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    CONNECTING TERMINAL DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME
    22.
    发明申请
    CONNECTING TERMINAL DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME 有权
    连接终端设备和包括该终端设备的电子设备

    公开(公告)号：US20160294095A1

    公开(公告)日：2016-10-06

    申请号：US15084901

    申请日：2016-03-30

    Applicant: Samsung Electronics Co., Ltd. ,  HYUPJINCONNECTOR Co., Ltd.

    Inventor： Kyung-Jong KIM ,  Seung-Kyo HONG ,  Yang-Jean PARK ,  Jin-Woo PARK

    IPC: H01R13/24 ,  H01R12/71

    CPC classification number: H01R12/714 ,  H01R12/7076 ,  H01R12/718 ,  H01R13/2464

    Abstract: A connecting terminal device may include: a bottom plate; a movable part provided on a rear surface of the bottom plate that is configured to be electrically connected to an external object as the movable part is pressed or raised; one or more protective walls provided on side surfaces of the bottom plate; pressing preventing parts provided at ends of the protective walls and provided between the bottom plate and the movable plate to restrict a pressing movement of the movable part; and rising preventing parts provided on side surfaces of the protective walls to restrict a rising movement of the movable part.

    Abstract translation: 连接终端装置可以包括：底板; 设置在所述底板的后表面上的可移动部分，其构造成当所述可移动部分被按压或升高时与外部物体电连接; 设置在底板的侧表面上的一个或多个保护壁; 设置在保护壁的端部处并设置在底板和可动板之间的防止部件限制可动部件的按压运动; 并且设置在保护壁的侧表面上的上升防止部件限制可动部件的上升运动。

    DISPLAY DEVICE
    23.
    发明申请
    DISPLAY DEVICE 审中-公开
    显示设备

    公开(公告)号：US20160062516A1

    公开(公告)日：2016-03-03

    申请号：US14843374

    申请日：2015-09-02

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Young-Tae JEONG ,  Hyun-Suk CHOI ,  Min-Soo KIM ,  Dong-Myeong PARK ,  Jin-Woo PARK ,  Young-Bae SIM

    IPC: G06F3/044

    CPC classification number: G06F3/044 ,  G06F1/1637 ,  G06F1/1643 ,  G06F3/0412 ,  G06F2203/04103 ,  H04M1/0266 ,  H04M2250/22

    Abstract: A display device is provided. The display device includes a screen display unit, a first nontransparent layer, and a second nontransparent layer. The screen display unit includes a first screen region and a second screen region of which at least a portion is curved from the first screen region. The first nontransparent layer is disposed in at least one side of border portions of the screen display unit. The second nontransparent layer is disposed in at least one side of border portions of the second screen region and is separated from at least a portion of the first nontransparent layer in a direction perpendicular to the first nontransparent layer.

    Abstract translation: 提供显示装置。 显示装置包括屏幕显示单元，第一非透明层和第二非透明层。 屏幕显示单元包括第一屏幕区域和第二屏幕区域，其中至少一部分从第一屏幕区域弯曲。 第一非透明层设置在屏幕显示单元的边界部分的至少一侧。 第二非透明层设置在第二屏幕区域的边界部分的至少一侧，并且在垂直于第一非透明层的方向上与第一非透明层的至少一部分分离。

    SEMICONDUCTOR PACKAGE
    24.
    发明申请
    SEMICONDUCTOR PACKAGE 有权
    半导体封装

    公开(公告)号：US20150048501A1

    公开(公告)日：2015-02-19

    申请号：US14455849

    申请日：2014-08-08

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jin-Woo PARK

    IPC: H01L23/00 ,  H01L23/31

    CPC classification number: H01L23/3128 ,  H01L21/56 ,  H01L23/13 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/15151 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/0401

    Abstract: A semiconductor package includes a substrate including a lower plate and an upper plate, a semiconductor chip mounted on a top surface of the substrate, and a mold layer surrounding a sidewall and a bottom surface of the semiconductor chip. The substrate has a mold path including an inner path extending between the lower and upper plates and a mold hole penetrating the upper plate. The mold hole is connected to the inner path. The mold layer extends into the mold path.

    Abstract translation: 半导体封装包括：包括下板和上板的衬底;安装在衬底顶表面上的半导体芯片;以及围绕半导体芯片的侧壁和底表面的模制层。 基板具有包括在下板和上板之间延伸的内部通道的模具路径和穿过上板的模具孔。 模具孔连接到内部路径。 模具层延伸到模具路径中。

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