MULTILAYER CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND BOARD FOR MOUNTING THE SAME
    21.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND BOARD FOR MOUNTING THE SAME 有权
    多层陶瓷电子元件及其制造方法及其安装板

    公开(公告)号:US20140311782A1

    公开(公告)日:2014-10-23

    申请号:US13924434

    申请日:2013-06-21

    CPC classification number: H01G4/30 H01G4/12 H05K1/181 Y10T29/43

    Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers stacked in a thickness direction and satisfying T/W>1.0 when a width thereof is W and a thickness thereof is T; first and second internal electrodes; and first and second external electrodes, wherein when the ceramic body is divided into five regions in a width direction and a central region among the five regions is CW1 and regions adjacent to the central region CW1 are CW2 and CW3, a difference between electrode connectivity of the central region CW1 and electrode connectivity of the region CW2 or CW3 satisfies 0.02≦(CW2 or CW3)−CW1≦0.10.

    Abstract translation: 多层陶瓷电子部件包括陶瓷体,该陶瓷体的宽度为W,厚度为T时,在厚度方向上层叠电介质层且满足T / W> 1.0的陶瓷体; 第一和第二内部电极; 以及第一外部电极和第二外部电极,其中当陶瓷体在宽度方向上被分成五个区域并且五个区域中的中心区域是CW1,并且与中心区域CW1相邻的区域是CW2和CW3时,电极连接性之间的差异 区域CW2或CW3的中心区域CW1和电极连通性满足0.02≦̸(CW2或CW3)-CW1≦̸ 0.10。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    24.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权
    多层陶瓷电子元件

    公开(公告)号:US20140376150A1

    公开(公告)日:2014-12-25

    申请号:US14013291

    申请日:2013-08-29

    CPC classification number: H01G4/30 H01G4/0085 H01G4/012 H01G4/12

    Abstract: There is provided a multilayer ceramic electronic component including, a ceramic body including dielectric layers, internal electrodes disposed in the ceramic body to face each other with the dielectric layers interposed therebetween, and having an average thickness of 1.0 μm or less, and external electrodes formed on outer surfaces of the ceramic body and electrically connected to the internal electrodes, wherein at least one of the internal electrodes is formed of only a conductive metal.

    Abstract translation: 提供了一种多层陶瓷电子部件,其包括:陶瓷体,其包括电介质层,设置在陶瓷体中的内部电极,其间插入有电介质层,并且平均厚度为1.0μm以下,形成外部电极 在陶瓷体的外表面上并且电连接到内部电极,其中至少一个内部电极仅由导电金属形成。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    25.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号:US20140355177A1

    公开(公告)日:2014-12-04

    申请号:US13962563

    申请日:2013-08-08

    Abstract: There is provided a multilayer ceramic electronic component including a ceramic body including a plurality dielectric layers stacked thereon, a plurality of internal electrodes formed to be exposed to both end surface of the ceramic body, having the dielectric layer interposed therebetween, and external electrodes formed on the end surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, wherein connectivity of the internal electrode is equal to or greater than 87%.

    Abstract translation: 提供了一种多层陶瓷电子部件,其包括:陶瓷体,其包括堆叠在其上的多个电介质层,形成为暴露于陶瓷体的两端面的多个内部电极,其间具有电介质层,形成在外部电极 陶瓷体的端面分别电连接到内部电极,其中内部电极的连接性等于或大于87%。

    MULTILAYERED CERAMIC COMPONENT
    26.
    发明申请
    MULTILAYERED CERAMIC COMPONENT 有权
    多层陶瓷组件

    公开(公告)号:US20130321978A1

    公开(公告)日:2013-12-05

    申请号:US13910932

    申请日:2013-06-05

    Abstract: Disclosed herein is a multilayered ceramic component having a structure in which internal electrode layers and dielectric layers are alternately multilayered, wherein the internal electrode layer includes 0.01 to 12 wt % of common material based on weight of metal powders, and an average particle size of the common material is 30 to 50% of an average particle size of a dielectric base material included in the dielectric layer. According to the first exemplary embodiment of the present invention, the particle size and the added amount of the common material squeezed out from the internal electrode layers at the time of firing thereof at a high temperature are controlled, thereby making it possible to improve the capacity and the reliability of the internal electrode.

    Abstract translation: 本发明公开了具有内部电极层和电介质层交替层叠的结构的多层陶瓷部件,其中,内部电极层包含基于金属粉末重量的0.01〜12重量%的普通材料,平均粒径为 普通材料是包含在电介质层中的电介质基材的平均粒径的30〜50%。 根据本发明的第一示例性实施例,控制在高温烧制时从内部电极层挤出的共同材料的粒径和添加量,从而可以提高容量 和内部电极的可靠性。

    MULTILAYER CERAMIC CAPACITOR
    28.
    发明申请

    公开(公告)号:US20190115153A1

    公开(公告)日:2019-04-18

    申请号:US15949623

    申请日:2018-04-10

    Abstract: A multilayer ceramic capacitor includes: a ceramic body having first and second surfaces opposing each other and third and fourth surfaces connecting the first and second surfaces to each other; a plurality of internal electrodes disposed in the ceramic body, exposed to the first and second surfaces, and each having one end exposed to the third or fourth surface; and first and second side margin portions disposed on the first and second surfaces and covering exposed surfaces of the internal electrodes. A dielectric composition contained in the first and second side margin portions is different from a dielectric composition contained in the ceramic body, the first and second side margin portions contain a barium titanate-based base material powder and magnesium (Mg), manganese (Mn), and aluminum (Al) as accessory ingredients, and a content ratio of manganese (Mn) to magnesium (Mg), manganese (Mn), and aluminum (Al) satisfies 0.316≤Mn/(Mn+Mg+Al)≤0.500, based on a molar content of Mn, Mg and Al in the first and second side margin portions.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON
    29.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON 有权
    多层陶瓷电子元器件及其相应的安装

    公开(公告)号:US20150136462A1

    公开(公告)日:2015-05-21

    申请号:US14174625

    申请日:2014-02-06

    CPC classification number: H01G2/065 H01G4/012 H01G4/12 H01G4/232 H01G4/30

    Abstract: There is provided a multilayer ceramic electronic component including: a ceramic body including dielectric layers; and a plurality of internal electrodes disposed in the ceramic body, having at least one of the dielectric layers interposed therebetween, wherein when a distance between a widthwise end of an internal electrode disposed at a central portion of the ceramic body in a thickness direction thereof and an adjacent side surface of the ceramic body is defined as D1 and a distance between a widthwise end of an internal electrode disposed at an upper or lower portion of the ceramic body in the thickness direction thereof and the adjacent side surface of the ceramic body is defined as D2, D1/D2 is in a range of 0.5 to 0.95 (0.5≦D1/D2≦0.95).

    Abstract translation: 提供了一种多层陶瓷电子部件,包括:包括电介质层的陶瓷体; 以及设置在所述陶瓷体中的多个内部电极,所述多个内部电极具有介于其间的至少一个电介质层,其中,当设置在所述陶瓷体的厚度方向的中心部分的内部电极的宽度方向端之间的距离和 陶瓷体的相邻侧面被定义为D1,并且限定了设置在陶瓷体的厚度方向的上部或下部的内部电极的宽度方向端与陶瓷体的相邻侧面之间的距离 作为D2,D1 / D2在0.5〜0.95(0.5& N1; D1 / D2≦̸ 0.95)的范围内。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    30.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号:US20140240898A1

    公开(公告)日:2014-08-28

    申请号:US13891923

    申请日:2013-05-10

    CPC classification number: H01G4/30 H01G4/012 H01G4/12

    Abstract: There is provided a multilayer ceramic electronic component, including a ceramic body, and an internal electrode formed in the ceramic body and having a plurality of non-electrode regions formed therein, wherein in a cross section formed in length and thickness directions of the ceramic body, when a thickness of the internal electrode is Te, an area of the internal electrode is Ae, and an area of the plurality of non-electrode regions is Ao, 0.1 μm≦Te≦0.55 μm and 3.2%≦Ao:Ae≦4.5% are satisfied.

    Abstract translation: 提供了一种多层陶瓷电子部件,包括陶瓷体和形成在陶瓷体中的内部电极,其中形成有多个非电极区域,其中在陶瓷体的长度和厚度方向形成的横截面中 当内部电极的厚度为Te时,内部电极的面积为Ae,多个非电极区域的面积为Ao,0.1μm& NlE; Te≦̸0.55μm和3.2%& NlE; Ao:Ae& 4.5%满意。

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