公开(公告)号：US20110048630A1

公开(公告)日：2011-03-03

申请号：US12847858

申请日：2010-07-30

申请人： Yukitoshi Hase ,  Masayuki Yamamoto

发明人： Yukitoshi Hase ,  Masayuki Yamamoto

IPC分类号： B32B38/10

CPC分类号： H01L21/67132 ,  Y10T156/1147 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1911 ,  Y10T156/1917

摘要： A chuck table adhesively holds a rear face of a mount frame subject to a dicing process with a protective tape joined thereto, and a suction plate having a heater embedded therein contacts and heats the protective tape. Consequently, an adhesion layer of the protective tape reduces its adhesive force due to foaming and expansion. Thereafter, the suction plate moves upward while keeping its suction force to separate the protective tape from all of chips.

摘要翻译： 卡盘台用连接有保护带的切割工艺粘合地保持安装框架的后表面，并且具有嵌入其中的加热器的吸板接触并加热保护带。 因此，保护​​带的粘合层由于发泡和膨胀而降低其粘附力。 此后，吸板向上移动，同时保持其吸力，以将保护带与所有芯片分离。

公开(公告)号：US20100300612A1

公开(公告)日：2010-12-02

申请号：US12779632

申请日：2010-05-13

申请人： Masayuki Yamamoto ,  Yukitoshi Hase

发明人： Masayuki Yamamoto ,  Yukitoshi Hase

IPC分类号： B32B38/10 ,  B32B37/02

CPC分类号： H01L21/67132 ,  Y10T156/17

摘要： A reinforcing support substrate is joined to a surface of the semiconductor wafer via a double-faced adhesive tape, and then is removed from the semiconductor wafer. Subsequently, the semiconductor wafer with the support substrate removed therefrom is adhesively held on a rear face of a ring frame via a support adhesive tape, and the double-faced adhesive tape is separated from the surface of the semiconductor wafer integrate with the ring frame.

摘要翻译： 加强支撑基板通过双面胶带与半导体晶片的表面接合，然后从半导体晶片去除。 随后，将其上移除了支撑基板的半导体晶片通过支撑胶带粘合地保持在环形框架的后表面上，并且双面胶带与半圆形晶片的与环形框架一体的表面分离。

公开(公告)号：US08960266B2

公开(公告)日：2015-02-24

申请号：US13304135

申请日：2011-11-23

申请人： Masayuki Yamamoto ,  Yukitoshi Hase

发明人： Masayuki Yamamoto ,  Yukitoshi Hase

IPC分类号： F24H3/00 ,  H01L21/677 ,  H01L21/67

CPC分类号： H01L21/6776 ,  H01L21/67109 ,  H01L21/67132 ,  H01L21/67784

摘要： A semiconductor wafer joined to a carrier via a double-faced adhesive tape having an adhesive layer of a heating separation property is heated for removal from the carrier. The double-faced adhesive tape is separated from the semiconductor wafer on a holding table. Thereafter, an air nozzle preliminarily cools the semiconductor wafer for a given time during transportation with a wafer transport section. Upon completion of the preliminary cooling, the semiconductor wafer is placed on a cooling stage to cool it to a target temperature.

摘要翻译： 通过具有加热分离性的粘合剂层的双面胶带连接到载体的半导体晶片被加热以从载体移除。 双面胶带与保持台上的半导体晶片分离。 此后，空气喷嘴在晶片输送部分运输期间预先冷却半导体晶片一定时间。 在初步冷却完成后，将半导体晶片放置在冷却台上以将其冷却至目标温度。

公开(公告)号：US20120082516A1

公开(公告)日：2012-04-05

申请号：US13239382

申请日：2011-09-21

申请人： Masayuki Yamamoto ,  Yukitoshi Hase

发明人： Masayuki Yamamoto ,  Yukitoshi Hase

IPC分类号： B65G51/03

CPC分类号： H01L21/67784 ,  B65G49/065

摘要： A wafer floats and is transported while gas is blown from holes passing vertically through a middle portion of a transport path against a rear face of the wafer to be transported, and from holes on opposite sides of the transport path that are inclined obliquely relative to a traveling direction of the wafer toward a center axis of the transport path against the rear face of the wafer. In the step of transporting the wafer, a flow rate of gas is adjusted that is blown from the holes on a side where the wafer deviates from a transport course.

摘要翻译： 晶圆漂浮并被输送，同时气体从穿过传送路径的中间部分的孔穿过待运输的晶片的背面，以及相对于传送路径倾斜倾斜的传送路径的相对侧上的孔 晶片的行进方向朝着与晶片的背面相对的输送路径的中心轴线。 在输送晶片的步骤中，调节从晶片偏离输送路径的一侧的孔中吹出的气体的流量。

公开(公告)号：US08038816B2

公开(公告)日：2011-10-18

申请号：US12630638

申请日：2009-12-03

申请人： Masayuki Yamamoto ,  Yukitoshi Hase

发明人： Masayuki Yamamoto ,  Yukitoshi Hase

IPC分类号： B32B38/00 ,  B32B41/00

CPC分类号： B32B38/10 ,  B32B37/0046 ,  B32B41/00 ,  B32B2457/14 ,  H01L21/67132 ,  H01L21/67288 ,  H01L22/12 ,  H01L22/20 ,  Y10T156/1052 ,  Y10T156/1062 ,  Y10T156/108

摘要： A method of this invention involves capturing an image of an outer periphery of a semiconductor wafer, by use of a CCD camera, performing image analysis on data about the captured image, detecting defects such as chips and cracks on the outer periphery of the semiconductor wafer, storing positions of the respective defects, calculating a clearance between the adjacent defects from information about the stored positions, comparing the calculated clearances with a preset width of a separation tape, and obtaining the clearance larger than the width of the separation tape, by arithmetic processing. If some of the clearances are larger than the width of the separation tape, this method also involves setting an appropriate one of the clearance as a position where the separation tape is joined, performing alignment on the semiconductor wafer, joining the separation tape to a protective tape joined to a surface of the semiconductor wafer, and separating the protective tape together with the separation tape from the surface of the semiconductor wafer.

摘要翻译： 本发明的方法涉及通过使用CCD照相机拍摄半导体晶片的外周的图像，对所拍摄图像的数据进行图像分析，检测半导体晶片的外周上的切屑和裂纹等缺陷 存储各个缺陷的位置，从关于存储位置的信息计算相邻缺陷之间的间隙，将计算出的间隙与分离带的预设宽度进行比较，并通过算术获得大于分离带的宽度的间隙 处理。 如果一些间隙大于分离带的宽度，则该方法还涉及将适当的一个间隙设置为分离带接合的位置，在半导体晶片上进行对准，将分离带连接到保护性 胶带连接到半导体晶片的表面，并将保护带与分离带一起从半导体晶片的表面分离。

公开(公告)号：US20100147442A1

公开(公告)日：2010-06-17

申请号：US12630638

申请日：2009-12-03

申请人： Masayuki Yamamoto ,  Yukitoshi Hase

发明人： Masayuki Yamamoto ,  Yukitoshi Hase

IPC分类号： B32B38/00 ,  B32B41/00

CPC分类号： B32B38/10 ,  B32B37/0046 ,  B32B41/00 ,  B32B2457/14 ,  H01L21/67132 ,  H01L21/67288 ,  H01L22/12 ,  H01L22/20 ,  Y10T156/1052 ,  Y10T156/1062 ,  Y10T156/108

摘要： A method of this invention involves capturing an image of an outer periphery of a semiconductor wafer, by use of a CCD camera, performing image analysis on data about the captured image, detecting defects such as chips and cracks on the outer periphery of the semiconductor wafer, storing positions of the respective defects, calculating a clearance between the adjacent defects from information about the stored positions, comparing the calculated clearances with a preset width of a separation tape, and obtaining the clearance larger than the width of the separation tape, by arithmetic processing. If some of the clearances are larger than the width of the separation tape, this method also involves setting an appropriate one of the clearance as a position where the separation tape is joined, performing alignment on the semiconductor wafer, joining the separation tape to a protective tape joined to a surface of the semiconductor wafer, and separating the protective tape together with the separation tape from the surface of the semiconductor wafer.

摘要翻译： 本发明的方法涉及通过使用CCD照相机拍摄半导体晶片的外周的图像，对所拍摄图像的数据进行图像分析，检测半导体晶片的外周上的切屑和裂纹等缺陷 存储各个缺陷的位置，从关于存储位置的信息计算相邻缺陷之间的间隙，将计算出的间隙与分离带的预设宽度进行比较，并通过算术获得大于分离带的宽度的间隙 处理。 如果一些间隙大于分离带的宽度，则该方法还涉及将适当的一个间隙设置为分离带接合的位置，在半导体晶片上进行对准，将分离带连接到保护性 胶带连接到半导体晶片的表面，并将保护带与分离带一起从半导体晶片的表面分离。

公开(公告)号：US20080169056A1

公开(公告)日：2008-07-17

申请号：US11966941

申请日：2007-12-28

申请人： Masayuki Yamamoto ,  Yukitoshi Hase

发明人： Masayuki Yamamoto ,  Yukitoshi Hase

IPC分类号： B29C65/00

CPC分类号： H01L21/67132 ,  B29C63/02 ,  B32B37/10 ,  B32B2457/14 ,  Y10T156/12

摘要： An apparatus for joining a double-sided adhesive tape to a substrate includes: a chuck table for holding a substrate; a tape feed device for separating, from a double-sided adhesive tape having first and second separators, the first separator, and feeding the double-sided adhesive tape onto the chuck table; a joining roller for pressing the double-sided adhesive tape fed on the chuck table in the state that the first separator is separated, from a side of the second separator with rolling, and joining the double-sided adhesive tape to a surface of the substrate; a separator collecting device for separating the second separator wound and turned around by the joining roller from the double-sided adhesive tape in association with the forward movement for joining of the joining roller, and taking up the second separator in synchronization with the forward movement for joining of the joining roller; and a tape cutting mechanism including a cutter blade for cutting the double-sided adhesive tape joined to the substrate along with a contour of the substrate.

摘要翻译： 将双面胶带与基板接合的装置包括：用于保持基板的卡盘台; 用于从具有第一和第二分离器的双面胶带分离第一分离器并将双面胶带馈送到卡盘台上的带进给装置; 在第一分离器分离的状态下，从第二分离器的侧面滚动而将供给在卡盘台上的双面胶带按压，并将双面胶带接合到基板的表面的接合辊 ; 分离器收集装置，用于与连接辊的接合的向前移动相关联，分离由接合辊缠绕并由双面胶带卷绕的第二分离器，并且与向前移动同步地吸收第二分离器 接合辊的接合; 以及带切割机构，其包括用于切割与基板的轮廓连接到基板的双面胶带的切割刀片。