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公开(公告)号:US20200328500A1
公开(公告)日:2020-10-15
申请号:US16844706
申请日:2020-04-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kwanghyun BAEK , Dohyuk HA , Youngju LEE , Jungyub LEE , Juneseok LEE , Jinsu HEO
Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module includes a first printed circuit board (PCB) stacked at least one layer, and a second PCB disposed on an upper surface of the first PCB and stacked at least one layer. The antenna module further includes a wireless communication chip disposed on an upper surface of the second PCB and controlling an electrical signal for a radio frequency, a first structure disposed on the upper surface of the first PCB and surrounding the upper surface of the first PCB, a first antenna disposed on an inner surface of the first structure to face the first PCB, and a feed line electrically connecting the first antenna and the wireless communication chip.
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公开(公告)号:US20190252757A1
公开(公告)日:2019-08-15
申请号:US16319963
申请日:2017-08-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kwanghyun BAEK , Hyunjin KIM , Byungchul KIM , Jungmin PARK , Youngju LEE , Jinsu HEO
CPC classification number: H01Q1/02 , H01Q1/243 , H01Q9/0457 , H01Q13/10 , H01Q21/0025 , H01Q21/064 , H01Q21/065 , H04B1/44 , H04M1/02
Abstract: The present invention relates to an antenna apparatus and an electronic device comprising the same. The antenna apparatus according to one embodiment of the present invention comprises an array antenna formed on a metal case of an electronic device, wherein the array antenna comprises at least two antenna elements, the at least two antenna elements may operate in the same frequency band. According to one embodiment of the present invention, it is possible to provide an antenna apparatus capable of reducing heat generation and increasing the radiation efficiency of an antenna.
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公开(公告)号:US20250096486A1
公开(公告)日:2025-03-20
申请号:US18964144
申请日:2024-11-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sanghoon PARK , Jungho PARK , Kwanghyun BAEK , Youngju LEE , Jungyub LEE , Juneseok LEE , Dohyuk HA , Jinsu HEO
Abstract: An antenna assembly is provided. The antenna assembly includes a first flexible printed circuit board (FPCB) for multiple first antennas, a second flexible printed circuit board (FPCB) for multiple second antennas, a metal plate including multiple holes, a first adhesive material layer for bonding between the metal plate and the first FPCB, and a second adhesive material layer for bonding between the metal plate and the second FPCB, wherein the metal plate is disposed such that the multiple first antennas are located in the multiple holes, respectively and the multiple second antennas to be located in the multiple holes, respectively.
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公开(公告)号:US20230132490A1
公开(公告)日:2023-05-04
申请号:US18147270
申请日:2022-12-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Juneseok LEE , Junsig KUM , Kwanghyun BAEK , Dohyuk HA , Jinsu HEO , Youngju LEE , Jungyub LEE
Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module is provided. The antenna module includes a flexible printed circuit board (FPCB) including a first surface directed in a first direction and a second surface directed in a second direction that forms a predetermined first angle with respect to the first direction, a first antenna deployed on one surface of the first surface, and a second antenna deployed on one surface of the second surface.
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公开(公告)号:US20230299506A1
公开(公告)日:2023-09-21
申请号:US18192910
申请日:2023-03-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sanghoon PARK , Kwanghyun BAEK , Juneseok LEE , Dohyuk HA , Jungho PARK , Youngju LEE , Jungyub LEE , Jinsu HEO
CPC classification number: H01Q21/28 , H01Q1/2283
Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate than a 4th generation (4G) communication system such as long term evolution (LTE). An antenna module is provided. The antenna module includes a plurality of antennas, a first printed circuit board (PCB) on which the plurality of antennas are disposed, a second PCB on which one or more elements for processing a radio frequency (RF) signal are disposed, and an adhesive material for bonding the first PCB and the second PCB, wherein the first PCB includes a first metal layer, a second metal layer, a dielectric, and a coupling structure plated along the first metal layer, the second metal layer, and a via hole between the first metal layer and the second metal layer, and may be disposed to provide a coupling connection through the coupling structure of the first PCB.
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公开(公告)号:US20230030388A1
公开(公告)日:2023-02-02
申请号:US17786870
申请日:2020-12-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sanghoon PARK , Juneseok LEE , Dohyuk HA , Jinsu HEO , Youngju LEE
IPC: H01Q1/42
Abstract: The present disclosure relates to a communication technique for converging, with IoT technology, a 5G communication system for supporting a higher data transfer rate beyond the 4G system, and a system therefor. The present disclosure may be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, healthcare, digital education, retail businesses, security- and safety-related services, etc.) on the basis of 5G communication technology and IoT-related technology. Disclosed is a cover device for protecting an antenna device which is mounted in an electronic device to radiate a beam in an ultrahigh-frequency band, the cover device comprising: a cover frame including an open window region corresponding to a radiation region of the antenna device; and a thickness compensation structure disposed in the window region on the cover frame and having a different thickness according to the frequency band of the beam radiated from the antenna device.
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公开(公告)号:US20230019144A1
公开(公告)日:2023-01-19
申请号:US17946688
申请日:2022-09-16
Applicant: Samsung Electronics Co., Ltd.
Inventor: Juneseok LEE , Youngsub KIM , Sanghoon PARK , Jungho PARK , Kwanghyun BAEK , Youngju LEE , Jungyub LEE , Dohyuk HA , Jinsu HEO
Abstract: The disclosure relates to a pre-5th-Generation (5G) or 5G communication system for supporting higher data rates Beyond 4th-Generation (4G) communication system, such as long term evolution (LTE). An antenna device is provided. The antenna device includes a first printed circuit board (PCB), a second PCB for a plurality of antenna elements, and a radio frequency integrated circuit (RFIC) coupled through a first surface of the first PCB. The second PCB may include a radio frequency (RF) routing layer including RF lines for the respective plurality of antenna elements. The first PCB may include a feeding structure for connecting the RF routing layer and the RFIC. The second PCB may be electrically connected to a second surface of the first PCB opposite to the first surface of the first PCB, through a first surface of the second PCB. The second PCB may be coupled to the plurality of antenna elements.
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公开(公告)号:US20210013633A1
公开(公告)日:2021-01-14
申请号:US17036783
申请日:2020-09-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jungmin PARK , Byungchul KIM , Hyunjin KIM , Kwanghyun BAEK , Youngju LEE , Jinsu HEO
IPC: H01Q21/29 , H01Q19/10 , H01Q19/28 , H01Q21/24 , H01Q15/14 , H01Q1/36 , H01Q1/38 , H01Q1/52 , H01Q9/04 , H01Q1/22
Abstract: An antenna device for providing a higher data transmission rate in a wireless communication system is provided. The antenna device includes a first radiating body mounted to a side surface of a multiple layer circuit board to transmit and receive a wireless signal and a second radiating body mounted to a top surface of the multiple layer circuit board and electrically connected to the first radiating body to transmit and receive the wireless signal together with the first radiating body.
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公开(公告)号:US20230387598A1
公开(公告)日:2023-11-30
申请号:US18446906
申请日:2023-08-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Youngsub KIM , Sanghoon PARK , Jungho PARK , Kwanghyun BAEK , Youngju LEE , Jungyub LEE , Juneseok LEE , Dohyuk HA , Jinsu HEO
CPC classification number: H01Q9/0457 , H01Q9/0414 , H01Q21/065
Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a data transmission rate higher than that of a 4th generation (4G) communication system such as long term evolution (LTE). An antenna structure of a wireless communication system is provided. The antenna structure includes a first radiator, a first printed circuit board (PCB) in which the first radiator is arranged, a plurality of second radiators, a second PCB in which the plurality of second radiators are arranged, and a frame structure, wherein the frame structure is arranged such that an air layer is formed between the first PCB and the second PCB, and the plurality of second radiators can include a first metal patch arranged in a region corresponding to the first radiator, and a plurality of second metal patches arranged to be separated from the first metal patch so as to be fed by coupling.
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公开(公告)号:US20230163488A1
公开(公告)日:2023-05-25
申请号:US18152311
申请日:2023-01-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sanghoon PARK , Jungho PARK , Kwanghyun BAEK , Youngju LEE , Jungyub LEE , Juneseok LEE , Dohyuk HA , Jinsu HEO
Abstract: An antenna assembly is provided. The antenna assembly includes a first flexible printed circuit board (FPCB) for multiple first antennas, a second flexible printed circuit board (FPCB) for multiple second antennas, a metal plate including multiple holes, a first adhesive material layer for bonding between the metal plate and the first FPCB, and a second adhesive material layer for bonding between the metal plate and the second FPCB, wherein the metal plate is disposed such that the multiple first antennas are located in the multiple holes, respectively and the multiple second antennas to be located in the multiple holes, respectively.
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