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    DISPLAY DRIVER INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME
    3.
    发明申请
    DISPLAY DRIVER INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME 有权
    显示驱动器集成电路及其制造方法

    公开(公告)号：US20160315099A1

    公开(公告)日：2016-10-27

    申请号：US15136075

    申请日：2016-04-22

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jin-Woo PARK ,  Siwoo KIM

    IPC: H01L27/12

    CPC classification number: H01L27/124 ,  G03F1/00

    Abstract: A display driver integrated circuit and a method of manufacturing the same are provided. The method of manufacturing a display driver integrated circuit (DDI) including a first area, a second area, and an overlapping area in which the first area and the second area overlap each other includes forming a first pattern in the first area using a first reticle; and forming a second pattern in the second area using a second reticle, and ends of the first pattern and the second pattern are connected within the overlapping area and the first area and the second area are asymmetrically set based on the overlapping area such that the overlapping area includes only a metal line.

    Abstract translation: 提供了一种显示驱动器集成电路及其制造方法。 制造包括第一区域，第二区域和第一区域和第二区域重叠的重叠区域的显示驱动器集成电路（DDI）的方法包括使用第一掩模版形成第一区域中的第一图案 ; 以及使用第二掩模版在所述第二区域中形成第二图案，并且所述第一图案和所述第二图案的端部在所述重叠区域内连接，并且所述第一区域和所述第二区域基于所述重叠区域被非对称地设定， 区域只包括金属线。

    METHODS OF FABRICATING SEMICONDUCTOR PACKAGE
    4.
    发明申请
    METHODS OF FABRICATING SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20220262696A1

    公开(公告)日：2022-08-18

    申请号：US17735471

    申请日：2022-05-03

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jung-Ho PARK ,  Jin-Woo PARK ,  Jae Gwon JANG ,  Gwang Jae JEON

    IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56

    Abstract: Methods of fabricating a semiconductor package may include forming a first barrier layer on a first carrier, forming a sacrificial layer, including an opening that exposes at least a portion of the first barrier layer, on the first barrier layer, and forming a second barrier layer on the first barrier layer and on the sacrificial layer. The second barrier layer may include a portion formed on the sacrificial layer. The methods may also include forming a first insulating layer in the opening and protruding beyond a top surface of the portion of the second barrier layer on the sacrificial layer, a top surface of the first insulating layer being farther from the first barrier layer than the top surface of the portion of the second barrier layer, forming a redistribution structure including a redistribution layer and a second insulating layer on the first insulating layer and on the second barrier layer, mounting a semiconductor chip on the redistribution structure, attaching a second carrier onto the semiconductor chip and removing the first carrier, removing the first barrier layer, the sacrificial layer, and the second barrier layer to expose portions of the redistribution structure, and forming solder balls, respectively, on the portions of the redistribution structure.

    SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
    5.
    发明申请
    SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME 有权

    公开(公告)号：US20210111163A1

    公开(公告)日：2021-04-15

    申请号：US16885391

    申请日：2020-05-28

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Min Jun BAE ,  Dong Kyu KIM ,  Jin-Woo PARK ,  Seok Hyun LEE

    IPC: H01L25/10 ,  H01L25/065 ,  H01L25/00

    Abstract: A semiconductor package includes a first redistribution layer. A plurality of posts is disposed on the first redistribution layer. A semiconductor chip is disposed on the first redistribution layer between the plurality of posts. A second redistribution layer is formed on the plurality of posts and the semiconductor chip. A first memory stack is disposed on the second redistribution layer. A height of each of the plurality of posts extends from an upper surface of the first redistribution layer to a lower surface of the second redistribution layer.

    PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES HAVING THE SAME, AND METHODS OF FABRICATING THE SEMICONDUCTOR PACKAGES
    7.
    发明申请
    PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES HAVING THE SAME, AND METHODS OF FABRICATING THE SEMICONDUCTOR PACKAGES 有权
    封装基板，具有该封装基板的半导体封装以及制造半导体封装的方法

    公开(公告)号：US20130288431A1

    公开(公告)日：2013-10-31

    申请号：US13924817

    申请日：2013-06-24

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jin-Woo PARK ,  Hwan-Sik LIM ,  EUNCHUL AHN

    IPC: H01L21/50

    CPC classification number: H01L21/50 ,  H01L21/563 ,  H01L23/48 ,  H01L23/58 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2924/00012

    Abstract: A package substrate, a semiconductor package having the same, and a method for fabricating the semiconductor package. The semiconductor package includes a semiconductor chip, a package substrate, and a molding layer. The package substrate provides a region mounted with the semiconductor chip. The molding layer is configured to mold the semiconductor chip. The package substrate includes a first opening portion that provides an open region connected electrically to the semiconductor chip and extends beyond sides of the semiconductor chip to be electrically connected to the semiconductor chip.

    Abstract translation: 封装基板，具有该封装基板的半导体封装以及半导体封装的制造方法。 半导体封装包括半导体芯片，封装基板和模制层。 封装衬底提供安装有半导体芯片的区域。 模制层被配置成模制半导体芯片。 封装基板包括第一开口部分，该第一开口部分提供与半导体芯片电连接的开放区域，并且延伸超过半导体芯片的两侧以与半导体芯片电连接。

    METHODS OF FABRICATING SEMICONDUCTOR PACKAGE
    8.
    发明申请
    METHODS OF FABRICATING SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20210066149A1

    公开(公告)日：2021-03-04

    申请号：US16866594

    申请日：2020-05-05

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jung-Ho PARK ,  Jin-Woo PARK ,  Jae Gwon JANG ,  Gwang Jae JEON

    IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00

    Abstract: Methods of fabricating a semiconductor package may include forming a first barrier layer on a first carrier, forming a sacrificial layer, including an opening that exposes at least a portion of the first barrier layer, on the first barrier layer, and forming a second barrier layer on the first barrier layer and on the sacrificial layer. The second barrier layer may include a portion formed on the sacrificial layer. The methods may also include forming a first insulating layer in the opening and protruding beyond a top surface of the portion of the second barrier layer on the sacrificial layer, a top surface of the first insulating layer being farther from the first barrier layer than the top surface of the portion of the second barrier layer, forming a redistribution structure including a redistribution layer and a second insulating layer on the first insulating layer and on the second barrier layer, mounting a semiconductor chip on the redistribution structure, attaching a second carrier onto the semiconductor chip and removing the first carrier, removing the first barrier layer, the sacrificial layer, and the second barrier layer to expose portions of the redistribution structure, and forming solder balls, respectively, on the portions of the redistribution structure.

    X-RAY DETECTOR AND X-RAY IMAGING APPARATUS HAVING THE SAME
    10.
    发明申请
    X-RAY DETECTOR AND X-RAY IMAGING APPARATUS HAVING THE SAME 审中-公开
    X射线探测器和X射线成像装置

    公开(公告)号：US20160154125A1

    公开(公告)日：2016-06-02

    申请号：US14953051

    申请日：2015-11-27

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Young Ik KIM ,  Jin-Woo PARK ,  Eun Jeong JO

    IPC: G01T7/00

    CPC classification number: G01T7/00 ,  A61B6/4283 ,  A61B6/44

    Abstract: Disclosed herein are an X-ray detector, in which an active area of the X-ray detector has an improved structure for a user's convenience, and an X-ray imaging apparatus having the same, The X-ray detector is configured to detect X-rays irradiated from an X-ray source, and includes: a top frame that includes a first area, a second area which is bent from the first area, and an active area which is biased from a center of the first area; a side frame that includes a top frame resting part which is formed in an outer surface which faces an outside of the X-ray detector and on which the second area rests, the side frame being coupled with the top frame to form an accommodation space; and a sensor panel disposed in the accommodation space and configured to convert the detected X-rays into an electrical signal, the sensor panel being biased from the center of the first area to correspond to the active area.

    Abstract translation: 这里公开了一种X射线检测器，其中X射线检测器的有源区域具有用于便利的改进结构，以及具有该X射线检测器的X射线成像设备，X射线检测器被配置为检测X 并且包括：顶部框架，其包括第一区域，从所述第一区域弯曲的第二区域和从所述第一区域的中心偏置的有效区域; 侧框架，其包括形成在面向所述X射线检测器的外侧的外表面中并且所述第二区域搁置的所述顶框架搁置部，所述侧框架与所述顶框架联接以形成容纳空间; 以及传感器面板，设置在所述容纳空间中并且被配置为将检测到的X射线转换成电信号，所述传感器面板从所述第一区域的中心偏置以对应于所述有效区域。

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