyamoto

发明人： Masayuki Yamamoto ,  Saburo Miyamoto

IPC分类号： B32B38/10

CPC分类号： B29C63/0013 ,  H01L21/67132 ,  Y10T156/1105 ,  Y10T156/1189 ,  Y10T156/1972 ,  Y10T156/1983

摘要： A surface height of a protective tape joined to a wafer mounted and held on a separation table is detected, an operation amount of approaching a joining member to the protective tape until a separation tape wound around the joining member contacts the protective tape based on detected information, the joining member is operation controlled to approach the protective tape based on the calculated operation amount, the joining member and the separation table are relatively moved along a direction of a surface of the protective tape in a state of maintaining the height of the joining member to join the separation tape to the protective tape, and the separation tape is separated from the surface of the wafer integrally with the protective tape.

摘要翻译： 检测接合到安装并保持在分离台上的晶片的保护带的表面高度，接合到保护带的接合构件的操作量，直到缠绕在接合构件上的分离带基于检测到的信息接触保护带 根据计算出的操作量，接合构件被操作控制到接近保护带，接合构件和分离台在保持接合构件的高度的状态下沿着保护带的表面的方向相对移动 将分离带连接到保护带上，并且分离带与保护带一体地与晶片的表面分离。

公开(公告)号：US08062474B2

公开(公告)日：2011-11-22

申请号：US12234292

申请日：2008-09-19

申请人： Masayuki Yamamoto ,  Saburo Miyamoto

发明人： Masayuki Yamamoto ,  Saburo Miyamoto

IPC分类号： B32B38/10

CPC分类号： H01L21/67132 ,  Y10T156/1105 ,  Y10T156/1906

摘要： A surface height of a protective tape joined to a wafer mounted and held on a separation table is detected, a lowering operation distance of a needle is calculated based on such detected information, and a lowering operation amount for approaching a joining member to the protective tape until the separation tape winded around the joining member contacts the protective tape is calculated. A separating site is formed in the protective tape and the protective tape is separated while controlling a height of each member based on the calculated lowering operation amount.

摘要翻译： 检测接合到安装并保持在分离台上的晶片的保护带的表面高度，基于这种检测信息计算针的下降操作距离，以及用于接近保护带的接合构件的下降操作量 直到分离带卷绕在接合构件周围接触保护带。 分离部位形成在保护带中，并且基于计算出的降低操作量来控制每个部件的高度来分离保护带。

公开(公告)号：US07984737B2

公开(公告)日：2011-07-26

申请号：US11898831

申请日：2007-09-17

申请人： Masayuki Yamamoto ,  Saburo Miyamoto

发明人： Masayuki Yamamoto ,  Saburo Miyamoto

IPC分类号： B26D5/00

CPC分类号： B26F1/3846 ,  B26D3/085 ,  B26D5/00 ,  B26D5/02 ,  B26D5/32 ,  B26D5/34 ,  B26D7/018 ,  G01B11/06 ,  G01B21/16 ,  H01L21/67132 ,  Y10T83/0567 ,  Y10T83/175 ,  Y10T83/178 ,  Y10T83/2022 ,  Y10T83/2024 ,  Y10T83/4656 ,  Y10T83/4664 ,  Y10T83/515 ,  Y10T83/527 ,  Y10T83/533 ,  Y10T156/12 ,  Y10T156/1343

摘要： In a state that a reference plane of a cutter holder, to which a cutter blade is attached, is brought into contact with a surface of a base of a supporting adhesive tape, the cutter blade cuts the supporting adhesive tape while the reference plane of the cutter holder follows the surface of the base. Herein, a cutting edge of the cutter blade passes by a joining interface between the supporting adhesive tape and a ring frame without penetrating through an adhesive layer of the supporting adhesive tape.

摘要翻译： 在安装有切割刀片的刀架的参考平面与支撑胶带的基部的表面接触的状态下，刀片切割支撑胶带，同时， 刀架靠近基座的表面。 这里，切割刀片的切割刃通过支撑胶带和环形框架之间的接合界面而不穿透支撑胶带的粘合剂层。

公开(公告)号：US5891298A

公开(公告)日：1999-04-06

申请号：US973859

申请日：1997-12-30

申请人： Shigeji Kuroda ,  Takao Matsushita ,  Saburo Miyamoto

发明人： Shigeji Kuroda ,  Takao Matsushita ,  Saburo Miyamoto

IPC分类号： H01L21/00 ,  H01L21/56 ,  B32B35/00

CPC分类号： H01L21/67132 ,  H01L21/56 ,  H01L21/67121 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68395 ,  H01L2924/0002 ,  Y10S156/941 ,  Y10T156/1179 ,  Y10T156/19

摘要： A method and apparatus for peeling protective adhesive tape 3 from work having the protective adhesive tape 3 applied to a surface of a semiconductor wafer W supported in a ring-shaped frame F by means of a supporting adhesive tape 1. Thin plates 4 with non-adhesive upper surfaces are applied to the supporting adhesive tape 1 adjacent a peel starting end 3a and a peel finishing end 3b of protective adhesive tape 3, respectively, to form regions for avoiding contact between a peeling tape 5 wound around an applying roller 8 and the like and the supporting adhesive tape 1. Subsequently, the peeling tape 5 is applied to the protective adhesive tape 3 at the peel starting end 3a with the applying roller 8, and a group of rollers 6-8 is moved horizontally on the work A to peel the peeling tape 5 and protective adhesive tape 3 together from the surface of semiconductor wafer W.

摘要翻译： PCT No.PCT / JP96 / 02476 Sec。 371日期1997年12月30日 102（e）1997年12月30日PCT PCT 1996年8月28日PCT公布。 出版物WO97 / 08745 日本1997年3月6日一种剥离保护性胶带3的工序的方法和装置，其具有通过支撑胶带1将保护胶带3涂覆在支撑在环形框架F中的半导体晶片W的表面上。薄片 将带有非粘性上表面的板4分别施加到邻近保护胶带3的剥离起始端3a和剥离完成端3b的支撑胶带1上，以形成用于避免卷绕在保护胶带3上的剥离带5之间的接触的区域 施加辊8等和支撑胶带1.随后，利用施加辊8将剥离带5施加到剥离开始端3a处的保护胶带3，并且一组辊6-8水平移动 在工件A上将剥离带5和保护胶带3从半导体晶片W的表面一起剥离。

公开(公告)号：US20120160397A1

公开(公告)日：2012-06-28

申请号：US13312997

申请日：2011-12-07

申请人： Masayuki Yamamoto ,  Saburo Miyamoto

发明人： Masayuki Yamamoto ,  Saburo Miyamoto

IPC分类号： B32B38/10

CPC分类号： H01L21/67132 ,  H01L21/67092 ,  H01L21/6715 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68386 ,  H01L2221/6839 ,  H01L2221/68395

摘要： A liquid adhesive is applied to a circuit surface of a semiconductor wafer. A carrier is joined to a surface of the semiconductor wafer coated with the adhesive. A rear face of the semiconductor wafer is ground while the carrier is held. The semiconductor wafer is supported on a ring frame via a support adhesive tape. The carrier is removed from the semiconductor wafer. The adhesive tape is separated integrally with the film-like adhesive from the semiconductor wafer through joining a separation tape having a width larger than a diameter of the semiconductor wafer to the adhesive on the semiconductor wafer and then separating the separation tape.

摘要翻译： 将液体粘合剂施加到半导体晶片的电路表面。 载体与涂覆有粘合剂的半导体晶片的表面接合。 半导体晶片的后表面在保持载体时被研磨。 半导体晶片通过支撑胶带支撑在环形框架上。 载体从半导体晶片去除。 通过将具有大于半导体晶片的直径的宽度的分离带与半导体晶片上的粘合剂接合，将粘合带与半导体晶片与膜状粘合剂一体地分离，然后分离分离带。

公开(公告)号：US20110310059A1

公开(公告)日：2011-12-22

申请号：US13222327

申请日：2011-08-31

申请人： Saburo Miyamoto ,  Toshihisa Nakano

发明人： Saburo Miyamoto ,  Toshihisa Nakano

IPC分类号： G06F3/044

CPC分类号： G06F3/044 ,  G02F1/13338 ,  G06F3/0412 ,  G06F3/045 ,  G06F2203/04113

摘要： A display device with a touch sensor according to the present invention includes an active matrix substrate and a transparent counter electrode. On a first surface of the active matrix substrate, multiple pixel electrodes are arranged in matrix. The transparent counter electrode is opposed to the first surface of the active matrix substrate. The display device further includes a first circuit, a second circuit and a switching circuit. The first circuit supplies a voltage or a current to the transparent counter electrode for display purposes. The second circuit detects currents flowing from a number of points on the transparent counter electrode. And the switching circuit selectively connects electrically one of the first and second circuits to the transparent counter electrode.

摘要翻译： 具有根据本发明的触摸传感器的显示装置包括有源矩阵基板和透明对电极。 在有源矩阵基板的第一表面上，将多个像素电极排成矩阵状。 透明对电极与有源矩阵基板的第一表面相对。 显示装置还包括第一电路，第二电路和开关电路。 第一电路将电压或电流提供给透明对电极用于显示目的。 第二电路检测从透明对电极上的多个点流出的电流。 并且开关电路选择性地将第一和第二电路之一电连接到透明对电极。

公开(公告)号：US20100038009A1

公开(公告)日：2010-02-18

申请号：US12539476

申请日：2009-08-11

申请人： Chouhei Okuno ,  Masayuki Yamamoto ,  Saburo Miyamoto

发明人： Chouhei Okuno ,  Masayuki Yamamoto ,  Saburo Miyamoto

IPC分类号： B32B38/00 ,  B32B37/00 ,  B32B41/00

CPC分类号： H01L21/67132 ,  H01L21/6836 ,  H01L2221/68327 ,  Y10T156/10 ,  Y10T156/12

摘要： A protective tape is supplied above the surface of a semiconductor wafer, and joined to the surface of the semiconductor wafer by rolling a joining roller while pressing the joining roller against the protective tape. Then the joined protective tape is cut out along the outer periphery of the semiconductor wafer. Subsequently, the protective tape is pressed with the pressure member to flatten the surface of the protective tape.

摘要翻译： 在半导体晶片的表面上方提供保护带，并且通过滚动接合辊并将接合辊压靠在保护带上而与半导体晶片的表面接合。 然后沿着半导体晶片的外周切出接合的保护带。 随后，用压力构件按压保护带，使保护带的表面变平。

公开(公告)号：US20090211710A1

公开(公告)日：2009-08-27

申请号：US12390661

申请日：2009-02-23

申请人： Masayuki Yamamoto ,  Saburo Miyamoto

发明人： Masayuki Yamamoto ,  Saburo Miyamoto

IPC分类号： B29C65/50

CPC分类号： H01L21/67132 ,  Y10T156/1168 ,  Y10T156/1195

摘要： An adhesive tape joining apparatus of this invention adopts an inverted “T”-shaped layout configured with a rectangular section that extends laterally when being viewed in a plane and a protrusion section that is coupled on a center of the rectangular section. An adhesive tape joining part is disposed in the protrusion section and joins an adhesive tape to a ring frame and a wafer. A transport mechanism is disposed in the rectangular section and transports the wafer, the ring frame, and the wafer held by the ring frame. An electronic substrate processing unit is disposed in at least one of two regions adjoining to the rectangular section with the protrusion section being interposed therebetween, and is coupled to the transport mechanism.

摘要翻译： 本发明的胶带接合装置采用倒置的“T”形布置，其配置有在平面中横向延伸的矩形截面，以及连接在矩形部分中心的突出部分。 粘合带接合部分设置在突出部分中，并将粘合带连接到环形框架和晶片。 传送机构设置在矩形部分中并传送由环形框架保持的晶片，环形框架和晶片。 电子基板处理单元设置在与矩形部分相邻的两个区域中的至少一个中，其中插入有突出部分，并且联接到输送机构。

公开(公告)号：US06272814B1

公开(公告)日：2001-08-14

申请号：US09625491

申请日：2000-07-25

申请人： Kazuichi Ikuta ,  Saburo Miyamoto

发明人： Kazuichi Ikuta ,  Saburo Miyamoto

IPC分类号： B65B104

CPC分类号： B65D5/509 ,  B65D25/108 ,  B65D85/24 ,  F16B13/0808

摘要： A method of packaging a plurality of nut assemblies. Each nut assembly includes a flat head formed with a bolt hole, a pair of elongated flat arms extending parallel to each other in one direction from both sides of the head and each formed with a longitudinally elongated hole, and a nut substantially in the shape of a square pole having first and second opposed pairs of longitudinal sides and formed with pins protruding laterally through the first opposed pair of longitudinal sides and loosely received in the respective elongated holes of the arms so that the nut is pivotable about the pins relative to the arms. The nut is further formed with a threaded hole extending therethrough between the second opposed pair of longitudinal sides. To package such nut assemblies, a resilient package formed with elongated grooves having a width smaller than the distance between the second opposed pair of longitudinal sides of the nut is prepared, and a plurality of nut assemblies are pushed into the grooves of the package. The nut assemblies can thus be packaged in an orderly manner without getting tangled with each other.

摘要翻译： 一种包装多个螺母组件的方法。 每个螺母组件包括一个形成有螺栓孔的平头，一对细长的平面臂，其从头部的两侧在一个方向上彼此平行地延伸，并且每个形成有纵向细长的孔， 具有第一和第二相对的一对纵向侧面并且形成有穿过第一相对的一对纵向侧面突出并且松散地容纳在臂的相应细长孔中的销的方杆，使得螺母能够绕销相对于臂枢转 。 螺母进一步形成有在第二相对的一对纵向侧之间延伸穿过的螺纹孔。 为了包装这种螺母组件，制备了具有宽度小于螺母的第二相对的一对纵向边之间的距离的细长槽的弹性包装，并且多个螺母组件被推入包装的凹槽中。 因此，螺母组件可以有序地包装，而不会彼此缠结。

公开(公告)号：US08031180B2

公开(公告)日：2011-10-04

申请号：US10487338

申请日：2002-07-18

申请人： Saburo Miyamoto ,  Toshihisa Nakano

发明人： Saburo Miyamoto ,  Toshihisa Nakano

IPC分类号： G06F3/041

CPC分类号： G06F3/044 ,  G02F1/13338 ,  G06F3/0412 ,  G06F3/045 ,  G06F2203/04113

摘要： A display device with a touch sensor according to the present invention includes an active matrix substrate 4A and a transparent counter electrode 7. On a first surface of the active matrix substrate, multiple pixel electrodes are arranged in matrix. The transparent counter electrode is opposed to the first surface of the active matrix substrate. The display device further includes a first circuit, a second circuit and a switching circuit. The first circuit supplies a voltage or a current to the transparent counter electrode for display purposes. The second circuit detects currents flowing from a number of points on the transparent counter electrode. And the switching circuit selectively connects electrically one of the first and second circuits to the transparent counter electrode.

摘要翻译： 具有根据本发明的触摸传感器的显示装置包括有源矩阵基板4A和透明相对电极7.在有源矩阵基板的第一表面上，多个像素电极被排列成矩阵。 透明对电极与有源矩阵基板的第一表面相对。 显示装置还包括第一电路，第二电路和开关电路。 第一电路将电压或电流提供给透明对电极用于显示目的。 第二电路检测从透明对电极上的多个点流出的电流。 并且开关电路选择性地将第一和第二电路之一电连接到透明对电极。