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    SEMICONDUCTOR PACKAGE AND MEMORY DEVICE INCLUDING THE SAME
    22.
    发明申请
    SEMICONDUCTOR PACKAGE AND MEMORY DEVICE INCLUDING THE SAME 有权

    公开(公告)号：US20230076865A1

    公开(公告)日：2023-03-09

    申请号：US17899715

    申请日：2022-08-31

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hyunjin KIM

    IPC: H01L23/00 ,  H01L25/065 ,  G11C16/22

    Abstract: A semiconductor package includes: a package board including a plurality of connection pads; a semiconductor chip including a first surface and a plurality of bonding pads, wherein the first surface of the semiconductor chip contacts a first surface of the package board, and wherein the plurality of bonding pads are respectively connected to the plurality of connection pads; and a thermal fuse circuit connected between a sensing connection pad of the plurality of connection pads and a sensing bonding pad of the plurality of bonding pads, and configured to open between the sensing connection pad and the sensing bonding pad when an internal temperature of the thermal fuse circuit is greater than or equal to a cutoff temperature of the thermal fuse circuit.

    ELECTRONIC DEVICE AND METHOD FOR DISPLAYING AUGMENTED REALITY CONTENT
    23.
    发明申请
    ELECTRONIC DEVICE AND METHOD FOR DISPLAYING AUGMENTED REALITY CONTENT 有权

    公开(公告)号：US20220405983A1

    公开(公告)日：2022-12-22

    申请号：US17435614

    申请日：2021-06-18

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hyunjin KIM ,  Jaewook JUNG

    IPC: G06T11/00 ,  G06T7/73 ,  G06V20/20

    Abstract: An example method of displaying augmented reality content includes receiving, from a server, augmented reality content for a real space and pieces of first location information generated to display the augmented reality content; detecting a plurality of objects present in the real space using a detection mode to obtain pieces of object location information of the detected plurality of objects; calculating first vectors indicating differences between the pieces of first location information and the pieces of object location information; identifying, among the first vectors, second vectors for modifying the pieces of first location information; generating pieces of second location information about locations where the augmented reality content is to be displayed by modifying the pieces of first location information based on the second vectors; and displaying the augmented reality content by rendering the augmented reality content at locations corresponding to the pieces of second location information.

    STRUCTURE OF COUPLER FOR ANTENNA MODULE AND ELECTRONIC DEVICE INCLUDING SAME
    24.
    发明申请
    STRUCTURE OF COUPLER FOR ANTENNA MODULE AND ELECTRONIC DEVICE INCLUDING SAME 有权

    公开(公告)号：US20220368025A1

    公开(公告)日：2022-11-17

    申请号：US17753468

    申请日：2020-09-03

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hyunjin KIM ,  Yonghun CHEON ,  Jungyub LEE

    IPC: H01Q21/06 ,  H01Q21/00

    Abstract: The present disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate after a 4th generation (4G) communication system such as long-term evolution (LTE). The present disclosure relates to an antenna device, and the antenna device may include an antenna board including a plurality of antenna elements and a coupler for extracting part of a signal transmitted to the plurality of the antenna elements, and a calibration board disposed under the antenna board, and including a correction circuit for correcting an error using the part of the signal extracted by the coupler, the coupler may include a first transmission line connected with the plurality of the antenna elements, and a second transmission line disposed to be capacitively connected with the first transmission line, and the second transmission line may include a third transmission line and a fourth transmission line spaced apart from each other to be parallel to the first transmission line based on the first transmission line, and a fifth transmission line disposed to connect with the third transmission line and the fourth transmission line with respective terminal ends, and to surround a via hole penetrating the antenna board in a vertical direction.

    ANTENNA MODULE INCLUDING PLURALITY OF RADIATORS, AND BASE STATION INCLUDING THE ANTENNA MODULE
    28.
    发明申请
    ANTENNA MODULE INCLUDING PLURALITY OF RADIATORS, AND BASE STATION INCLUDING THE ANTENNA MODULE 审中-公开

    公开(公告)号：US20190393619A1

    公开(公告)日：2019-12-26

    申请号：US16444548

    申请日：2019-06-18

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hyunjin KIM ,  Seungtae KO ,  Yoongeon KIM ,  Jungmin PARK ,  Junsig KUM ,  Youngju LEE

    IPC: H01Q21/30 ,  H01Q1/52 ,  H01Q1/24

    Abstract: A technique for converging Internet of things (IoT) technology with a fifth generation (5G) communication system for supporting data rates beyond a fourth generation (4G) system can be applied to intelligent services. An antenna module includes a first radiator radiating a radio wave through an upper surface, a second radiator formed surrounding an outer periphery of the first radiator, a dielectric having an upper surface disposed under a lower surface of the first radiator, the dielectric being formed to fix the first radiator and the second radiator to be separated based on a first length, a feeder having an upper surface disposed under a lower surface of the dielectric, the feeder coupling an electrical signal to at least one of the radiator or second radiators through the dielectric, and a printed circuit board electrically connected to the feeder by a conductive pattern and supplying the electrical signal to the feeder.

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