公开(公告)号：US20170297164A1

公开(公告)日：2017-10-19

申请号：US15407569

申请日：2017-01-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae-Hong KIM ,  Jung-Min OH ,  SeokHoon KIM ,  Chae Lyoung KIM ,  Mihyun PARK ,  Hyosan LEE

IPC: B24B37/20 ,  B08B3/08 ,  B08B3/02 ,  B24B37/005 ,  B05D1/00

CPC classification number: B24B37/20 ,  B05D1/60 ,  B08B3/024 ,  B08B3/08 ,  B24B37/005 ,  C23C16/4407 ,  H01L21/00 ,  H01L21/67

Abstract: Aspects of the inventive concepts provide a cleaning apparatus and a substrate processing system including the same. The cleaning apparatus includes a chuck receiving a substrate, a first nozzle providing first cleaning water or a first organic solvent onto the substrate at a first pressure, and a second nozzle disposed adjacent to the first nozzle. The second nozzle provides a cleaning solution including second cleaning water and a second organic solvent onto the substrate at a second pressure lower than the first pressure.

公开(公告)号：US20170062287A1

公开(公告)日：2017-03-02

申请号：US15175062

申请日：2016-06-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoung Hwan KIM ,  Ingi KIM ,  Mihyun PARK ,  Young-Hoo KIM ,  Ui-soon PARK ,  Jung-Min OH ,  Kuntack LEE ,  Hyosan LEE

IPC: H01L21/66 ,  H01L21/306

CPC classification number: H01L21/31111 ,  H01L21/67086 ,  H01L21/67253 ,  H01L21/67288

Abstract: A substrate treating apparatus and a method of treating a substrate, the apparatus including a substrate treater that treats a substrate using a chemical solution, the chemical solution including a phosphoric acid aqueous solution and a silicon compound; and a chemical solution supplier that supplies the chemical solution to the substrate treating unit, wherein the chemical solution supplier includes a concentration measurer that measures concentrations of the chemical solutions, the concentration measurer including a first concentration measurer that measures a water concentration of the chemical solution; and a second concentration measurer that measures a silicon concentration of the chemical solution.

Abstract translation: 一种基板处理装置及其处理方法，其特征在于，具备使用化学溶液处理基板的基板处理装置，所述化学溶液含有磷酸水溶液和硅化合物; 以及向所述基板处理单元供给所述化学溶液的化学溶液供给体，所述化学溶液供给体包含测定所述化学溶液浓度的浓度测定器，所述浓度测定器包括测定所述化学溶液的水浓度的第一浓度测定器 ; 以及测量化学溶液的硅浓度的第二浓度测量器。

公开(公告)号：US20150157955A1

公开(公告)日：2015-06-11

申请号：US14537318

申请日：2014-11-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong-Jhin CHO ,  Jung-Min OH ,  Yongmyung JUN ,  Yongsun KO ,  Kuntack LEE ,  Hyosan LEE

IPC: B01D3/00

CPC classification number: H01L21/02101 ,  H01L21/02057

Abstract: A method of purifying a cleaning agent is provided. The method includes heating a first mixed solution including an etching agent, a first cleaning agent, and a second cleaning agent at or below a first temperature and distilling the etching agent and the first cleaning agent and removing the second cleaning agent. The method includes condensing or compressing the etching agent and the first cleaning agent forming a second mixed solution including the etching agent and the first cleaning agent. The method includes heating the second mixed solution at a temperature lower than a second temperature, redistilling the etching agent and extracting the first cleaning agent. The second temperature is lower than the first temperature.

Abstract translation: 提供一种净化剂的净化方法。 该方法包括在第一温度或低于第一温度下加热包括蚀刻剂，第一清洁剂和第二清洁剂的第一混合溶液，并蒸馏蚀刻剂和第一清洁剂并除去第二清洁剂。 该方法包括冷凝或压缩蚀刻剂和第一清洗剂，形成包括蚀刻剂和第一清洁剂的第二混合溶液。 该方法包括在低于第二温度的温度下加热第二混合溶液，重新分配蚀刻剂并提取第一清洁剂。 第二个温度低于第一个温度。