公开(公告)号：US06272814B1

公开(公告)日：2001-08-14

申请号：US09625491

申请日：2000-07-25

申请人： Kazuichi Ikuta ,  Saburo Miyamoto

发明人： Kazuichi Ikuta ,  Saburo Miyamoto

IPC分类号： B65B104

CPC分类号： B65D5/509 ,  B65D25/108 ,  B65D85/24 ,  F16B13/0808

摘要： A method of packaging a plurality of nut assemblies. Each nut assembly includes a flat head formed with a bolt hole, a pair of elongated flat arms extending parallel to each other in one direction from both sides of the head and each formed with a longitudinally elongated hole, and a nut substantially in the shape of a square pole having first and second opposed pairs of longitudinal sides and formed with pins protruding laterally through the first opposed pair of longitudinal sides and loosely received in the respective elongated holes of the arms so that the nut is pivotable about the pins relative to the arms. The nut is further formed with a threaded hole extending therethrough between the second opposed pair of longitudinal sides. To package such nut assemblies, a resilient package formed with elongated grooves having a width smaller than the distance between the second opposed pair of longitudinal sides of the nut is prepared, and a plurality of nut assemblies are pushed into the grooves of the package. The nut assemblies can thus be packaged in an orderly manner without getting tangled with each other.

摘要翻译： 一种包装多个螺母组件的方法。 每个螺母组件包括一个形成有螺栓孔的平头，一对细长的平面臂，其从头部的两侧在一个方向上彼此平行地延伸，并且每个形成有纵向细长的孔， 具有第一和第二相对的一对纵向侧面并且形成有穿过第一相对的一对纵向侧面突出并且松散地容纳在臂的相应细长孔中的销的方杆，使得螺母能够绕销相对于臂枢转 。 螺母进一步形成有在第二相对的一对纵向侧之间延伸穿过的螺纹孔。 为了包装这种螺母组件，制备了具有宽度小于螺母的第二相对的一对纵向边之间的距离的细长槽的弹性包装，并且多个螺母组件被推入包装的凹槽中。 因此，螺母组件可以有序地包装，而不会彼此缠结。

公开(公告)号：US20110045234A1

公开(公告)日：2011-02-24

申请号：US12834450

申请日：2010-07-12

申请人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masayuki Yamamoto

发明人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masayuki Yamamoto

IPC分类号： B32B7/12 ,  B32B38/10

CPC分类号： B62D25/105 ,  Y10T156/1077 ,  Y10T428/24174

摘要： A joining roller rolls while pressing on a separator on a surface of a double-faced adhesive tape with through holes in rectangular shapes regularly formed therein in a longitudinal tape direction, and the double-faced adhesive tape is joined to a building panel. Thereafter, the separator is separated and the reinforcing member is joined to an adhesive layer of the double-faced adhesive tape while being pressed with the reinforcing member being kept parallel to the double-faced adhesive tape.

摘要翻译： 接合辊在将双面胶带的表面上的隔膜压在辊纵向上规则地形成有矩形形状的通孔的同时滚压，双面胶带与建筑面板接合。 此后，分离器被分离，并且加强构件在与加强构件保持平行于双面胶带的同时被按压而与双面胶带的粘合剂层接合。

公开(公告)号：US20060219359A1

公开(公告)日：2006-10-05

申请号：US11358140

申请日：2006-02-22

申请人： Saburo Miyamoto ,  Yasuji Kaneshima ,  Masayuki Yamamoto

发明人： Saburo Miyamoto ,  Yasuji Kaneshima ,  Masayuki Yamamoto

IPC分类号： B32B37/00 ,  B29C63/00 ,  B32B38/00

CPC分类号： B29C63/0013 ,  H01L21/67132 ,  H01L2221/6839 ,  Y10T156/1105 ,  Y10T156/1168 ,  Y10T156/1179 ,  Y10T156/19 ,  Y10T156/1906 ,  Y10T156/1978

摘要： During relative and horizontal movement of a mount frame, in which a semiconductor wafer with a protective tape is supported on a ring frame through a supporting adhesive tape, and a joining member, a position of an end edge of the protective tape is detected in a non-contact manner. Based on the detection result, a joining member is stopped in the position of the end edge of the protective tape and is moved close to the semiconductor wafer to press and bring a separation tape against and into contact with an end of the protective tape. In this state, the mount frame and the joining member are relatively and horizontally moved to join the separation tape onto the protective tape. Then, the mount frame and the joining member are relatively and horizontally moved to separate the separation tape together with the protective tape from a surface of the semiconductor wafer.

摘要翻译： 在具有保护带的半导体晶片通过支撑胶带被支撑在环形框架上的安装框架的相对和水平移动以及接合构件中，在保护带的端部边缘的位置被检测到 非接触式 基于检测结果，接合构件停止在保护带的端缘的位置，并且移动靠近半导体晶片，以将分离带抵靠并与保护带的端部接触。 在这种状态下，安装框架和接合构件被相对且水平地移动以将分离带连接到保护带上。 然后，安装框架和接合构件被相对且水平地移动，以将分离带与保护带一起从半导体晶片的表面分离。

公开(公告)号：US20050014345A1

公开(公告)日：2005-01-20

申请号：US10875165

申请日：2004-06-25

申请人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masaru Irie

发明人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masaru Irie

IPC分类号： H01L21/683 ,  H01L21/00 ,  H01L21/02 ,  H01L21/301 ,  H01L21/304 ,  H01L21/52 ,  H01L21/30 ,  H01L21/3205

CPC分类号： H01L21/67132 ,  H01L21/67092

摘要： A joining roller rolls on the surface of a reinforcing substrate held by a center and side latch claws so as to be close and opposite to an wafer placed and held on a holding table in the condition that an adhesive sheet is adhered on the surface, whereby joining proceeds. As the joining roller rolls, both of the latch claws oscillate downward and the latch claws themselves move down while keeping the bend of the reinforcing substrate nearly constant, and retract when the joining roller approaches the latch claws.

摘要翻译： 接合辊在由粘合在表面上的粘合片的条件下，在由中央和侧面的锁定爪保持的加强基板的表面上滚动以与放置并保持在保持台上的晶片紧密相对，由此 加入收益 当接合辊滚动时，两个闩锁爪向下摆动，并且闩爪自身向下运动，同时保持加强基板的弯曲几乎恒定，并且当接合辊接近闩锁爪时缩回。

公开(公告)号：US6099675A

公开(公告)日：2000-08-08

申请号：US203497

申请日：1998-12-01

申请人： Masayuki Yamamoto ,  Makoto Namikawa ,  Eiji Toyoda ,  Shigeji Kuroda ,  Saburo Miyamoto ,  Takao Matsushita

发明人： Masayuki Yamamoto ,  Makoto Namikawa ,  Eiji Toyoda ,  Shigeji Kuroda ,  Saburo Miyamoto ,  Takao Matsushita

IPC分类号： H01L21/027 ,  B29C63/00 ,  B32B31/16 ,  C09J5/06 ,  G05G15/00 ,  H01J21/30

CPC分类号： B29C63/0013 ,  Y10S156/922 ,  Y10T156/11

摘要： An adhesive tape is applied to an article covered with a resist pattern. The article with the adhesive tape applied thereto is rapidly cooled to form cracks in the resist pattern on the surface of the article to weaken the cohesion between the resist pattern and the surface of the article. After the cooling, the adhesive tape is separated from the article, whereby the resist pattern is removed with the adhesive tape from the surface of the article.

摘要翻译： 将粘合带施加到被抗蚀图案覆盖的物品上。 施加有胶粘带的制品被快速冷却以在制品的表面上的抗蚀剂图案中形成裂纹，以削弱抗蚀剂图案和制品的表面之间的内聚力。 冷却后，粘合带与制品分离，由此用胶带从制品的表面除去抗蚀剂图案。

公开(公告)号：US5688090A

公开(公告)日：1997-11-18

申请号：US698737

申请日：1996-08-16

申请人： Saburo Miyamoto

发明人： Saburo Miyamoto

IPC分类号： F16B25/00 ,  F16B13/12 ,  F16B37/04 ,  F16B13/06

CPC分类号： F16B13/124

摘要： A screw assembly is made up of a screw and a screw fixing member. The screw fixing member is inserted into a starting hole formed in a concrete wall and then the screw is driven into the fixing member in a continuous manner. The screw fixing member has a body having a cylindrical section formed with an eccentric bore having an opening at one end thereof. The screw has its tip inserted in the opening of the bore. The screw has a threaded shank and a cylindrical portion provided at one end of the shank. The screw and the screw fixing member are coupled together by inserting the cylindrical portion of the screw into the opening of the bore.

摘要翻译： 螺钉组件由螺钉和螺钉固定构件构成。 将螺钉固定部件插入到形成在混凝土壁中的起始孔中，然后以连续的方式将螺钉驱动到固定部件中。 螺钉固定构件具有主体，该主体具有形成有在其一端具有开口的偏心孔的圆柱形部分。 螺钉的尖端插入孔的开口中。 螺钉具有螺纹柄和设置在柄的一端的圆柱形部分。 螺钉和螺钉固定构件通过将螺杆的圆柱形部分插入孔的开口中而联接在一起。

公开(公告)号：US4204905A

公开(公告)日：1980-05-27

申请号：US931281

申请日：1978-08-04

申请人： Saburo Miyamoto

发明人： Saburo Miyamoto

IPC分类号： H01R4/22 ,  B65H81/00 ,  C09J5/00 ,  H01B13/012 ,  H01B13/08 ,  H01B13/26 ,  H01R43/00 ,  H02G1/14 ,  H02G1/16 ,  B31F1/00

CPC分类号： H01B13/01263 ,  H01B13/08 ,  H01B13/26 ,  H02G1/14 ,  H02G1/16

摘要： A taping machine used to wind an adhesive tape around e.g. a joined cable disclosed. It comprises a rotor rotatably mounted on a frame, drive means for the rotor, tape feed means, and tape cutting means. The rotor has a radial opening, on the opposite inner walls of the radial opening are mounted brushes. The article to be taped is pushed into the radial opening and between the brushes, subsequently the rotor starts to turn. As it turns, the tape is tightly wound around the article by frictional action of the brushes.

摘要翻译： 用于缠绕例如胶带的胶带机。 公开了一种连接电缆。 它包括可旋转地安装在框架上的转子，用于转子的驱动装置，送带装置和带切割装置。 转子具有径向开口，在径向开口的相对的内壁上安装有刷子。 要被接合的物品被推入径向开口和刷子之间，随后转子开始转动。 转动时，通过刷子的摩擦力将胶带紧紧地缠绕在物品周围。

公开(公告)号：US07913735B2

公开(公告)日：2011-03-29

申请号：US12390661

申请日：2009-02-23

申请人： Masayuki Yamamoto ,  Saburo Miyamoto

发明人： Masayuki Yamamoto ,  Saburo Miyamoto

IPC分类号： B29C65/50

CPC分类号： H01L21/67132 ,  Y10T156/1168 ,  Y10T156/1195

摘要： An adhesive tape joining apparatus of this invention adopts an inverted “T”-shaped layout configured with a rectangular section that extends laterally when being viewed in a plane and a protrusion section that is coupled on a center of the rectangular section. An adhesive tape joining part is disposed in the protrusion section and joins an adhesive tape to a ring frame and a wafer. A transport mechanism is disposed in the rectangular section and transports the wafer, the ring frame, and the wafer held by the ring frame. An electronic substrate processing unit is disposed in at least one of two regions adjoining to the rectangular section with the protrusion section being interposed therebetween, and is coupled to the transport mechanism.

摘要翻译： 本发明的胶带接合装置采用倒置的“T”形布置，其配置有在平面中横向延伸的矩形截面，以及连接在矩形部分中心的突出部分。 粘合带接合部分设置在突出部分中，并将粘合带连接到环形框架和晶片。 传送机构设置在矩形部分中并传送由环形框架保持的晶片，环形框架和晶片。 电子基板处理单元设置在与矩形部分相邻的两个区域中的至少一个中，其中插入有突出部分，并且联接到输送机构。

公开(公告)号：US20110048609A1

公开(公告)日：2011-03-03

申请号：US12848290

申请日：2010-08-02

申请人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masayuki Yamamoto

发明人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masayuki Yamamoto

IPC分类号： B32B37/12 ,  B32B38/04

CPC分类号： B65H35/0013 ,  B65H37/002 ,  B65H2301/460186 ,  Y10T156/108 ,  Y10T156/1084 ,  Y10T156/1085 ,  Y10T156/1195

摘要： A joint detector detects a joint in an adhesive tape supplied from a tape supply section, and a computing unit determines a suitable cutting position of the adhesive tape for removing the joint in accordance with the detected results. A controller controls each mechanism to operate so as to satisfy the determined results by the computing unit. Thereafter, the adhesive tape including the joint is cut and removed.

摘要翻译： 联合检测器检测从带供应部分提供的粘合带中的接头，并且计算单元根据检测结果确定用于移除接头的胶带的适当切割位置。 控制器控制每个机构进行操作以满足计算单元确定的结果。 此后，将包括接头的胶带切割并除去。

公开(公告)号：US07849900B2

公开(公告)日：2010-12-14

申请号：US11358140

申请日：2006-02-22

申请人： Saburo Miyamoto ,  Yasuji Kaneshima ,  Masayuki Yamamoto

发明人： Saburo Miyamoto ,  Yasuji Kaneshima ,  Masayuki Yamamoto

IPC分类号： B29C65/18

CPC分类号： B29C63/0013 ,  H01L21/67132 ,  H01L2221/6839 ,  Y10T156/1105 ,  Y10T156/1168 ,  Y10T156/1179 ,  Y10T156/19 ,  Y10T156/1906 ,  Y10T156/1978

摘要： During relative and horizontal movement of a mount frame, in which a semiconductor wafer with a protective tape is supported on a ring frame through a supporting adhesive tape, and a joining member, a position of an end edge of the protective tape is detected in a non-contact manner. Based on the detection result, a joining member is stopped in the position of the end edge of the protective tape and is moved close to the semiconductor wafer to press and bring a separation tape against and into contact with an end of the protective tape. In this state, the mount frame and the joining member are relatively and horizontally moved to join the separation tape onto the protective tape. Then, the mount frame and the joining member are relatively and horizontally moved to separate the separation tape together with the protective tape from a surface of the semiconductor wafer.

摘要翻译： 在具有保护带的半导体晶片通过支撑胶带被支撑在环形框架上的安装框架的相对和水平移动以及接合构件中，在保护带的端部边缘的位置被检测到 非接触式 基于检测结果，接合构件停止在保护带的端缘的位置，并且移动靠近半导体晶片，以将分离带抵靠并与保护带的端部接触。 在这种状态下，安装框架和接合构件被相对且水平地移动以将分离带连接到保护带上。 然后，安装框架和接合构件被相对且水平地移动，以将分离带与保护带一起从半导体晶片的表面分离。