公开(公告)号：US10985152B2

公开(公告)日：2021-04-20

申请号：US16503121

申请日：2019-07-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jichul Kim ,  Chajea Jo ,  Sang-Uk Han ,  Kyoung Soon Cho ,  Jae Choon Kim ,  Woohyun Park

IPC: H01L25/18 ,  H01L27/146 ,  H01L23/00 ,  H01L25/00 ,  H01L23/367 ,  H01L21/56 ,  H01L23/31 ,  H01L25/065 ,  H01L23/18

Abstract: A semiconductor package includes a first semiconductor chip on a substrate, a second semiconductor chip on the substrate and spaced apart from the first semiconductor device, a mold layer on the substrate and covering sides of the first and second semiconductor chips, and an image sensor unit on the first and second semiconductor chips and the mold layer. The image sensor unit is electrically connected to the first semiconductor chip.

公开(公告)号：US10658266B2

公开(公告)日：2020-05-19

申请号：US15495324

申请日：2017-04-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Choon Kim ,  Jichul Kim ,  Jin-Kwon Bae ,  Eunseok Cho

IPC: H01L23/38 ,  F25B21/02 ,  H01L35/32 ,  H01L25/10 ,  H01L25/18 ,  H01L23/00

Abstract: A method for managing a temperature of a device includes determining a temperature of a circuit or a package including the circuit, and selectively operating a thermoelectric semiconductor based on the determined temperature to adjust the temperature of the circuit or the package.

公开(公告)号：US10198049B2

公开(公告)日：2019-02-05

申请号：US15459403

申请日：2017-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Heungkyu Kwon ,  Jae Choon Kim ,  Eunseok Cho ,  Jichul Kim

IPC: G06F1/20 ,  G06F9/52 ,  G01K1/08 ,  G01K1/16 ,  G01J5/10 ,  G05B15/02

Abstract: A surface temperature management method of mobile device is provided. The method includes sensing a temperature of an application processor in an operation mode of the mobile device; and controlling the application processor using the sensed temperature and a surface temperature management table to manage a surface temperature of a target part of the mobile device. The surface temperature management table includes information related to the temperature of the application processor corresponding to the surface temperature of the target part in the operation mode.