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    Compression bonding apparatus
    22.
    发明授权
    Compression bonding apparatus 有权

    公开(公告)号：US11469343B2

    公开(公告)日：2022-10-11

    申请号：US16768492

    申请日：2019-01-03

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yoonsuk Lee ,  Doyoung Kwag ,  Sangmoo Park

    IPC: H01L33/00 ,  H01L33/56 ,  H01L21/683

    Abstract: A compression bonding apparatus is disclosed. The compression bonding apparatus comprises: a stage configured to support a substrate on which a plurality of light emitting elements are arranged on an adhesive layer having a predetermined viscosity; a support member disposed on the stage and surrounding at least a part of a side surface of the substrate; and a pressing member configured to press the plurality of light emitting elements, wherein the support member is configured to have a height equal to or greater than the height of the substrate.

    Micro LED transfer device and micro led transferring method using the same
    23.
    发明授权
    Micro LED transfer device and micro led transferring method using the same 有权

    公开(公告)号：US11289622B2

    公开(公告)日：2022-03-29

    申请号：US16832884

    申请日：2020-03-27

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yoonsuk Lee ,  Sangmoo Park ,  Doyoung Kwag ,  Byungchul Kim ,  Eunhye Kim ,  Minsub Oh ,  Dongyeob Lee

    IPC: H01L33/00 ,  H01L33/62

    Abstract: A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.

    LED transfer device comprising mask and LED transferring method using the same
    26.
    发明授权
    LED transfer device comprising mask and LED transferring method using the same 有权

    公开(公告)号：US11222797B2

    公开(公告)日：2022-01-11

    申请号：US16731468

    申请日：2019-12-31

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Doyoung Kwag ,  Eunhye Kim ,  Sangmoo Park ,  Minsub Oh ,  Yoonsuk Lee

    IPC: H01L21/67 ,  H01L33/62 ,  H01L25/075 ,  H01L21/683

    Abstract: A light-emitting diode (LED) transfer device is provided. The LED transfer device includes a transfer assembly configured to move a first substrate, on which a plurality of LEDs are provided, above a second substrate, a laser light source configured to emit a laser beam toward the first substrate, a mask that is disposed between the first substrate and the laser light source and has a plurality of openings that are configured to be selectively exposed and blocked and a processor configured to control the transfer assembly to move the first substrate to a predetermined position and selectively rotate the first substrate, and control the mask to expose and block the plurality of openings corresponding to the plurality of LEDs to be transferred from the first substrate to the second substrate.

    Display module and large format display apparatus using the same
    27.
    发明授权
    Display module and large format display apparatus using the same 有权

    公开(公告)号：US11201202B2

    公开(公告)日：2021-12-14

    申请号：US16681290

    申请日：2019-11-12

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Eunhye Kim ,  Doyoung Kwag ,  Sangmoo Park ,  Minsub Oh ,  Yoonsuk Lee

    IPC: H01L27/32

    Abstract: A display module and a large format display apparatus incorporating the display module are provided. The display module includes a thin film transistor substrate, light emitting diodes arranged on one surface of the thin film transistor substrate, and side wirings formed on each of a first edge of the thin film transistor substrate and a second edge of the thin film transistor substrate that is adjacent to the first edge, to electrically couple components on the one surface of the thin film transistor substrate with components on an opposite surface of the one surface respectively.

    LED transfer device comprising mask and micro LED transferring method using the same
    28.
    发明授权
    LED transfer device comprising mask and micro LED transferring method using the same 有权

    公开(公告)号：US11152245B2

    公开(公告)日：2021-10-19

    申请号：US16682111

    申请日：2019-11-13

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sangmoo Park ,  Doyoung Kwag ,  Eunhye Kim ,  Minsub Oh ,  Yoonsuk Lee

    IPC: H01L21/683 ,  H01L21/67 ,  H01L33/62

    Abstract: A micro LED transfer device is provided. The micro LED transfer device includes a transfer part configured to arrange a first substrate wherein a plurality of LEDs are disposed on a lower surface relative to an upper surface of a second substrate; a memory storing characteristic information of each of the plurality of LEDs; a laser light source configured to irradiate laser light; a mask comprising a plurality of shutters configured to selectively open and close a plurality of openings of the mask, the mask being interposed between the first substrate and the laser light source; and a processor configured to identify an LED from among the plurality of LEDs to be arranged on the second substrate based on the stored characteristic information, and control the mask such that a shutter from among the plurality of shutters that corresponds to the LED is opened.

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