Memory modules and memory systems having the same

    公开(公告)号:US11531496B2

    公开(公告)日:2022-12-20

    申请号:US17154030

    申请日:2021-01-21

    Abstract: Memory modules and memory systems having the same are provided. A memory module may include command/address terminals, data terminals, at least one monitoring terminal, a buffer, and a plurality of semiconductor memory devices. The buffer may be configured to receive and buffer data applied through the data terminals and a command/address applied through the command/address terminals to generate buffered write data and a buffered command/address. The buffer may be configured to buffer the buffered write data and the buffered command/address to generate module data and a module command/address, and store and then transmit at least one portion of the buffered write data as monitoring data through the at least one monitoring terminal. The plurality of semiconductor memory devices may be configured to receive and store the module data in response to the module command/address.

    SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
    22.
    发明申请
    SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20160225633A1

    公开(公告)日:2016-08-04

    申请号:US14967455

    申请日:2015-12-14

    CPC classification number: H01L29/66795 H01L21/3086

    Abstract: Provided are methods of fabricating a semiconductor device including a field effect transistor. Such methods may include sequentially forming lower and intermediate mold layers on a substrate, forming first upper mold patterns and first spacers on the first and second regions, respectively, of the substrate, etching the intermediate mold layer using the first upper mold patterns and the first spacers as an etch mask to form first and second intermediate mold patterns, respectively, forming second spacers to cover sidewalls of the first and second intermediate mold patterns, etching the lower mold layer using the second spacers as an etch mask to form lower mold patterns, and etching the substrate using the lower mold patterns as an etch mask to form active patterns.

    Abstract translation: 提供制造包括场效应晶体管的半导体器件的方法。 这样的方法可以包括在衬底上顺序地形成下模层和中间模层,分别在衬底的第一和第二区上形成第一上模模和第一衬垫,使用第一上模模蚀刻中间模层, 间隔物作为蚀刻掩模,以分别形成第一和第二中间模具图案,形成第二间隔件以覆盖第一和第二中间模具图案的侧壁;使用第二间隔件蚀刻下模具层以形成下模具图案; 并使用下模具图案蚀刻基板作为蚀刻掩模以形成有源图案。

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